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Renesas Electronics Introduces High-Reliability Advanced Low-Power SRAM Products

December 12, 2014

Düsseldorf, 11 December 2014 – Renesas Electronics, a premier provider of advanced semiconductor solutions, today introduced 5 new product versions in the RMLV0816B and RMLV0808B series of Advanced Low-Power SRAM (Advanced LP SRAM), the company’s flagship SRAM (static random access memory) devices. The new memory devices have a density of 8 megabits (Mb) and utilize a fine fabrication process technology with a circuit linewidth of 110 nanometers (nm).

In the Advanced LP SRAM Series, which can achieve soft error (Note 1) free and latch-up (Note 2) free operation, Renesas started mass production … Read More → "Renesas Electronics Introduces High-Reliability Advanced Low-Power SRAM Products"

Leti Will Discuss CoolCubeTM Technology for 3D Transistor Stacking At Workshop Preceding IEDM 2014

December 12, 2014

GRENOBLE, France – Dec. 11, 2014 – CEA-Leti will present its latest results on CoolCube™, the technique for stacking transistors sequentially in the same process flow for 3D-VLSI, at a Dec. 14 workshop in San Francisco, Calif. The workshop precedes IEDM 2014, Dec. 15-17.

“The technology is designed to allow a connection of the stacked active layers on a nanometric scale, with a very high density, due to their alignment by a standard lithographic process,” said Maud Vinet, Leti’s advanced CMOS laboratory manager, who will give the presentation. “This 3D concept should allow a gain of 50 percent in area and 30 percent in … Read More → "Leti Will Discuss CoolCubeTM Technology for 3D Transistor Stacking At Workshop Preceding IEDM 2014"

Saelig Launches GDS-200 and GDS-300 Compact/Portable Digital Oscilloscopes

December 12, 2014

Fairport, NY, USA: Saelig Company, Inc. has introduced the GDS-200/300 series of battery-powered, compact 2-channel 1GSa/s digital oscilloscopes featuring a large 7″ touch panel LCD for portrait or landscape operation. Available in 70MHz, 100MHz and 200MHz bandwidth versions, the maximum sample rate per channel is 1GSa/s and memory depth is 5Mpts. These oscilloscopes feature a built-in digital multimeter (5,000 counts for GDS-200; 50,000 counts for GDS-300) which can simultaneously measure and monitor A.C. and D.C. voltage and current, and temperature. Trend plots over a long time allow engineers to effectively monitor standard electric parameters while measuring basic … Read More → "Saelig Launches GDS-200 and GDS-300 Compact/Portable Digital Oscilloscopes"

Rugged Compact PC from Aitech Improves Reliable, High Performance Computing in Harsh Environments

December 12, 2014

Chatsworth, Calif. December 2014 – Aitech Defense Systems Inc., a pioneer in true embedded and mission critical computing technologies for environmentally-demanding, mission-critical applications, now offers the extremely rugged and compact A171 computing system that ensures high computing performance under highly adverse conditions.

An environmentally-sealed (IP65) aluminum enclosure that withstands exceptional shock and vibration houses the A171’s Intel Core i7 processor board along with a highly integrated power interface board. The two … Read More → "Rugged Compact PC from Aitech Improves Reliable, High Performance Computing in Harsh Environments"

Green Hills Software Delivers World’s Most Powerful Embedded Linux C/C++ Debugger

December 11, 2014

SANTA BARBARA, CA — December 11, 2014 — Green Hills Software, the largest independent software vendor for the Internet of Things (IoT), today announced a new MULTI® software development environment for embedded Linux developers. MULTI for Linux leapfrogs all other solutions in the market.

Until now, the state of the art for debugging Linux was a sad combination of print statements, command-line tools, and rudimentary graphical debuggers that are difficult to learn, setup, and use and lack the powerful control and visibility that modern electronic systems demand. This lack of high quality development tools presents a tremendous time-to-market … Read More → "Green Hills Software Delivers World’s Most Powerful Embedded Linux C/C++ Debugger"

LDRA Unveils Unique and Cost-Effective Software Verification on VxWorks 7 Platform

December 11, 2014

Wirral, U.K. December 11, 2014—LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, has fully integrated the LDRA tool suite with the next generation Wind River® VxWorks® 7 real-time operating system (RTOS) to achieve full compliance with industry safety- and security-critical standards. The reduced overhead and comprehensive support of the LDRA tool suite for a wide range of target architectures, regardless of their respective footprints, ensures that VxWorks-based systems can be built and verified faster and at lower cost.

LDRA, a well-established leader in the compliance and certification market, brings advanced software … Read More → "LDRA Unveils Unique and Cost-Effective Software Verification on VxWorks 7 Platform"

STMicroelectronics and Politecnico di Milano Build FASTER 3D Graphics Application using FPGAs

December 11, 2014

Geneva, December 11, 2014 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced that it had tested and validated an experimental 3D-graphics application based on ray-tracing technology that had been implemented on an ARM®-processor-based test chip attached to a Field-Programmable Gate Array (FPGA). Partially funded by the European Union Seventh Framework Programme (FP7 IC T 287804), the effort for “Facilitating Analysis and Synthesis Technologies For Effective Reconfiguration” (FASTER) was performed as part of a tight R&D cooperation with Politecnico di Milano that also involved Foundation for Research and Technology – … Read More → "STMicroelectronics and Politecnico di Milano Build FASTER 3D Graphics Application using FPGAs"

Cadence Perspec System Verifier Delivers Up to 10X Productivity Improvement in System-on-Chip Verification

December 11, 2014

HIGHLIGHTS:

  • Reduces complex use-case scenario development effort for SoC verification from weeks to days
  • Automates traditionally manual, and often complex, system-level coverage-driven test development
  • Improves SoC quality by accelerating the development of complex software-driven tests and integrated debug to reproduce, find and fix complex SoC-level bugs

SAN JOSE, Calif., December 11, 2014? Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced the Cadence® Perspec ? System Verifier platform for use-case scenario-based software-driven system-on-chip (SoC) verification. Using an intuitive graphical specification of system-level verification scenarios and a definition of the SoC topology and actions, … Read More → "Cadence Perspec System Verifier Delivers Up to 10X Productivity Improvement in System-on-Chip Verification"

PLS’ Universal Debug Engine (UDE) now also supports the Infineon TLE986x and TLE987x Embedded Power ICs

December 11, 2014

Lauta (Germany), December 11, 2014 – PLS Programmierbare Logik & Systeme presents the latest version 4.3.4 of its Universal Debug Engine (UDE), an optimized test and debug tool for the new Infineon TLE986x and TLE987x Embedded Power IC series.

The highly integrated Embedded Power family was specifically designed for intelligent motor control in a wide range of automotive applications. The devices come in a standard QFN package with a footprint of only 7 mm x 7 mm. In addition to an ARM® Cortex™-M3 core, the devices include flash memory of up to 128 kB, up to six NFETs, … Read More → "PLS’ Universal Debug Engine (UDE) now also supports the Infineon TLE986x and TLE987x Embedded Power ICs"

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