News – Page 898 – EEJournal

Pentek Announces 6.4 GHz A/D and D/A Jade 3U VPX Module for Wideband Defense, Radar and Communication Applications

November 22, 2019

Utilizes state-of-art high-speed Texas Instruments A/Ds and D/As
Matching 6.4 GHz A/D and D/A sampling for wideband signals
3U VPX with PCIe Gen.3×8, Optical I/O and RF I/O backplane options
Jade architecture uses Xilinx Kintex UltraScale FPGA
Navigator Design Suite supports Xilinx Graphical Vivado IP Integrator

UPPER SADDLE RIVER, NJ─November 18, 2019─Pentek, Inc., today introduced the newest member of the Jade< … Read More → "Pentek Announces 6.4 GHz A/D and D/A Jade 3U VPX Module for Wideband Defense, Radar and Communication Applications"

Renesas’ R-IN32M4-CL3 IC Boosts Next-Generation Ethernet TSN, Linking IT and OT Seamlessly With CC-Link IE TSN

Enables Ultra High-Speed And High-Precision Motion Control of Time Synchronization Accuracy Less Than One-Millionth of A Second Between Applications

November 22, 2019

TOKYO, Japan, November 21, 2019 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of the R-IN32M4-CL3 IC for industrial Ethernet (IE) communication. Renesas’ latest industrial network device heralds support for CC-Link IE Time Sensitive Networking (TSN), a communication standard for next-generation Ethernet TSN technology.

As one of the first controllers to support CC-Link IE TSN, the R-IN32M4-CL3 satisfies the strict specifications of less than one-millionth of a second time synchronization accuracy between applications, accelerating TSN support for applications such as AC servos, actuators, and … Read More → "Renesas’ R-IN32M4-CL3 IC Boosts Next-Generation Ethernet TSN, Linking IT and OT Seamlessly With CC-Link IE TSN"

VadaTech Announces 8U VPX Chassis with Six 3U Slots and RTM Support

November 22, 2019

Henderson, NV – November 21, 2019 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VTX660. The VTX660 is an 8U VPX chassis with six 3U VPX slots. The chassis can accept 0.8-inch, 0.85-inch and 1.0-inch pitch modules and is ideal for development and deployment. The … Read More → "VadaTech Announces 8U VPX Chassis with Six 3U Slots and RTM Support"

UVM-AMS Working Group Formed to Standardize UVM Analog/Mixed-Signal Extensions

Standard will focus on development of a comprehensive analog/mixed-signal verification approach by making UVM AMS aware

November 21, 2019

Elk Grove, Calif., November 19, 2019 — Accellera Systems Initiative (Accellera), the electronics industry organization focused on the creation and adoption of electronic design automation (EDA) and intellectual property (IP) standards, announced today the formation of the Universal Verification Methodology Analog/Mixed-Signal Working Group (UVM-AMS WG). The charter of the new working group is to develop a standard that will provide a unified analog/mixed-signal verification methodology based on UVM to improve the verification of AMS integrated circuits and systems.

“The level of industry interest and commitment to develop a standard that addresses analog/mixed-signal extensions … Read More → "UVM-AMS Working Group Formed to Standardize UVM Analog/Mixed-Signal Extensions"

OmniVision Announces Compact Medical Camera Module With Industry’s Fastest Frame Rate at the Highest 640k Resolution

Wafer-Level Module Offers World’s Most Compact 640k Resolution Camera for Disposable Endoscopes

November 21, 2019

SANTA CLARA, Calif. – Nov. 20, 2019 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OC0SA—the latest member of its growing family of CameraCubeChip™ wafer-level camera modules for medical applications. This new module offers an industry leading resolution of 800×800 with the highest frame rate of 60fps, or 400×400 resolution at 90fps, for … Read More → "OmniVision Announces Compact Medical Camera Module With Industry’s Fastest Frame Rate at the Highest 640k Resolution"

New Vishay Intertechnology High Speed IR Emitters Deliver 30 % Higher Brightness, Eliminate Unwanted Side Emissions

850 nm, 890 nm, and 940 nm Devices Offer Radiant Intensity to 13 mW/sr in Compact 0805 SMD Package With Opaque Side Walls and -40 °C to +110 °C Temperature Range

