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Brewer Science Expands Printed Electronics Service Capabilities for Growing Market

Company to Host Free Sensors Expo Workshop on ‘Next Generation Sensing: Printed Sensors’ with Other Industry Leaders
June 12, 2019

ROLLA, Mo., June 11, 2019 (GLOBE NEWSWIRE) — Brewer Science, Inc. (BSI) today announced the expansion of its printed electronics program to incorporate service capabilities. These new services are categorized into three major core competencies: printing, electronics and software The new offerings will enable customers to take full advantage of BSI’s core competencies and expertise in printed electronics sensor systems for a variety of applications.

Printing Services
BSI has a wide range of printing capabilities for flexible-hybrid electronics (FHE) and other printing needs. Its state-of-the-art equipment can accommodate both screen printing and spray coating. … Read More → "Brewer Science Expands Printed Electronics Service Capabilities for Growing Market"

Unleash the Full Potential of Your Micro Speakers with Maxim’s DSM Smart Amplifier

June 11, 2019

SAN JOSE, Calif., June 10, 2019 /PRNewswire/ — As devices continue to shrink and customers demand ever sleeker products, Maxim Integrated Products, Inc. (NASDAQ: MXIM) introduces the MAX98390 smart amplifier with integrated Dynamic Speaker Management (DSM) algorithm to efficiently deliver louder, clearer, richer sound at the lowest quiescent power in the market. The boosted, digital Class D DSM smart amplifier unleashes a system’s full audio potential by safely driving higher power levels (up to 5.1 … Read More → "Unleash the Full Potential of Your Micro Speakers with Maxim’s DSM Smart Amplifier"

Knowles Announces First Amazon-Qualified Development Kit for Wake-on-Voice Alexa Headsets

AISonic SmartMic Headset Development Kit Supports Alexa With Lowest Power Voice Activation, Eliminating the Need for Push-to-Talk Activation
June 11, 2019

ITASCA, Ill., Jun. 11, 2019 — Knowles Corporation (NYSE: KN), a market leader and global provider of advanced micro-acoustic, audio processing, and precision device solutions, today announced that it has developed a new hands-free reference solution to enable OEMs and ODMs to build headphones, headsets and wireless earbuds that allow users to talk directly to Alexa. The Knowles AISonic™ SmartMic Headset Development Kit for the Alexa Voice Service (AVS) brings users natural access to the service’s capabilities by simply saying the “Alexa” wake word. This means customers can play music, place calls, access skills, and more – hands-free. The … Read More → "Knowles Announces First Amazon-Qualified Development Kit for Wake-on-Voice Alexa Headsets"

Microchip and STAR-Dundee Create First SpaceVPX -Compliant Development Platform Featuring Radiation-Tolerant FPGAs and SpaceFibre Technology

Platform enables developers to implement new high-speed data transfer technology for modern spacecraft using Microchip’s radiation-tolerant RTG4™ FPGAs
June 11, 2019

CHANDLER, Ariz., June 11, 2019 — Microchip Technology Inc. (Nasdaq: MCHP), via its Microsemi subsidiary, collaborated with STAR-Dundee to create an evaluation platform that implements SpaceFibre technology, which was recently recognized by the VITA Standards Organization (VSO) as a control-and-data plane option for its SpaceVPX interconnect standard.

The SpaceFibre standard is already published as a very high-speed serial link standard by the European Cooperation for Space Standardization.

The Read More → "Microchip and STAR-Dundee Create First SpaceVPX -Compliant Development Platform Featuring Radiation-Tolerant FPGAs and SpaceFibre Technology"

CEA-Leti Announces Smart-Farm Project to Lower Greenhouse Gas Emissions & Boost Farming Efficiency

In Situ Sensor Node Linked to the Internet of Things Will Monitor Soil Nutrient Levels and Air Quality at Ground Level
June 11, 2019

GRENOBLE, France – June 11, 2019 – Leti, a research institute of CEA Tech, today announced a new European Commission smart-farming project that will deliver real-time data on soil conditions.

“Demand for sustainably produced food is driving current strategies in the intensification of the agricultural sector worldwide. To meet these challenges farmers will need to adopt a whole-farm approach to resource efficiency,” said Suzanne Lesecq, CEA-Leti director of research. “Meanwhile, there is no commercial system that provides real-time, in-situ concentration of different nutrients in the soil, while monitoring gaseous emissions just above the soil.”

Read More → "CEA-Leti Announces Smart-Farm Project to Lower Greenhouse Gas Emissions & Boost Farming Efficiency"

Wind River Linux Harnesses Power of Containers and Cloud-Native Approaches for Embedded Systems Development

June 11, 2019

Rohde & Schwarz verifies 5G NR performance and QoE using commercially released smartphones in live 5G networks

June 11, 2019

Rohde & Schwarz has conducted first field tests of network performance and quality from the end-user perspective on a live 5G NR network using commercially available 5G NR devices such as the Samsung S10 5G. This is an important step to verify that the 5G network performance supports the demanding technical requirements and delivers the required Quality of Experience to the end user. Rohde & Schwarz mobile network testing solutions for engineering, site acceptance, optimization, benchmarking and monitoring offer the ability to conduct such measurements using commercially available smartphones.

Munich, June 11, 2019 — The ultimate test of a complete 5 … Read More → "Rohde & Schwarz verifies 5G NR performance and QoE using commercially released smartphones in live 5G networks"

TI introduces the first system basis chip with integrated CAN FD controller and transceiver

New automotive SBC helps designers add CAN FD without changing their microcontroller, reducing design and time to market for in-vehicle networks
June 11, 2019

DALLAS (June 11, 2019) – Texas Instruments (TI) (NASDAQ: TXN) today introduced an automotive system basis chip that is the industry’s first to integrate a controller and transceiver for Controller Area Network with Flexible Data Rate (CAN FD). Designed to meet the high-bandwidth and data-rate flexibility needs of in-vehicle networks, the TCAN4550-Q1 uses the Serial Peripheral Interface (SPI) bus of almost any microcontroller to implement, with minimal hardware changes, a CAN FD interface or increase the amount of CAN FD bus ports in a system.

Previously, designers had to incorporate multiple discrete components into their designs or change … Read More → "TI introduces the first system basis chip with integrated CAN FD controller and transceiver"

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