industry news
Subscribe Now

Enflame leverages Mentor’s Tessent DFT solutions for innovative cloud AI chip targeting neural network training

  • Mentor’s Tessent design-for-test (DFT) technology helped Enflame dramatically speed design cycles and lower test costs
  • Enflame achieved AI chip bring-up in seven days with Tessent software

Mentor, a Siemens business, today announced that leading artificial intelligence (AI) solution provider Enflame Technology recently used Mentor’s Tessent™ software product family to successfully meet silicon test requirements and achieve rapid test bring-up for its new Deep Thinking Unit (DTU) chip.

Introduced earlier this week, Enflame’s DTU chip targets deep learning training in datacenters. The chip helps lower the cost of accelerating AI applications in cloud and enterprise datacenters, while helping deliver exceptional performance for training tasks.

Based in Shanghai, China, Enflame develops deep learning software stacks and accelerator system-on-chips (SoCs) to deliver AI training platform solutions for the global datacenter and cloud service provider markets.

“Tessent tools help enable faster DFT development and debugging turnaround cycles between design, verification and physical design, which is essential for large AI chips as they continue to grow in size,” said Iris Ma, SoC DFX director at Enflame Technology. “The register-transfer level-based hierarchical design-for-test capabilities within Tessent offer an ideal solution for implementing DFT and automatic test pattern generation, not only in our huge current-generation devices, but also for our next-generation chip, which is even bigger.”

When developing its new DTU chip, Enflame required a DFT solution that minimized test cost, reduced defective parts-per-million (DPPM) and accelerated time to market. Making these requirements especially challenging was the exceptionally large size of the chip’s design, which integrates more than 10 billion transistors, incorporates high bandwidth memory (HBM)2 with 2.5D package and is manufactured at 12nm.

“Mentor’s Tessent DFT and Calibre physical verification tools played a critical role in the development of our new DTU AI chip, which includes 480mm2 prime die and HBM2 with 2.5D package,” said Arthur Zhang, COO of Enflame Technology. “We are thrilled to say that we rapidly achieved bring-up, with the ASIC back to us in seven days. All DC/AC scan, memory BIST, boundary scan and analog tests completed with zero issues. In addition, all wafer-sort/FT/SLT are automated and initial yield is aligned with foundry index. The wafer-sort, FT, SLT and lab results correlated properly. We sincerely thank Mentor for its outstanding tool quality, exceptional innovation and constant support.”

Mentor’s Tessent software is a market-leading DFT solution, helping companies achieve higher test quality, lower test cost and faster yield ramps. The register-transfer level (RTL)-based hierarchical DFT Tessent with Tessent Connect automation features an array of technologies specifically suited to address the DFT implementation and pattern generation challenges of AI chip architectures. These technologies help to avoid DFT considerations from presenting delays to aggressive production schedules, which are common in emerging markets such as AI processing.

“Hardware acceleration for AI is now a very competitive and rapidly evolving market. As a result, fast time to market is a leading concern for many of our customers in this segment,” said Brady Benware, VP and GM for the Tessent product family at Mentor, a Siemens business. “Companies participating in this market are choosing Tessent because of its advanced hierarchical DFT approach and Tessent Connect automation, which together provide extremely efficient test implementation for massively parallel architectures. In addition, SiliconInsight debug and characterization capabilities in Tessent help eliminate costly delays during silicon bring-up.”

To learn more about Tessent solutions for AI accelerators, please visit https://bit.ly/2DPY9ZO. To learn more about Tessent Connect automation, please visit https://bit.ly/388Z6ta.

Mentor Graphics Corporation, a Siemens business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Web site: http://www.mentor.com.

Leave a Reply

featured blogs
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Advantech Industrial AI Camera: Small but Mighty
Sponsored by Mouser Electronics and Advantech
Artificial intelligence equipped camera systems can be a great addition to a variety of industrial designs. In this episode of Chalk Talk, Amelia Dalton and Ryan Chan from Advantech explore the components included in an industrial AI camera system, the benefits of Advantech’s AI ICAM-500 Industrial camera series and how you can get started using these solutions in your next industrial design. 
Aug 23, 2023
29,355 views