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Cavium Announces New Low Power Dual and Quad Core OCTEON® III SoC Processors

  • New Low Power 28nm OCTEON® III CN70XX and CN71XX Families Provide
  • Unprecedented Compute Performance at Compelling Power and Cost Metrics
  • Extensive Integrated Hardware Acceleration including Hardware Virtualization, Packet
  • Processing, QoS, DPI and Security
  • Broad Range of Software, Hardware and ODM Partner Support

SAN JOSE, Calif. and TAIPEI, Taiwan, June 3, 2013 – Cavium, Inc. (NASDAQ: CAVM), a leading provider of highly integrated semiconductor products that enable intelligent processing for networking, communications and the digital home, today announced two new families of 28nm dual and quad core OCTEON® </ … Read More → "Cavium Announces New Low Power Dual and Quad Core OCTEON® III SoC Processors"

Forte Design Systems, CircuitSutra Partner on Design Services, IP Co-Development

SAN JOSE, CALIF., and NOIDA, INDIA –– May 31, 2013 –– Forte Design Systems™ (www.ForteDS.com), the #1 provider of software to enable design at a higher level of abstraction, and CircuitSutra(www.circuitsutra.com) announced today they will partner to provide design services throughout India … Read More → "Forte Design Systems, CircuitSutra Partner on Design Services, IP Co-Development"

TI delivers the industry’s highest voltage rating in next-generation automotive LED drivers for dashboard applications

DALLAS (May 28, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the next-generation AEC-Q100 qualified automotive LED drivers, feature-packed with the industry’s highest voltage rating, thermal shutdown protection and optimized electromagnetic compatibility (EMC) performance. In harsh automotive environments, the electronics must endure high temperatures, high voltage transient and electromagnetic interference. It is crucial for the devices to survive such conditions while reducing electromagnetic emissions. The TLC6C598-Q1 and TLC6C5912-Q1 are monolithic, medium-voltage, low-current 8-bit/12-bit shift registers designed for use in systems that require relatively moderate load power, such as LEDs. The TLC6C598-Q1 and … Read More → "TI delivers the industry’s highest voltage rating in next-generation automotive LED drivers for dashboard applications"

GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC technology

Milpitas, Calif. — May 30, 2013 — At next week’s 50th Design Automation Conference (DAC) in Austin, Texas,GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes. The sign-off ready flows, jointly developed with the leading EDA providers, offer robust support for implementing designs using sophisticated multi-die packaging techniques, leveraging through-silicon vias (TSVs) in 2.5D silicon interposers and new bonding approaches.

Multi-vendor support is available, with full implementation flows from Read More → "GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC technology"

Mentor Graphics and GLOBALFOUNDRIES Deliver 20nm Design Kits for Advanced Design Enablement

WILSONVILLE, Ore., May 30, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced it has collaborated with GLOBALFOUNDRIES to deliver 20nm design kits for the Olympus-SoC™ netlist-to-GDS platform. The design kit enables mutual customers to achieve the best performance, power and area with faster design closure times.

“Double patterning and timing closure at advanced nodes require a comprehensive suite of design tools and methodologies,” said Andy Brotman, vice president of design infrastructure at GLOBALFOUNDRIES. “Mentor solutions, including Olympus-SoC, help ensure that designs using our 20nm technologies perform and yield well by efficiently utilizing our DRC+ technology to … Read More → "Mentor Graphics and GLOBALFOUNDRIES Deliver 20nm Design Kits for Advanced Design Enablement"

Leti to Present Latest R&D Results in MEMS At Transducers’ 2013 in Barcelona

GRENOBLE, FRANCE – May 29, 2013 – CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.

Workshop: 6:30-8 p.m., June 18, Rooms 118-119, CCIB Barcelona

The session features three brief presentations from 6:30-7:10 p.m.:

PMC Adopts Cadence Physical Verification System as Signoff Technology for Large Complex SoC

SAN JOSE, CA–(Marketwired – May 30, 2013) –

Cadence Design Systems, Inc. (NASDAQ: CDNS)

HIGHLIGHTSCadence Design Systems, Inc. (NASDAQ: CDNS)

  • PMC is producing working silicon on 65- and 40-nanometer designs, and is currently deploying the product for its 28-nanometer designs.
  • Technology chosen for turnaround time and ready foundry support
  • Physical Verification System signoff decks certified by major foundries

Cadence Design … Read More → "PMC Adopts Cadence Physical Verification System as Signoff Technology for Large Complex SoC"

Jasper and Duolog Partner to Combine SoC Integration with Formal Verification

May 30, 2013, MOUNTAIN VIEW, Calif. — Jasper Design Automation, Inc., the leading provider of verification solutions based on state-of-the-art formal technology, and Duolog Technologies, the leading provider of SoC integration products and solutions, have announced a partnership to leverage the tools and methodologies of both companies. The companies’ integrated solutions will address the complex, time-consuming and error-prone tasks associated with SoC integration and verification. The integrated flows by Duolog and Jasper will enable IP/SoC development teams to deliver qualified, integration-ready IP and SoC … Read More → "Jasper and Duolog Partner to Combine SoC Integration with Formal Verification"

Exar Releases High Frequency, Step-Down Regulator for EMC/EMI Sensitive Applications

Fremont, CA, May 28, 2013 – Exar Corporation (Nasdaq: EXAR), a leading supplier of high performance analog mixed-signal components and data management solutions, today expanded its family of low voltage, step down regulators with the addition of the XRP6670. The programmable operating frequency of the XRP6670 offers power design engineers increased flexibility in optimizing component values, size and performance enabling precise management of electromagnetic interference (EMI) compliance and electromagnetic compatibility (EMC).

Operating from a 2.6V to 5.5V input voltage range, the XRP6670 is capable of supplying up to 3Amps of continuous current with an adjustable output voltage … Read More → "Exar Releases High Frequency, Step-Down Regulator for EMC/EMI Sensitive Applications"

IEEE-SA and Accellera Team to Deliver 1801 Unified Power Format Standard

Napa, Calif., USA, 30 May 2013 — Accellera Systems Initiative (Accellera) announces they have once again partnered with the IEEE Standards Association (IEEE-SA), a globally recognized standards-setting body within the IEEE, to deliver a leading electronic design and verification standard to engineers and chip designers worldwide. The revised version of IEEE 1801™-2013 “Standard for Design and Verification of Low Power Integrated Circuits Language Reference Manual” is now available through the … Read More → "IEEE-SA and Accellera Team to Deliver 1801 Unified Power Format Standard"

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