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Nanoplas Announces Important New 14nm Order and Joint Development Agreement with CEA-Leti

November 13, 2013

ST-ÉGRÈVE, France – November 13, 2013 – Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a second purchase order for an ALDE® (Atomic Layer Downstream Etching) process module for extreme selectivity dielectric dry-etching. As the company foresees many different applications at 14nm and beyond, Nanoplas also announced a Joint Development Agreement (JDA) with CEA-Leti, extending the technology to additional applications in 14nm dry-etching, stripping and cleaning.

The new ALDE® order will enable … Read More → "Nanoplas Announces Important New 14nm Order and Joint Development Agreement with CEA-Leti"

Advanced Microcontrollers from STMicroelectronics Ensure Ultimate Digital Security in Next-Generation Mobile and Consumer Applications

November 13, 2013

Geneva, November 13, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and the world’s top supplier of secure chips for NFC Universal Integrated Circuit Cards (UICCs)[1] and embedded Secure Element (eSE) Element[2] applications, has revealed the latest generation of its successful ST33 secure microcontroller line, delivering advanced performance, enhanced security, lower power consumption and … Read More → "Advanced Microcontrollers from STMicroelectronics Ensure Ultimate Digital Security in Next-Generation Mobile and Consumer Applications"

MakerBot and Partners Are Leading the Charge to Crowd Source A MakerBot Desktop 3D Printer in Every School in America

November 12, 2013

Brooklyn, N.Y., November 12, 2013 – MakerBot is on a mission:  to put a MakerBot Desktop 3D Printer in every school in America.  This initiative is a unique partnership between MakerBot, DonorsChoose.org America Makes, and Autodesk, and was a response to a call to action by the President of the United States.  In the recent State of the Union Address, President Barack Obama announced a new initiative to bring manufacturing jobs back to the U.S.  He affirmed, “3D printing has … Read More → "MakerBot and Partners Are Leading the Charge to Crowd Source A MakerBot Desktop 3D Printer in Every School in America"

Exar Introduces Industry’s Lowest Power Fault Tolerant Transceivers with Level 4 IEC ESD Protection

November 12, 2013

Fremont, CA, November 12, 2013 – Exar Corporation (NYSE: EXAR), a leading supplier of high performance analog mixed-signal components and data management solutions, today announced the XR3070-78X family of ruggedized RS-485/RS-422 transceivers for harsh industrial environments.  The analog bus pins can withstand direct shorts up to ±18V and are protected from ESD events exceeding IEC Level 4.  Operating from 3.3V with an industry-leading 300?A idle current, these devices consume half the power of a comparable ±18V fault tolerant solution.  The family of nine devices supports data rates … Read More → "Exar Introduces Industry’s Lowest Power Fault Tolerant Transceivers with Level 4 IEC ESD Protection"

STMicroelectronics Captures Top MEMS Awards from MEMS Industry Group

November 12, 2013

Geneva, November 11, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has been selected by MEMS Industry Group and affiliated voters as the Company of the Year for its continuing success in growing its MEMS business, expanding its product line, and demonstrating industry leadership and vision. Adding to ST’s Company of the Year recognition, Executive Vice President and General Manager of ST’s Analog, MEMS & Sensors Group, Benedetto Vigna, was acknowledged as Executive of the Year, and the LSM303C 2mmx2mm … Read More → "STMicroelectronics Captures Top MEMS Awards from MEMS Industry Group"

Programmable 800 and 1500 Watt PSUs provides constant current output down to almost zero volts

November 12, 2013

XP Power today announced the HDS series of 800 and 1500 Watt highly efficient programmable AC-DC power supplies. With a typical efficiency of up to 93%, these single output low profile supplies measure 9.80 x 5.00 x 1.61 inches (249.0 x 127.0 x 40.9 mm) for the 800 Watt models and 11.02 x 5.0 x 2.5 inches (280 x 127 x 63.5 mm) for the 1500 Watt range and fit into an industry standard 1U or 2U profile. Two front mounted variable speed fans, included in the above dimensions, help conserve energy and keep noise to a minimum. The power density of these compact units is greater than 10 Watts per cubic inch.

< … Read More → "Programmable 800 and 1500 Watt PSUs provides constant current output down to almost zero volts"

ADLINK Launches Extreme Rugged™ HPERC-IBR for Reduced SWaP Requirements

November 12, 2013

SAN JOSE, CA – November 12, 2013 – ADLINK Technology, Inc., a leading provider of embedded computing products and Application Ready Intelligent Platforms (ARIP), today announced release of the new Extreme Rugged™ HPERC-IBRsystem. The HPERC™ Series is a high performance Extreme Rugged computer system offering a compact, highly reliable and efficient processing unit to meet challenging SWaP (Size, Weight and Power) requirements for modern ground … Read More → "ADLINK Launches Extreme Rugged™ HPERC-IBR for Reduced SWaP Requirements"

Optomec Launches Entry Level Research System for Printed Electronics

November 12, 2013

Albuquerque, New Mexico, 1 November 2013: Optomec announced today availability of a new entry level offering in its line-up of systems for printed electronics, the Aerosol Jet 200 bench top. This new system is built using Optomec’s patented Aerosol Jet core technology, but in a bench top form factor ideally suited for research applications, such as prototyping small electronic devices, or developing and certifying new printable inks. The system was developed specifically in response to growing world-wide interest in printed electronics, including the need to train a new generation of workers in additive manufacturing technology.

… Read More → "Optomec Launches Entry Level Research System for Printed Electronics"

TI helps make customer system design easier with TI Designs, the industry’s most extensive reference design library

November 12, 2013

DALLAS (Nov. 11, 2013) – Today Texas Instruments (TI) (NASDAQ: TXN) introduced TI Designs, the industry’s most extensive reference design library, spanning TI’s broad portfolio of analog, embedded processor and connectivity products for industrial, automotive, consumer, communications and computing applications, among others. TI Designs are comprehensive, with each including test data, a schematic or block diagram, bill of materials (BOM) and design files that help explain the circuit’s function and performance. Support material may also include models, software, code examples, design guides, evaluation modules and more to take system designers even further down the design path. To learn more … Read More → "TI helps make customer system design easier with TI Designs, the industry’s most extensive reference design library"

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