News – Page 939 – EEJournal

It’s time to move on FMC+ : Choose PFP-KX7+

A cost-effective Kintex-7 FPGA PCIe platform to boost your data rate performance with 12 High-Speed Serial links

July 8, 2019

Since 15+ years, TECHWAY offers cost-effective solutions to simplify FPGA technology integration onto the Industrial market.

In 2012, TECHWAY pioneered the PFP-KX7 boards: Xilinx Kintex-7 FPGA platforms including FMC site for modularity. Today, PFP-KX7 series are widely adopted by Industry key players.

Capitalizing on this success, TECHWAY goes beyond the state-of-the-art FMC+ technology with the new PFP-KX7+ series. PFP-KX7+ are highly-versatile thanks to their perfect technology mix: Kintex-7 FPGA, FMC+ site, DDR3 memories, management system, 12 HSS, programmable clock generator, etc.

Based on the Xilinx Kintex-7 FPGA, PFP-KX7+ … Read More → "It’s time to move on FMC+ : Choose PFP-KX7+"

Samsung Accelerates New Product Ramp for 7nm Technology Node Using Synopsys’ Yield Explorer

Comprehensive Yield Learning Platform from Synopsys Enables Close Collaboration with Samsung and Its Fabless Customers During Production Ramp-up of New Products

July 4, 2019

MOUNTAIN VIEW, Calif., July 2, 2019 /PRNewswire/ —

Highlights:

Collaboration between Samsung and Synopsys results in fast product ramp for 10/8/7nm products and establishes a foundation for yield learning for 5/4/3nm technology nodes
Secure solution enables Samsung and its fabless customers to work together in identifying systematic yield limiters while maintaining confidentiality of design and fab information
… Read More → "Samsung Accelerates New Product Ramp for 7nm Technology Node Using Synopsys’ Yield Explorer"

SEGGER Adds Video to emUSB-Device

July 3, 2019

Monheim, Germany – June 28th, 2019

SEGGER introduces video class (UVC) support for emUSB-Device. An Embedded System with a USB device interface can now enumerate as a video camera. Once connected to a Host (Windows, Mac, Linux or Tablet), it is recognized as a camera. Video content can come from a live camera feed, a prerecorded video, or can be generated dynamically by using a graphics library such as SEGGER emWin. The ability to use a host as pluggable display does not cost more than the USB connector. No drivers on the host side are required.

VadaTech Announces 6U OpenVPX 10GbE Switch with Optional Health Management

July 2, 2019

Henderson, NV – June 27, 2019 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VPX007. The VadaTech VPX007 is a versatile 10GbE VPX switch with optional health management. The unit can be configured to have all 10GbE ports routed to the front … Read More → "VadaTech Announces 6U OpenVPX 10GbE Switch with Optional Health Management"

X-FAB Introduces Highly-Sensitive SPAD and APD Devices Based on its Modular 180nm Process Technology

July 2, 2019

Tessenderlo, Belgium – June 20, 2019

X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, continues to develop ground-breaking semiconductor solutions to address the most difficult of design challenges. It has now announced the availability of avalanche photodiode (APD) and single-photon avalanche diode (SPAD) products for implementation in scenarios where there are extremely low light conditions to contend with and augmented sensitivity is required, as well as tight timing resolutions involved.

Based on the company’s popular 180nm high-voltage XH018 (Read More → "X-FAB Introduces Highly-Sensitive SPAD and APD Devices Based on its Modular 180nm Process Technology"

SmartDV Adds New Verification IP to Support OpenCAPI Standard

First to Market OpenCAPI Verification IP

July 2, 2019

SAN JOSE, CALIF –– June 25, 2019 –– SmartDV™ Technologies, the Proven and Trusted choice for Verification Intellectual Property (IP), added new Verification IP to support the OpenCAPI standard aimed at boosting the performance of data center servers tasked with analyzing large amounts of data.

“OpenCAPI is an important new development that enables data to move through the network faster and backed by the largest enterprise networking companies,” states Deepak Kumar … Read More → "SmartDV Adds New Verification IP to Support OpenCAPI Standard"

New ams/MEGVII partnership for plug-and-play solutions enabling 3D face recognition in any smart device

July 2, 2019

Shanghai, China (27 June, 2019) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, and artificial intelligence pioneer MEGVII today announce they have signed a partnership agreement to jointly develop and promote complete, plug-and-play 3D face recognition solutions for any type of smart consumer or commercial device.
Under the new memorandum of understanding, the two companies expect to offer the world’s first off-the-shelf face recognition system for smart home, smart retail, smart building and smart security applications, completely independent of the user’s mobile phone. Mobile phone users have rapidly adopted face recognition as their preferred … Read More → "New ams/MEGVII partnership for plug-and-play solutions enabling 3D face recognition in any smart device"

Code Dx and AdaCore Partner to Provide an Ada Application Security Testing Toolsuite

July 1, 2019

NORTHPORT AND NEW YORK, N.Y. – June 26, 2019 – Code Dx, Inc., provider of an award-winning application security management solution that automates and accelerates the discovery, prioritization, and risk management of software vulnerabilities, today announced its partnership with AdaCore, a … Read More → "Code Dx and AdaCore Partner to Provide an Ada Application Security Testing Toolsuite"

ES Design West Opens July 9 with Exhibit Floor Showcasing Companies that Span Entire Electronic System Design Ecosystem

IBM’s Q Quantum Computer a Featured Highlight

July 1, 2019

MILPITAS, CALIF. –– July 1, 2019 –– The exhibit floor at ES Design West will be a showplace of companies that span the entire electronic system design ecosystem including IP, EDA, embedded software, design services, design infrastructure and the cloud presenting system-centric commercial solutions for complex chip design.

Plus, IBM will be in ES Design West booth #2327 with an exhibit of a life-size model of an IBM … Read More → "ES Design West Opens July 9 with Exhibit Floor Showcasing Companies that Span Entire Electronic System Design Ecosystem"

CEA-Leti & Radiall to Design Innovative RF Components for 5G Networks and Photonics Components for Harsh Environments

Common Lab Will Develop Ultra-Low Profile E-Band Antenna for Backhaul/Fronthaul Applications to Speed up Networks’ Capacity & Coverage

July 1, 2019

GRENOBLE, France – June 27, 2019 – Leti, a research institute of CEA Tech, and Radiall, a global manufacturer of leading-edge interconnect solutions, announced a five-year common lab to design innovative antennas, radio frequency (RF) to meet infrastructure requirements of 5G networks and photonics components for harsh environments.

Announced during Leti Innovation Days in Grenoble, the common lab will develop low profile, millimeter-wave antenna solutions for backhaul/fronthaul applications.

5G networks require high-speed, point-to-point communication at millimeter-wave frequencies. The explosive increase in ultra-dense 5G infrastructure systems required to accommodate high-speed mobile data traffic … Read More → "CEA-Leti & Radiall to Design Innovative RF Components for 5G Networks and Photonics Components for Harsh Environments"