November 21, 2019

MALVERN, Pa. — Nov. 20, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) today broadened its optoelectronics portfolio with the release of new high speed infrared (IR) emitters in a 2 mm by 1.25 mm by 0.8 mm 0805 surface-mount package, the industry’s smallest package to offer opaque side walls. Built on Vishay’s SurfLight™ surface emitter chip technology, the Vishay Semiconductors VSMY5850X01 (850 nm), VSMY5890X01 (890 nm), and VSMY5940X01 (940 nm) deliver 30 % higher radiant intensity than previous-generation devices over a wide temperature range from -40 °C to +110 °C.

Traditional PCB packages utilize an all-transparent epoxy to embed the emitter chip, resulting in side emissions … Read More → "New Vishay Intertechnology High Speed IR Emitters Deliver 30 % Higher Brightness, Eliminate Unwanted Side Emissions"

Renesas Electronics Introduces Industry’s First ASi-5 ASSP for Industrial Automation

New ASSP Delivers Easy Integration and Enhanced Performance from OFDM (Orthogonal Frequency Division Multiplexing) for Smart Sensors, Actuators, and Networked Industrial Automation Devices

November 21, 2019

TOKYO, Japan, November 20, 2019 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the ASI4U-V5 ASSP – the industry’s first silicon solution to fully implement the ASi-5 (Actuator Sensor Interface version specification version 5) standard for industrial network equipment. ASi-5 offers superior performance and usability over ASi-3, delivering 1.27 ms cycle time, 200m cable length and 96 slaves per segment.The field-proven ASSP delivers an easy-to-use fieldbus integration option for developers working with sensors, actuators, and other industrial equipment requiring easy and cost-efficient fieldbus connectivity.

The new ASI4U-V5 ASSP features a … Read More → "Renesas Electronics Introduces Industry’s First ASi-5 ASSP for Industrial Automation"

New All-Weather Radar Sensors from OmniPreSense

IP67 rated enclosure protects from extreme weather conditions

November 21, 2019

San Jose, CA November 14, 2019 – OmniPreSense Corporation, an innovative supplier of Short-Range Radar (SRR) sensors, today announces a new family of radar sensors in all-weather enclosures. The OPS724x family of radar sensors are meant for mounting outdoors in the harshest of weather environments.

The new radar sensors include both Doppler and FMCW versions capable of reporting speed, direction, and range of objects up to 100m (328 ft.) away. The radar sensors are enclosed within an IP67 rated enclosure and operate over a -40° to +85°C temperature range. Unlike other technologies, radar … Read More → "New All-Weather Radar Sensors from OmniPreSense"

SmartDV’s Platform-Independent VIP Portfolio Ensures Seamless Coverage-Driven Verification Flow

Broad Portfolio of Reusable Plug and Play VIP Fills Verification Coverage Gaps, Supports Code Coverage, Functional Coverage

November 20, 2019

SAN JOSE, CALIF. –– November 21, 2019 –– SmartDV™ Technologies, the Proven and Trusted choice for Verification Intellectual Property (VIP), today announced its broad portfolio of portable, platform-independent VIP ensures a thorough and seamless coverage-driven verification flow with no coverage gaps between simulation, emulation or formal verification.

Unlike other VIP tailored to specific verification functions, SmartDV’s VIP addresses verification from simulation and formal verification to hardware emulation and post-silicon verification with support for both … Read More → "SmartDV’s Platform-Independent VIP Portfolio Ensures Seamless Coverage-Driven Verification Flow"

The Zigbee Alliance Augments Its Green Power Program – Saving Time, Money & Energy for Smart Home/Building Installations

New Green Power Logo Identifies IoT Products that Support Battery-Less, Secure, and Low-Maintenance Monitoring for End Users

November 20, 2019

DAVIS, California – November 19, 2019 – The Zigbee Alliance, an organization of hundreds of companies creating, maintaining, and delivering open, global standards for the Internet of Things (IoT), today announced new branding and certification measures centered around its existing Green … Read More → "The Zigbee Alliance Augments Its Green Power Program – Saving Time, Money & Energy for Smart Home/Building Installations"

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