industry news
Subscribe Now

TI introduces the first system basis chip with integrated CAN FD controller and transceiver

New automotive SBC helps designers add CAN FD without changing their microcontroller, reducing design and time to market for in-vehicle networks

DALLAS (June 11, 2019) – Texas Instruments (TI) (NASDAQ: TXN) today introduced an automotive system basis chip that is the industry’s first to integrate a controller and transceiver for Controller Area Network with Flexible Data Rate (CAN FD). Designed to meet the high-bandwidth and data-rate flexibility needs of in-vehicle networks, the TCAN4550-Q1 uses the Serial Peripheral Interface (SPI) bus of almost any microcontroller to implement, with minimal hardware changes, a CAN FD interface or increase the amount of CAN FD bus ports in a system.

Previously, designers had to incorporate multiple discrete components into their designs or change microcontrollers entirely when upgrading to or expanding CAN FD functionality – an often time-consuming and expensive process. With the TCAN4550-Q1 system basis chip (SBC), designers can maintain their existing microcontroller-based architecture and streamline CAN FD upgrade or expansion in body electronics and lighting, advanced driver assistance systems (ADAS) and automotive gateway designs. For product details, seewww.ti.com/TCAN4550-Q1-pr.

What is CAN FD?

The CAN FD communications protocol builds on the original CAN bus standard (also known as “Classical CAN”) to help ensure that automotive microcontrollers and connected systems can communicate effectively as the variety and speed of data rates throughout in-vehicle networks continue to evolve. With support for data rates up to 5 Mbps and payloads up to 64 bytes, the CAN FD protocol empowers designers to move data faster in their next-generation automotive applications.

Key features and benefits of TI’s TCAN4550-Q1

  • Reduced bill of materials (BOM) and system costs: Designers can simplify their designs with the high integration of the TCAN4550-Q1 – including integrated ±58-VDC bus fault protection, watchdog timer and fail-safe modes – and its cross-compatibility with the Classical CAN protocol.
  • Easier bus expansion in automotive designs: Designers can also use the chip to add more CAN FD buses via the existing SPI port in an automotive system when the microcontroller has a limited number of CAN FD ports. Typically this type of bus expansion can require system redesign, which is not necessary when using the TCAN4550-Q1.
  • Small power design footprint: With an integrated 125-mA low-dropout (LDO) linear regulator, the TCAN4550-Q1 can power itself while also providing a 70-mA external output that can be used to power sensors or additional components, which enables a smaller power design footprint by reducing the need for external power components.
  • Reduced power consumption: The TCAN4550-Q1 helps designers lower system power consumption when in standby mode through wake and inhibit features.
  • Increased maximum data rate: The new SBC enables faster programmability of automotive software during vehicle assembly through a maximum data rate of 8 Mbps, which exceeds the 5-Mbps maximum data rate of the CAN FD protocol.

Save space while increasing system performance

This new device joins TI’s growing portfolio of SBCs that integrate CAN FD, CAN, and Local Interconnect Network (LIN) transceivers and power components into single-chip solutions, including the TCAN4550-Q1 and TLIN1441-Q1. These highly integrated devices help designers reduce their BOM, increase system performance and get their designs to market faster, as compared to competing devices with fewer integrated components. Designers can also pair TI SBCs with TI C2000™ microcontrollers to quickly and easily expand the amount of available bus ports while increasing overall system functionality.

Tools and support to speed design

Package, availability and pricing

The TCAN4550-Q1 is available now through the TI store and authorized distributors. The TCAN4550-Q1 comes in a 4.5-mm-by-3.5-mm very thin quad flat no-lead package and is priced at US$1.79 in 1,000-unit quantities.

Find out more about TI’s TCAN4550-Q1

About Texas Instruments

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog integrated circuits (ICs) and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping approximately 100,000 customers transform the future, today. Learn more at www.ti.com.

Leave a Reply

featured blogs
Jul 3, 2020
[From the last episode: We looked at CNNs for vision as well as other neural networks for other applications.] We'€™re going to take a quick detour into math today. For those of you that have done advanced math, this may be a review, or it might even seem to be talking down...
Jul 2, 2020
Using the bitwise operators in general -- and employing them to perform masking, bit testing, and bit setting/clearing operations in particular -- can be extremely efficacious....
Jul 2, 2020
In June, we continued to upgrade several key pieces of content across the website, including more interactive product explorers on several pages and a homepage refresh. We also made a significant update to our product pages which allows logged-in users to see customer-specifi...

Featured Video

Product Update: New DesignWare® IOs

Sponsored by Synopsys

Join Faisal Goriawalla for an update on Synopsys’ DesignWare GPIO and Specialty IO IP, including LVDS, I2C and I3C. The IO portfolio is silicon-proven across a range of foundries and process nodes, and is ready for your next SoC design.

Click here for more information about DesignWare Embedded Memories, Logic Libraries and Test Videos

Featured Paper

Cryptography: How It Helps in Our Digital World

Sponsored by Maxim Integrated

Gain a basic understanding of how cryptography works and how cryptography can help you protect your designs from security threats.

Click here to download the whitepaper

Featured Chalk Talk

0 to 112 (Gbps PAM4) in 5 Seconds

Sponsored by Samtec

With serial connections hitting 112Gbps, we can’t mess around with our interconnect. We need engineered solutions that will keep those eyes open and deliver the signal integrity we need in our high-speed designs. In this episode of Chalk Talk, Amelia Dalton talks with Matt Burns of Samtec about the interconnect options for speeds up to 112Gbs, and Samtec’s Flyover interconnect technology.

Click here to download the Silicon-to-Silicon Solutions Guide