Bundling Performance
Every year, FPGA and Structured ASIC Journal has conducted a survey of design teams that have recently completed projects using FPGAs. We collect and analyze a large volume of responses from readers regarding their completed projects, and we publish and sell a detailed report to companies that have a vested interest in gathering data about the current behaviors of FPGA design teams. This is nothing unusual, as many media companies perform similar research and offer similar studies to their customers. This time, however, we noticed one thing that was unusual. There seems to be a shift that … Read More → "Bundling Performance"