News – Page 1760 – EEJournal

SunPartner Technologies and 3M Collaborate to Deliver the Only Wireless Transparent Solar Charging System for Consumer Mobile Electronics

November 14, 2013

November 13, 2013 (Aix-en-Provence, France, and St. Paul, Minnesota, USA) – Sunpartner Technologies and 3M Company announce an agreement to collaborate in product development and technical solutions, capitalizing on innovative engineered electronics materials from 3M and transparent solar cell technologies from Sunpartner Technologies. The two companies are developing a sustainable wireless transparent micro component that will charge devices while they are being used and exposed to light. This game-changing development will give consumers the ability to charge their mobile phones and tablets with just natural or artificial light — no electrical outlets needed to power.

Combining 3M … Read More → "SunPartner Technologies and 3M Collaborate to Deliver the Only Wireless Transparent Solar Charging System for Consumer Mobile Electronics"

MakerBot 3D Printer Driver Now Available on Windows 8.1

November 14, 2013

Brooklyn, N.Y, November 14, 2013 – Printing in 3D just got even easier. With the recent launch of Microsoft Windows 8.1, MakerBot owners can now download the MakerBot 3D Printer Driver for Windows 8.1 and with a quick click inside an application, can print directly to their MakerBot® Replicator® 2 Desktop 3D Printer. This built-in support in Windows 8.1 uses the new 3D printer driver, available for download via the Windows Update Service, which MakerBot developed so customers could experience plug-and-play and seamless end-to-end printing from a wide variety of applications directly to a MakerBot.</ … Read More → "MakerBot 3D Printer Driver Now Available on Windows 8.1"

MEMS Industry Group’s Annual Executive Conference Shows Why MEMS is Growing 2x Faster than Semiconductors

November 14, 2013

PITTSBURGH—November 14, 2013—MEMS Industry Group (MIG)’s MEMS Executive Congress®—held November 7-8, 2013 in Napa, CA—showed why the MEMS industry is outpacing the semiconductor industry, in both growth and innovation. With a ten percent increase in attendance over 2012 and market analysts such as IHS Inc.’s Jérémie Bouchaud predicting that the MEMS industry will grow twice as fast as the semiconductor industry—MEMS Executive Congress highlighted innovation … Read More → "MEMS Industry Group’s Annual Executive Conference Shows Why MEMS is Growing 2x Faster than Semiconductors"

New ZestETM1 Gigabit Ethernet Module Launches

November 14, 2013

Oxford, UK company Orange Tree Technologies has just announced the launch of a slim new addition to its product family, the ZestETM1, a high performance Gigabit Ethernet TCP/IP offload engine (TOE) module.

Charles Sweeney, Hardware Director at the company, said “With the increasing use of Ethernet in many different markets such as industrial control, machine vision, defence and the medical sector, the ZestETM1 can speed the time to market for many companies, creating a key advantage for them”.

With the proprietary protocol chip GigExpedite handling the whole TCP/IP stack at over 100MBytes/sec … Read More → "New ZestETM1 Gigabit Ethernet Module Launches"

Nallatech Delivers OpenCL-Compatible FPGA Accelerator Cards to the High Performance Computing (HPC) Market

November 14, 2013

CAMARILLO, Calif., – November 13, 2013 – Nallatech, a leading supplier of high-performance FPGA solutions, today announced it is now delivering its family of OpenCL-compatible accelerator cards featuring Altera Stratix® V FPGAs to the High Performance Computing (HPC) market. The Nallatech 385 and 395 accelerator cards are capable of accelerating a range of compute and I/O intensive applications while reducing overall power consumption and total cost of ownership. Visitors to Supercomputing ‘13 (November 19-November 21) can learn more at Nallatech’s booth #3519 and can view application demonstrations at Altera’s booth #4332.

“The introduction of OpenCL for FPGAs is a market changing development enabling adoption … Read More → "Nallatech Delivers OpenCL-Compatible FPGA Accelerator Cards to the High Performance Computing (HPC) Market"

Real Intent to Present Session on CDC Verification, Serve as Panelist and Exhibit at TVS “Verification Futures” Conferences in Germany and UK Nov. 18 & 19, 2013

November 13, 2013

SANTA CLARA, Calif. – Nov. 13, 2013 –

Who:

Robert Eichner, partner at EuropeLaunch S.L.N.E., the European distributor for Real Intent, whose advanced verification solutions accelerate design sign-off, will make a presentation, serve as a panelist, and exhibit Real Intent’s Ascent and Meridian products at the Testing and Verification Solutions (TVS) 2013 “Verification Futures” … Read More → "Real Intent to Present Session on CDC Verification, Serve as Panelist and Exhibit at TVS “Verification Futures” Conferences in Germany and UK Nov. 18 & 19, 2013"

Ericsson Meets High Power Datacom Demands with 864W Quarter-Brick DC/DC Module

November 13, 2013

Industry’s first Hybrid Regulated Ratio DC/DC converter handles 864W of power
PKM-NH platform quarter-brick module delivers high power density of 35.6W/cm3 (581W per cubic inch)
Innovative module delivers high-efficiency flat-curve characteristics of up to 97%

Ericsson has announced a second new product in its high-power PKM-NH platform, the PKM4817NH-PIHS, which employs the company’s innovative hybrid regulated topology. The platform is optimized for datacom board applications that have a 52-58V system bus distribution and require high-power regulated quarter-brick-format intermediate bus converters.

AIMS International Announces Advanced Vectored VDSL2 Testing

November 13, 2013

Fife, Scotland, UK — November 13th 2013 – AIMS International, one of the foremost innovators and suppliers of cutting edge software test solutions to the Broadband industry, is today launching its new Vectored VDSL2 Test solution, designed to enable telecoms operators to undertake internal testing on their Vectored VDSL2 modems.

Incorporating a powerful Graphical User Interface (GUI) to control Vectored VDSL2 test environments for modem testing, the AIMS International solution allows stringent testing according to global specifications published by the Broadband Forum and the NICC (BBF TR-249 and NICC 1436).

The AIMS GUI runs on an external PC and … Read More → "AIMS International Announces Advanced Vectored VDSL2 Testing"

ams schedules multi-project wafer starts for analog foundry customers in 2014

November 13, 2013

Unterpremstaetten, Austria (November 13, 2013), The Full Service Foundry business unit of ams AG (SIX: AMS) today announced its fast and cost-efficient IC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with an updated schedule in 2014. The prototyping service, which combines several designs from different customers onto a single wafer, offers significant cost advantages for foundry customers as the costs for wafers and masks are shared among a number of different shuttle participants.

ams’ best in class MPW service includes the whole range of 0.18µm and 0.35µm specialty processes. In order to provide leading analog semiconductor process … Read More → "ams schedules multi-project wafer starts for analog foundry customers in 2014"

Cadence Hosts Signoff Summit

November 13, 2013

SAN JOSE, CA–(Marketwired – November 13, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS) — If you want to get on the fast track to design signoff, don’t miss Cadence’s Signoff Summit — a day-long event that will help you shave weeks off design closure.

WHEN:
Thursday, November 21, 2013

WHERE:
Cadence Design Systems
Building 10 Auditorium
2655 Seely Ave,< … Read More → "Cadence Hosts Signoff Summit"

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