industry news
Subscribe Now

Xilinx Announces Integration of 56G PAM4 Transceiver Technology into its Virtex UltraScale+ FPGAs

Devices to accelerate next wave of Ethernet deployment for wired and data center interconnect

May 17, 2017

SAN JOSE, Calif., May 17, 2017 /PRNewswire/ — Xilinx, Inc. (XLNX) today announced integration of 56G PAM4 transceiver technology into its industry-leading Virtex® UltraScale+™ FPGAs. Built upon proven 16nm FinFET+ FPGA fabric, these devices will expand the Virtex product line to drive the next wave of Ethernet deployment and provide seamless migration of existing systems to next-gen backplane, optics, and high performance interconnects.

Targeted for wired communications, data centers, and wireless backhaul applications, the integrated devices enable customers to double bandwidth on existing infrastructure by breaking through the physical limitations of data transmission at 56G+ line rates.

“Xilinx is leading the charge on transceiver technology with the infusion of 56G PAM4 into our 16nm FPGAs,” said Ken Chang, vice president, SerDes Technology Group at Xilinx. “These new devices are built upon a proven FPGA foundation and are in alignment with the vast ecosystem of optics, ASICs, and backplanes soon to be deployed.”

Today’s announcement signals another milestone for Xilinx transceiver leadership after the company was first to demonstrate 56G PAM4 transceiver technology on a 16nm programmable device in 2016. View the Xilinx 56G PAM4 technology demo and contact your local sales representative for more information.

About Xilinx

Xilinx is the leading provider of All Programmable semiconductor products, including FPGAs, SoCs, MPSoCs, RFSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT. For more information, visit www.xilinx.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

One Year of Synopsys Cloud: Adoption, Enhancements and Evolution
Sponsored by Synopsys
The adoption of the cloud in the design automation industry has encouraged innovation across the entire semiconductor lifecycle. In this episode of Chalk Talk, Amelia Dalton chats with Vikram Bhatia from Synopsys about how Synopsys is redefining EDA in the Cloud with the industry’s first complete browser-based EDA-as-a-Service cloud platform. They explore the benefits that this on-demand pay-per use, web-based portal can bring to your next design. 
Jul 11, 2023
33,954 views