industry news
Subscribe Now

Pixus Offers Mid-Sized OpenVPX Development Chassis for RF Modules and Equipment

Waterloo, Ontario  —  Dec 17, 2019 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced a new version of the VPXD1000 series that allows various VITA 67 slot configurations for RF interfaces over OpenVPX.   The chassis can be partitioned for a separate segment for specialty RF devices or your SOSA (Sensor Open Systems Architecture) implementation.  

The new version of the VPXD1000 comes in a 63HP (12.6”) wide size, allowing higher slot count backplanes up to ten slots at a 1.0” pitch.   Alternatively, designers can utilize one portion of the chassis for a smaller VITA 67 backplane over OpenVPX and a separate segment for RF or other devices.  Pixus can optimize the airflow/cooling for each segment to best suit the customer requirements. 

The VPXD1000 features removable sidewalls.  When testing, the sidewalls can be removed for easy open frame access to probe plug-in cards.  The chassis walls can later be plugged in for thermal testing or aesthetic purposes for end customers demonstrations.  

Pixus offers OpenVPX backplane/chassis systems in commercial, development, and MIL rugged formats.  The company also provides IEEE and Eurocard components for the embedded computer market. 

 About Pixus Technologies 

Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies’ embedded backplanes and systems are focused primarily on  ATCA, OpenVPX, MicroTCA, and custom designs.    Pixus also has an extensive offering of VME-based and cPCI-based solutions.   In May 2011, Pixus Technologies became the sole authorized North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.  

Leave a Reply

featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Designing Scalable IoT Mesh Networks with Digi XBee® for Wi-SUN
Sponsored by Mouser Electronics and Digi and Silicon Labs
In this episode of Chalk Talk, Quinn Jones from Digi, Chad Steider from Silicon Labs and Amelia Dalton explore how Wi-SUN Micro-Mesh can reduce cost and simplify deployment for your next IoT mesh network. They also investigate the benefits that Digi XBee solutions bring to these types of networks and how you can jump start your next IoT mesh network design with Silicon Labs and Digi.
May 4, 2026
11,165 views