industry news
Subscribe Now

Pixus Offers New Ultra-Rugged Mounting Rail for OpenVPX Enclosure Frames

Waterloo, Ontario  —  Aug 17, 2017 –  Pixus Technologies, a provider of embedded computing and enclosure solutions,  has released a new mounting rail that supports very high insertion forces.   The modular extrusion rail accepts standard OpenVPX or other architectures boards based on the IEEE 1101 specification.
In many OpenVPX systems, the high insertion forces of some plug-in modules can cause standard mounting rails to bow or crack.  The rugged Pixus version features a thicker metal, has two mounting screws, and a re-enforced design to provide strength and durability.  When utilized in concert with Pixus’ new offset card guides, both 4HP and 5HP plug-in modules can be used in the same subrack.
Pixus offers OpenVPX enclosures, backplanes, components, and accessories.  The company also provides mounting rails and subrack components for CompactPCI Serial, CompactPCI, VME64x, and other architectures.
 About Pixus Technologies
Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on  ATCA, OpenVPX, MicroTCA, and custom designs.    Pixus also has an extensive offering of VME-based and cPCI-based solutions.   In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.

Leave a Reply

featured blogs
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
22,782 views