News – Page 1213 – EEJournal

IAR Systems introduces starter kit for state machine-based development

November 2, 2015

Uppsala, Sweden—November 2, 2015—Today, IAR Systems® launches a starter kit for the state machine toolset IAR visualSTATE®. The complete starter kit is targeted for developers interested in exploring state machine-based embedded development and includes evaluation versions of IAR visualSTATE as well as the embedded development toolchain IAR Embedded Workbench®. The kit features an evaluation board based on a STM32F429 device from STMicroelectronics and an I-jet Lite debug probe. To get users up and running quickly, a number of example applications are included.

Developers can use … Read More → "IAR Systems introduces starter kit for state machine-based development"

Microchip Releases Next-Generation Bluetooth® Low Energy Solutions

November 2, 2015

CHANDLER, Ariz., Nov. 2, 2015 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced its next-generation Bluetooth^® Low Energy (LE) solutions. Qualified to the latest Bluetooth 4.2 standard, the IS1870 and IS1871 Bluetooth LE RF ICs, along with the BM70 module, expand Microchip’s existing … Read More → "Microchip Releases Next-Generation Bluetooth® Low Energy Solutions"

500mA, 140V Boost/SEPIC/Flyback/Inverting DC/DC Converter with IQ= 6µA

November 2, 2015

MILPITAS, CA – November 2, 2015 – Linear Technology Corporation announces the LT8331, a current mode step-up DC/DC converter with an internal 500mA, 140V switch. It operates from an input voltage range of 4.5V to 100V, making it suitable for use with a wide range of input sources found in industrial, transportation and avionic applications. The LT8331 can be configured as either a boost, SEPIC, … Read More → "500mA, 140V Boost/SEPIC/Flyback/Inverting DC/DC Converter with IQ= 6µA"

FCI Introduces PwrMAX® Ortho Power Connectors

October 30, 2015

SINGAPORE (October 30, 2015) — FCI, a leading supplier of connectors and interconnect systems, today announced an expansion of their power connector family which now includes the PwrMAX^®Ortho power connectors.

PwrMAX^® Ortho power connectors are designed to support a new datacenter equipment trend known as Orthogonal system packaging architectures. This architecture can offer improved data transfer and improved system cooling by eliminating mid-plane circuit boards. PwrMAX^® Ortho power connectors can be used with either busbars or circuit boards to distribute power in systems with orthogonal architectures.

The connectors also feature FCI’ … Read More → "FCI Introduces PwrMAX® Ortho Power Connectors"

New BeagleBone Green Dev Board Now Shipping from Mouser

October 30, 2015

October 29, 2015 – Mouser Electronics, Inc. is now stocking the highly anticipatedBeagleBone Green, a Linux-based development board from BeagleBoard.org and Seeed Studio. The BeagleBone Green updates the popular BeagleBone Black, retaining the AM335x 1GHz ARM® Cortex®-A8 processor from Texas Instruments. Rather than keeping the BeagleBone Black’s HDMI connector and chip, the BeagleBone Green contains Seeed Studio’s plug-and-play Grove connectors. With this new board, Seeed Studio looks to help developers and designers capitalize on Seeed’s modular Grove system and the board’s general purpose I/O (GPIO) expansion capabilities.

Seeed Studio’s … Read More → "New BeagleBone Green Dev Board Now Shipping from Mouser"

Imec and Ghent University Demonstrate First Laser Arrays Monolithically Grown on 300mm Silicon Wafers

October 30, 2015

Leuven and Ghent (Belgium)—October 29, 2015—Imec and Ghent University present, for the first time, arrays of indium phosphide lasers monolithically integrated on 300mm silicon substrates in a CMOS pilot line. This breakthrough achievement, published in Nature Photonics, provides a path toward high-volume manufacturing of cost-effective photonic integrated circuits (PICs) with monolithically integrated laser sources. Such laser-powered PICs will revolutionize data transfer between future logic and memory chips.

Over the past few years, demand for data communication between servers in cloud datacenters has been growing exponentially, following strong growth in social networking, cloud computing and … Read More → "Imec and Ghent University Demonstrate First Laser Arrays Monolithically Grown on 300mm Silicon Wafers"

Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components

October 30, 2015

This brief video, which can be found at www.indium.com/blog/phil-zarrow, features Indium Corporation Technical Support Engineer Derrick Herron as he explains to SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, how voiding can be consistently reduced to 12 percent with the use of solder preforms.

“Voiding can lead to hot spots in the component, which will eventually lead to a shortened life span,” Herron said. “By limiting voiding, heat is transferred more efficiently into the PCB and away from … Read More → "Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components"

IAR Systems integrates powerful code analysis with functional safety tools for ARM

October 29, 2015

Uppsala, Sweden—October 29, 2015—Today, IAR Systems® releases a new version of the functional safety edition of the complete embedded development toolchain IAR Embedded Workbench® for ARM®. The build chain of IAR Embedded Workbench for ARM is certified by TÜV SÜD as a qualified tool for development of safety-related applications. The new version integrates IAR Systems’ add-on tools C-STAT® and C-RUN® for powerful static and runtime code analysis. In addition, extensive new functionality has been added. Support for the new ARM Cortex®-M7 core is now available, as well as new ARM-based devices from major semiconductor vendors including … Read More → "IAR Systems integrates powerful code analysis with functional safety tools for ARM"

38V Dual DC/DC Controller with Current Mode Control, Sub-Milliohm DCR Sensing, I²C/PMBus Interface & Programmable Loop Compensation

October 29, 2015

MILPITAS, CA – October 29, 2015 – Linear Technology Corporation announces the LTC3884, a dual output current mode synchronous step-down DC/DC controller with programmable loop compensation and I²C-based PMBus interface. This device enables the use of very low DC resistance (DCR) power inductors (0.3 milliohms) by enhancing the signal-to-noise ratio of the current sense signal to maximize converter efficiency and increase power density.

The LTC3884 operates over an input voltage range of 4.5V to 38V and produces output voltages up to 5.5V. Up to 6 phases can be paralleled and clocked out-of-phase to minimize input and output filtering. When both outputs … Read More → "38V Dual DC/DC Controller with Current Mode Control, Sub-Milliohm DCR Sensing, I²C/PMBus Interface & Programmable Loop Compensation"

Fairchild’s USB Type-C Solution is Chosen for Meizu’s New PRO 5 Smartphone

October 29, 2015

SAN JOSE, Calif. – October 29, 2015 — Fairchild (NASDAQ: FCS), a leading global supplier of high-performance semiconductor solutions, announced today that its FUSB302, from the industry’s first family of programmable USB Type-C controllers with Power Delivery (PD), is a key component of the new PRO 5 smartphone from Meizu, a major Chinese smartphone manufacturer.
“We are keen on innovating and are committed to building smartphones that offer an excellent user experience, and Fairchild’s product is exactly what we need for our Meizu PRO 5,” said Jacky Ke, sourcing director at Meizu.

FUSB302 is the industry’s … Read More → "Fairchild’s USB Type-C Solution is Chosen for Meizu’s New PRO 5 Smartphone"

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How Synopsys IP and TSMC’s N12e Process are Driving AIoT

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Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....