News – Page 1214 – EEJournal

Bosch announces high-performance MEMS acceleration sensors for wearables

Step counting and gesture recognition in tiny packages

June 26, 2017

Step counter optimized for wearable devices, integrated directly in the sensor
No external microcontroller necessary to enable step counting
Easy to integrate for fast time-to-market
Low power consumption

Reutlingen, Germany – June 26, 2017 – Bosch Sensortec announced a new family of MEMS acceleration sensors for wearable devices, offering high performance and ease of integration in compact packages: The BMA456 and BMA423 are specifically designed … Read More → "Bosch announces high-performance MEMS acceleration sensors for wearables"

Sanechips (ZTE Microelectronics) Licenses CEVA-X1 IoT Processor for NB-IoT Connected Devices

June 26, 2017

MOUNTAIN VIEW, Calif., – June 26, 2017 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Sanechips Technology Co., Ltd. (previously named ZTE Microelectronics Technology Co., Ltd.) has licensed the Read More → "Sanechips (ZTE Microelectronics) Licenses CEVA-X1 IoT Processor for NB-IoT Connected Devices"

Synopsys Embedded Vision Processor IP Quadruples Neural Network Performance for Machine Learning Applications

Enhanced DesignWare EV6x Family Delivers Up to 4.5 TeraMACs/sec for Real-Time Vision Processing

June 26, 2017

MOUNTAIN VIEW, Calif., June 26, 2017 /PRNewswire/ —

Highlights:

DesignWare EV6x Vision Processors integrate up to four 512-bit vector DSPs and a CNN engine, providing scalable performance for a wide range of current and emerging embedded vision applications
The EV6 … Read More → "Synopsys Embedded Vision Processor IP Quadruples Neural Network Performance for Machine Learning Applications"

Outsourced Electronic Design Provides Specialist Support and Project Based Resources

June 26, 2017

Innovators, SMEs and even large OEMs may not always have the in-house design resources to meet workload demands or have the specialist expertise and design tools required for a particular project. In many cases the most efficient and cost effective response to such circumstances is to outsource the design requirement. Outsourcing a design or even part of a design can free up customer’s own resources to continue with existing projects.

LDD Technology have the knowledge and experience to take a project from concept to production-ready design and prototypes or provide an individual service including schematic design, … Read More → "Outsourced Electronic Design Provides Specialist Support and Project Based Resources"

STMicroelectronics Launches Robust USB Type-C™ Controllers with Internal Protection to Save Space and Enhance Operation Safety

June 26, 2017

Geneva, June 26, 2017 – STMicroelectronics has introduced two new USB Type-C™ -certified port-controller ICs with built-in protection, which help designers implement interfaces cost-effectively to support their required blend of USB features. These can include power negotiation, managed active cables, and support for guest protocols.

< … Read More →

Synopsys Embedded Vision Processor IP Quadruples Neural Network Performance for Machine Learning Applications

Enhanced DesignWare EV6x Family Delivers Up to 4.5 TeraMACs/sec for Real-Time Vision Processing

June 26, 2017

MOUNTAIN VIEW, Calif., June 26, 2017 –

Highlights:

DesignWare EV6x Vision Processors integrate up to four 512-bit vector DSPs and a CNN engine, providing scalable performance for a wide range of current and emerging embedded vision applications
The EV6x processors, with dedicated and programmable CNN engine, supports all CNN graphs
MetaWare EV Development Toolkit, a suite of tools supporting OpenCL C, OpenVX and OpenCV, simplifies application software development
Read More → "Synopsys Embedded Vision Processor IP Quadruples Neural Network Performance for Machine Learning Applications"

ICE-P3 EPU Integrates Temperature-Compensated Voltage and Frequency Control for Maximum Energy Savings

Newest ICE-Grain Family Member Expands Fully Autonomous Hardware Power Control to Include DVFS and Body Bias

June 26, 2017

San Jose, Calif. – June 26, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today introduced ICE-P3™, the IP industry’s first product to automate implementation of dynamic voltage and frequency scaling (DVFS). ICE-P3 is the newest member of the ICE-Grain™ Family of Energy Processing Units (EPU) that identifies, sequences, and … Read More → "ICE-P3 EPU Integrates Temperature-Compensated Voltage and Frequency Control for Maximum Energy Savings"

Mentor launches unique, end-to-end Xpedition High- Density Advanced Packaging flow

June 23, 2017

The Mentor® Xpedition® High-Density Advanced Packaging (HDAP) flow is the industry’s first comprehensive solution for the design and verification of today’s leading-edge IC package designs.
Industry-unique Xpedition Substrate Integrator tool enables rapid prototyping of heterogeneous substrate package assemblies.
The new Xpedition Package Design technology for physical package implementation ensures data synchronization for confident design sign-off and verification.
Integrated Mentor HyperLynx® technologies provide 2.5D/3D simulation models and design rule checking (DRC) to identify and resolve design errors with accuracy before tape-out.
Calibre® 3DSTACK technology enables complete signoff verification … Read More → "Mentor launches unique, end-to-end Xpedition High- Density Advanced Packaging flow"

Mentor OSAT Alliance Program Streamlines IC High- Density Advanced Packaging Design and Manufacturing

June 23, 2017

Proven low-cost, low-risk path to designing HDAP technologies
Trusted verification and signoff process for OSAT customers
Increased OSAT business efficiency though proven Mentor flow
Launches with Amkor as first OSAT alliance member

Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for their IC designs. By launching this program, Mentor will work with OSATs to … Read More → "Mentor OSAT Alliance Program Streamlines IC High- Density Advanced Packaging Design and Manufacturing"

LCR Embedded Systems Announces Availability of Pigeon Point Shelf Management for AdvancedTCA Enclosures

Availability of Pigeon Point Adds Even Greater Flexibility to LCR Embedded’s Extensive Portfolio of Design Options

June 23, 2017

June 19, 2017 – Norristown, PA – LCR Embedded Systems today announced the availability of Pigeon Point shelf management for their customers, further expanding the company’s already extensive portfolio of shelf management options. While this new offering is most relevant to customers seeking to take advantage of the popular, high-performance AdvancedTCA form factor, Pigeon Point shelf management along with the company’s other shelf management options can be designed into other form factors where required.

LCR Embedded’s Pigeon Point Shelf Manager Carrier will be drop-in replaceable both mechanically and electrically with our existing VT014 carrier in our third-generation 6-slot … Read More → "LCR Embedded Systems Announces Availability of Pigeon Point Shelf Management for AdvancedTCA Enclosures"