industry news archive
Subscribe Now

SLX FPGA v2019.4 Delivers an Average of 45X HLS Performance Improvement

San Jose, CA – December 16,  2019 – Silexica (silexica.com) has announced the release of SLX FPGA v19.4. Designed to help developers prepare and optimize C/C++ code for high-level synthesis (HLS) in Xilinx’s VivadoTM and VitisTM  HLS design flows. SLX FPGA v19.4 provides performance improvements that deliver, on average, a 45x increase in performance by leveraging SLX’s FPGAs parallelism detection and automatic HLS pragma insertion when compared to no HLS pragmas.

Maximizing Design Performance 

Adopting an HLS methodology presents challenges that … Read More → "SLX FPGA v2019.4 Delivers an Average of 45X HLS Performance Improvement"

ON Semiconductor Announces New Family of Power Modules to Address the Growing Market and Applications for Automotive Traction Inverters

Consumer Electronics Show (CES) – Venetian 3302 – LAS VEGAS, NV. – 16 December 2019 – ON Semiconductor (NASDAQ: ON), driving energy efficient innovations, has released the first two devices from its new VE-Trac™ family of power modules (http://bit.ly/3353dUf) for high voltage automotive traction inverters. These two power integrated module (PIM) devices bring best-in-class electrical and thermal performance while providing scalability and automotive reliability to the rapidly growing market for … Read More → "ON Semiconductor Announces New Family of Power Modules to Address the Growing Market and Applications for Automotive Traction Inverters"

BrightSparks 2020 initiative celebrates the talent and entrepreneurship of the UK’s young engineers

LONDON, UK, 16 December 2019 – RS Components (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and electronic products and solutions, has announced it is partnering with Electronics Weekly for a fourth year to launch EW BrightSparks, an initiative to showcase the brightest and most talented young electronics engineers in the UK today.

EW BrightSparks is designed to celebrate a group of young engineers who are making a difference in the first years of their working life, or still in education and showing great promise towards becoming leaders and innovators in the electronics … Read More → "BrightSparks 2020 initiative celebrates the talent and entrepreneurship of the UK’s young engineers"

Vishay Intertechnology IHDF Edge-Wound Inductor With Low 15.4 mm Max. Profile Delivers Saturation Current to 230 A

Featuring Ferrite Core Technology, This Through-Hole Device Provides Low DCR to Reduce Power Losses and Increase EfficiencyMALVERN, Pa. — Dec. 12, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new IHDF edge-wound, through-hole inductor with rated current up to 72 A and saturation currents up to 230 A for industrial and military applications. Featuring ferrite core technology and a low 15.4 mm maximum profile, the Vishay Dale IHDF-1300AE-10 operates over a demanding temperature range from -55 °C to +125 °C with low AC and DC power losses and excellent heat dissipation. The edge-wound coil of the device released today provides low DCR of 1.1 mΩ maximum, which minimizes losses and improves rated current performance for increased efficiency. Compared to competing ferrite-based solutions, the IHDF-1300AE-10 offers 75 % higher saturation current. The device's low profile package allows designers to meet harsh mechanical shock and vibration requirements while minimizing board height to save space. With an operating voltage up to 500 VDC, the device is ideal for DC/DC converters, inverters, and motor and switching noise suppression, and high power switchmode power supplies in high current, high temperature applications, including industrial solar systems and charging stations for electric vehicles, as well as military defense systems. Vishay can customize the IHDF-1300AE-10's mounting orientation, termination type, nominal inductance, and isolation voltage rating on request. To reduce the risk of whisker growth, the inductor features a hot-dipped tin plating. The device is RoHS-compliant, halogen-free, and Vishay Green.

MALVERN, Pa. — Dec. 12, 2019 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new IHDF edge-wound, through-hole inductor with rated current up to 72 A and saturation currents up to 230 A for industrial and military applications. Featuring ferrite core technology and a low 15.4 mm maximum profile, the Vishay Dale IHDF-1300AE-10 operates over a demanding temperature range from -55 °C to +125 °C with low AC and DC power losses and excellent heat dissipation.

The edge-wound coil of the device released today provides low DCR of 1.1 mΩ maximum, which minimizes losses and improves rated current performance for increased efficiency. Compared to … Read More → "Vishay Intertechnology IHDF Edge-Wound Inductor With Low 15.4 mm Max. Profile Delivers Saturation Current to 230 A"

Silicon Designs Debuts Industry-Exclusive, Enhanced Temperature Performance, Low-Cost MEMS Analog Surface Mount Accelerometers

December 11, 2019 – Kirkland, Washington, USA – Silicon Designs, Inc., a 100% U.S-based and veteran-owned designer and manufacturer of highly rugged commercial- and inertial-grade MEMS capacitive accelerometer chips, modules, and supporting data acquisition, today announced the global market launch of its Model 1522 series, an industry-exclusive family of enhanced temperature performance, low cost, general purpose analog surface mount accelerometers.
Units are now in active production and are available for immediate customer shipment.

Keysight Technologies Delivers High Speed Differential Probing Solution for DDR5/LPDDR5

SANTA ROSA, Calif., December 16, 2019 — Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced the MX0023A InfiniiMax RC, a new high speed … Read More → "Keysight Technologies Delivers High Speed Differential Probing Solution for DDR5/LPDDR5"

Aldec’s new FPGA-based NVMe Data Storage Solution Targets High Performance Computing Applications

Henderson, USA – December 12, 2019 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched a powerful, versatile and time-saving FPGA-based NVMe Data Storage solution to aid in the development of High Performance Computing (HPC) applications such as High Frequency Trading and Machine Learning.

The solution includes an Aldec … Read More → "Aldec’s new FPGA-based NVMe Data Storage Solution Targets High Performance Computing Applications"

Enflame leverages Mentor’s Tessent DFT solutions for innovative cloud AI chip targeting neural network training

  • Mentor’s Tessent design-for-test (DFT) technology helped Enflame dramatically speed design cycles and lower test costs
  • Enflame achieved AI chip bring-up in seven days with Tessent software

Mentor, a Siemens business, today announced that leading artificial intelligence (AI) solution provider Enflame Technology recently used Mentor’s Tessent™ software product family to successfully meet silicon test … Read More → "Enflame leverages Mentor’s Tessent DFT solutions for innovative cloud AI chip targeting neural network training"

featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...