industry news
Subscribe Now

Brewer Science Expands Printed Electronics Service Capabilities for Growing Market

Company to Host Free Sensors Expo Workshop on ‘Next Generation Sensing: Printed Sensors’ with Other Industry Leaders

ROLLA, Mo., June 11, 2019 (GLOBE NEWSWIRE) — Brewer Science, Inc. (BSI) today announced the expansion of its printed electronics program to incorporate service capabilities. These new services are categorized into three major core competencies: printing, electronics and software The new offerings will enable customers to take full advantage of BSI’s core competencies and expertise in printed electronics sensor systems for a variety of applications.

Printing Services
BSI has a wide range of printing capabilities for flexible-hybrid electronics (FHE) and other printing needs. Its state-of-the-art equipment can accommodate both screen printing and spray coating. Additionally, the company can provide multilayer, front and back printing services with optical layer alignment for a variety of substrates and inks.

Electronics Services
As the FHE market grows and enables unique applications, the ability to produce these electronic components can be challenging. BSI has partnered with customers to provide solutions for both FHE and traditional printed circuit boards (PCBs). These turn-key, integrated FHE solutions services include flexible circuit board design, lay out, manufacturing, communications, firmware, and population; laser cutting and engraving; data transport and storage; device testing and consulting.

Software and Other Services
Since Brewer Science was founded in 1981, it has focused on developing and delivering the finest services and materials in the semiconductor industry. Having excelled in this capacity for nearly four decades, BSI has developed a large number of ancillary capabilities that, while world-class, have previously been solely focused on internal use. As of today, these capabilities are now available to customers, and include computer-aided design (CAD) schematics capture, PCB layout, laser cutting and engraving, and data transport and analysis.

“As a company, we’ve built much of our strength and reputation on innovation,” said Dan Brewer, Executive Director of Emerging Technology at Brewer Science. “Printed electronics is the latest arena in which we are applying our innovation leadership to greatly impact where technology is going and how it can benefit people from all walks of life.”

Sensors Expo
Brewer Science will be exhibiting and presenting at the Sensors Expo and Conference in San Jose, Calif., from June 25-27, 2019. Visit Booth 1422 at the San Jose Convention Center to learn more about these new printed electronics service capabilities. Additionally, BSI will host a free afternoon workshop at 1:00 p.m. on June 26 with other industry leaders focusing on ‘Next Generation Sensing: Printed Sensors.’ The presenters will delve into the current state of the printed sensors market, where it’s heading, and which applications will be the next to adopt this exciting technology.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

Leave a Reply

featured blogs
Jul 28, 2021
Here's a sticky problem. What if the entire Earth was instantaneously replaced with an equal volume of closely packed, but uncompressed blueberries?...
Jul 28, 2021
Hyperscale data centers are driving demand for high-bandwidth Ethernet protocols at speeds up to 800G to support HPC, AI, video streaming, and cloud computing. The post What's Driving the Demand for 200G, 400G, and 800G Ethernet? appeared first on From Silicon To Software....
Jul 28, 2021
After a long writing (and longer editing and approval seeking) process, the AIAA's CFD Vision 2030 Integration Committee has published its first update to the Vision's roadmap. This 71 page,... [[ Click on the title to access the full blog on the Cadence Community ...
Jul 9, 2021
Do you have questions about using the Linux OS with FPGAs? Intel is holding another 'Ask an Expert' session and the topic is 'Using Linux with Intel® SoC FPGAs.' Come and ask our experts about the various Linux OS options available to use with the integrated Arm Cortex proc...

featured video

Design Success with Foundation IP & Fusion Compiler

Sponsored by Synopsys

When is 1+1 greater than 2? When using DesignWare Foundation IP & Fusion Compiler! Join Raymond and Yung in their discussion of a customer that benefited from the combination of Fusion Compiler’s machine learning and Foundation IP cells and macros.

More information about DesignWare Foundation IP: Embedded Memories, Logic Libraries, GPIO & PVT Sensors

featured paper

PrimeLib Next-Gen Library Characterization - Providing Accelerated Access to Advanced Process Nodes

Sponsored by Synopsys

What’s driving the need for a best-in-class solution for library characterization? In the latest Synopsys Designer’s Digest, learn about various SoC design challenges, requirements, and innovative technologies that deliver faster time-to-market with golden signoff quality. Learn how Synopsys’ PrimeLib™ solution addresses the increase in complexity and accuracy needs for advanced nodes and provides designers and foundries accelerated turn-around time and compute resource optimization.

Click to read the latest issue of Designer's Digest

featured chalk talk

TI Robotics System Learning Kit

Sponsored by Mouser Electronics and Texas Instruments

Robotics projects can get complicated quickly, and finding a set of components, controllers, networking, and software that plays nicely together is a real headache. In this episode of Chalk Talk, Amelia Dalton chats with Mark Easley of Texas Instruments about the TI-RSLK Robotics Kit, which will get you up and running on your next robotics project in no time.

Click here for more information about the Texas Instruments TIRSLK-EVM Robotics System Lab Kit