industry news
Subscribe Now

Cadence Perspec System Verifier Delivers Up to 10X Productivity Improvement in System-on-Chip Verification

HIGHLIGHTS:

  • Reduces complex use-case scenario development effort for SoC verification from weeks to days
  • Automates traditionally manual, and often complex, system-level coverage-driven test development
  • Improves SoC quality by accelerating the development of complex software-driven tests and integrated debug to reproduce, find and fix complex SoC-level bugs

SAN JOSE, Calif., December 11, 2014? Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced the CadenceĀ® Perspec ? System Verifier platform for use-case scenario-based software-driven system-on-chip (SoC) verification. Using an intuitive graphical specification of system-level verification scenarios and a definition of the SoC topology and actions, this new verification solution automates system-level coverage-driven test development using constraint-solving technology, delivering up to 10X productivity improvement in SoC verification versus typical manual test development. A part of the Cadence System Development Suite, Perspec System Verifier reduces complex test development from weeks to days, while also allowing design teams to reproduce, find and fix complex bugs to improve overall SoC quality.

Perspec System Verifier is currently available. For more information, visit http://www.cadence.com/news/perspec.

Perspec System Verifier delivers increased productivity and SoC quality through several key features, including:

?A Unified Modeling Language (UML) based view of system-level actions and resources that, combined with powerful solver technology, creates an intuitive view of complex and hard-to-test system-level use-case interactions

Solver technology, which automates the generation of portable tests to deliver complete coverage of system-level scenarios based on chip constraints and the scope of the scenarios to verify SoC-level features for functionality, performance and power

?Tests that run on all pre-silicon verification platforms including simulation, acceleration and emulation, and virtual and FPGA prototyping, which can be further used to validate actual silicon

“Today’s verification teams face a challenge in that the bottom-up approach to IP verification does not extend to the SoC level, and they are looking for an opportunity to move to top-down scenario-based verification in order to extend traditional approaches like UVM and achieve better coverage,” said Charlie Huang, executive vice president, Worldwide Field Operations and System & Verification Group at Cadence. “With its SoC-level constraint-solving technology, Perspec System Verifier is enabling our customers to create tests previously not feasible, increasing their confidence that they are meeting SoC functional requirements while speeding time to market.”

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadenceā€™s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

AlteraĀ® FPGAs and SoCs with FPGA AI Suite and OpenVINOā„¢ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.
May 19, 2023
38,362 views