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Aldec’s Latest Embedded Development Platform is First to Feature Largest PolarFire and SmartFusion2 FPGAs on a Single Board

Aldec’s HES-MPF500-M2S150 Development Kit supports the early co-development and co-verification of hardware and software in projects targeting FPGAs from Microchip’s PolarFire and SmartFusion2 families.
November 26, 2019

Henderson, USA – November 26, 2019 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched the HES-MPF500-M2S150 Development Kit, to aid engineers in the development of FPGA-based embedded systems that will use devices from either … Read More → "Aldec’s Latest Embedded Development Platform is First to Feature Largest PolarFire and SmartFusion2 FPGAs on a Single Board"

New STM32WB Wireless Microcontrollers from STMicroelectronics Delivered in a New Affordable Value Line

November 26, 2019

Geneva, November 26, 2019 — STM32WB50* Value Line wireless microcontrollers (MCUs) from STMicroelectronics are a full and pin-compatible derivative of the STM32WB55 System-on-Chip, created to serve cost-sensitive connected devices that need to support Bluetooth® 5.0, ZigBee® 3.0, or OpenThread. The devices offer a good link budget from 100dB in Bluetooth 5.0 mode up to 104dB in 802.15.4 mode.

With the Arm® Cortex®-M4 to handle the user-application software and a Cortex-M0+ to run the radio subsystem including radio stack and security, the STM32WB50 is the best fit for developers … Read More → "New STM32WB Wireless Microcontrollers from STMicroelectronics Delivered in a New Affordable Value Line"

STMicroelectronics and maxon Collaborate on Precision Motor Control for Robotics and Automation

November 25, 2019
  • Two leading names in motor control work together to ease development challenges
  • Jointly created plug-and-play servo control development kit for drives, robotics and automation on display at sps 2019

Geneva and Sachseln, Switzerland, November 25, 2019 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is working with maxon, a leading precision-motor provider and a member of the ST Partner Program, to accelerate the design of robotics applications and industrial servo drives. The companies will demonstrate a jointly developed servo control kit at sps 2019 … Read More → "STMicroelectronics and maxon Collaborate on Precision Motor Control for Robotics and Automation"

AVX Releases New High-Temperature, Glass-Encapsulated Multilayer Varistors Rated for 150°C Operation

Designed for use in high-temperature, high-energy, & harsh-environment automotive, industrial, & oil & gas applications, the new TransGuard® Automotive VGAH Series MLVs provide bidirectional overvoltage protection & broadband EMI/RFI filtering in a single, high-reliability SMT device
November 25, 2019

FOUNTAIN INN, S.C., Nov. 25, 2019 (GLOBE NEWSWIRE) — AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, released a new series of high-temperature, … Read More → "AVX Releases New High-Temperature, Glass-Encapsulated Multilayer Varistors Rated for 150°C Operation"

Wind River Introduces Kubernetes-Based Cloud Native Solution for Complex 5G vRAN Network Edge Needs

November 25, 2019
Wind River Cloud Platform combines a fully cloud native, Kubernetes and container-based architecture with the ability to manage a physically and geographically separated infrastructure for vRAN and core data center sites.
• Reducing service providers’ operational burden and costs, the platform delivers single-pane-of-glass, zero-touch automated management of thousands of nodes.
• Cloud Platform is a commercially supported version of StarlingX and lends itself to demanding 5G use cases applicable across mission-critical industries.

 

Industry’s First 4Mbit EEPROM Memory Chips from STMicroelectronics Let Small Devices Handle Bigger User Data

November 25, 2019
  • Industry’s first 4Mbit EEPROM in small, low-cost, 8-pin package
  • Data-storage boost brings more features and precision to smart devices
  • ST is the world leader in serial EEPROM memories, widely used across a full range of applications

Geneva, November 21, 2019 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced a new generation of memory chips that combine unprecedented storage density with speed and reliability, enabling the devices we use every day to do more to enrich … Read More → "Industry’s First 4Mbit EEPROM Memory Chips from STMicroelectronics Let Small Devices Handle Bigger User Data"

Is Crowd Computing the Next Big Thing?

Neocortix Would Like that it Be So
November 25, 2019

The upshot: Neocortix can muster smartphones to act as cloud computing resources.

From where we all sit, we see lots of cloud computing – either being developed or fully rolled out. The general public is also heavily involved with the cloud, although they may not be as aware of it. To much of the public, the cloud might feel like an amorphous notion of giant banks of computers – perhaps dominated by the Big Tech Overlords – that are out of their control. In other words, they’re not personally involved … Read More → "Is Crowd Computing the Next Big Thing?"

UltraSoC joins the OpenHW Group and extends its commitment to an open-source future for technology development

November 22, 2019

CAMBRIDGE, UK – 21 November 2019

UltraSoC today announced it has joined the OpenHW Group, the global not-for-profit organization established earlier this year to further the adoption of open source processors, particularly for high volume production systems-on-chip (SoCs). As part of its involvement, UltraSoC will contribute its substantial experience and IP in the area of system-level debug and processor trace. UltraSoC is committed to supporting its customers using all open-source and proprietary technologies and is seeing an increasing number of designs supporting mixed (heterogeneous) processor hardware.

The OpenHW Group has already announced a range of cores, dubbed CORE-V, … Read More → "UltraSoC joins the OpenHW Group and extends its commitment to an open-source future for technology development"

NXP, Dongfeng Venucia, and Hangsheng Electronics Collaboration Achieves Milestone: First Global Mass Production of Smart eCockpits

November 22, 2019

Eindhoven, Netherlands – November 21, 2019 – NXP Semiconductors N.V. (NASDAQ: NXPI), Dongfeng Venucia, and Hangsheng Electronics today jointly announced that the Venucia T90 e-cockpit, “Venucia 3.0 PLUS,” marks a mass production milestone in the companies’ joint efforts to bring next-generation eCockpits to drivers.

Co-developed by Dongfeng-Nissan Technology Center, Hangsheng Electronics, and NXP, the Venucia 3.0 PLUS leverages NXP’s high-performance i.MX 8QuadMax applications processor to bring a dynamic dashboard with digital clusters for multimedia, extended functionality including vehicle-to-home connectivity, anytime online navigation, and sensor-based climate control. NXP’s unique hardware partitioning architecture and capability to run multiple operating systems, without … Read More → "NXP, Dongfeng Venucia, and Hangsheng Electronics Collaboration Achieves Milestone: First Global Mass Production of Smart eCockpits"

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