industry news
Subscribe Now

New ams/MEGVII partnership for plug-and-play solutions enabling 3D face recognition in any smart device

Shanghai, China (27 June, 2019) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, and artificial intelligence pioneer MEGVII today announce they have signed a partnership agreement to jointly develop and promote complete, plug-and-play 3D face recognition solutions for any type of smart consumer or commercial device.
Under the new memorandum of understanding, the two companies expect to offer the world’s first off-the-shelf face recognition system for smart home, smart retail, smart building and smart security applications, completely independent of the user’s mobile phone. Mobile phone users have rapidly adopted face recognition as their preferred means of user authentication, especially for security reasons. Manufacturers of other types of products are now keen to gain the convenience and security benefits of implementing face recognition. ams and MEGVII plan to bring their joint solution to market before the end of 2019.
Applications and Benefits

The integrated solution under development combines ams’ proven Vertical-Cavity Surface-Emitting Laser (VCSEL) emitter modules with MEGVII’s software for depth mapping and face recognition. As a result, the two companies will create the first 3D Active Stereo solution with very robust performance in both indoor and outdoor light conditions. In addition, the solution will meet very high security standards: for instance, it will be suitable for use in consumer payments systems such as point-of-sale terminals.
MEGVII and ams have combined successfully before to develop a complete face recognition solu-tion for mobile phones. The new solution, which will be compatible with a much wider range of applications processors from various manufacturers, will greatly reduce the development time, risk and effort involved in implementing face recognition in embedded systems such as smart locks, access control equipment and payment terminals.
​​​​​​​

How to learn more

​​​​​​​Click here to learn more about ams 3D technologies in different products and markets
Engineers from ams and MEGVII will be at the ams stand N1.C120 at Mobile World Congress (Shanghai, 26-28 June 2019) to answer visitors’ questions about the partnership’s face recognition solution.​​​​​

Leave a Reply

featured blogs
Jul 15, 2019
Cadence sponsors several different tech conferences throughout the year. We use these events as an opportunity to allow employees to take a day out of our normal work routine to network, learn, and... [[ Click on the title to access the full blog on the Cadence Community sit...
Jul 11, 2019
This is the first of a two-part article outlining the restoration of the Apollo Guidance Computer (AGC), and Samtec'€™s participation in the process, to commemorate the 50th anniversary of the Apollo 11 landing. If you'€™re like me, you'€™re watching and reading about t...
Jan 25, 2019
Let'€™s face it: We'€™re addicted to SRAM. It'€™s big, it'€™s power-hungry, but it'€™s fast. And no matter how much we complain about it, we still use it. Because we don'€™t have anything better in the mainstream yet. We'€™ve looked at attempts to improve conven...