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Timesys LinuxLink Bundled with Freescale Vybrid™ Controller Solutions

PITTSBURGH, June 19, 2012 /PRNewswire/ — Timesys Corporation (http://www.timesys.com), provider of the industry’s most-easy-to-use and affordable embedded Linux products and expert professional services, today announced that Freescale Semiconductor (NYSE: FSL) is expected to offer Timesys LinuxLink PRO Edition as the default software development option … Read More → "Timesys LinuxLink Bundled with Freescale Vybrid™ Controller Solutions"

Imec presents breakthrough results in resistive-switching (R)RAM

Leuven (Belgium), Honolulu (Hawaii, USA) – June 14, 2012 – At this week’s VLSI Technology Symposium (Honolulu, Hawaii, USA), imec presents significant improvements in performance and reliability of RRAM cells by process improvements and clever stack-engineering, and imec introduces a new modeling approach increasing the fundamental understanding of RRAM process technology. These achievements pave the way towards scalability and manufacturability of RRAM technology.

RRAM is a promising concept for future non-volatile memories because of its high speed, low energy operation, superior scalability, and compatibility with CMOS technology. Its operation relies on the voltage controlled resistance change of a conductive filament … Read More → "Imec presents breakthrough results in resistive-switching (R)RAM"

Maxim Introduces Third-Generation TINI® Power SoC Chipset for Smaller, Thinner, and More Energy-Efficient Smartphones

Sunnyvale, CA—June 19, 2012—Maxim Integrated Products, Inc. (NASDAQ: MXIM) announced that its newest Power SoC chipset in the Galaxy S® III operates with the Exynos 4412 quad-core applications processor to provide a smaller, much thinner, and significantly more efficient smartphone.  

Maxim’s newest Power SoC chipset covers all power management, charging, and USB multiplexing needs. It provides an optimized balance between size and flexibility to power the Samsung® applications processor and baseband processor. It maximizes battery usage and enhances USB connectivity. Managing the power for upwards of 60 channels, the chipset offers up to 20 percent more … Read More → "Maxim Introduces Third-Generation TINI® Power SoC Chipset for Smaller, Thinner, and More Energy-Efficient Smartphones"

New Excelsys 150 and 200 Watt LED Power Supplies Offer Lowest Profile in the Industry

Excelsys Technologies, leaders in high efficiency power supply design, announces the introduction of the latest models in their market leading Xled series of LED power supplies. 

The LDB 150 LED and LDB 200 power supplies provide 150 watts and 200 Watts of Constant Current/Constant Voltage power respectively in an IP67 rated, low profile, aluminium case measuring only 198 x 63 x < … Read More → "New Excelsys 150 and 200 Watt LED Power Supplies Offer Lowest Profile in the Industry"

X-Ray Imaging Applications to Benefit from Development of Wafer-Scale CMOS Imaging Technology

  • Advanced sensor for medical imaging applications developed by the Science and Technology Facilities Council’s Rutherford Appleton Laboratory
  • Highly innovative imager enabled by advanced analog design tools from Tanner EDA and leading-edge CMOS Image Sensor manufacturing process technology from TowerJazz
  • Innovative three-sided ‘buttable’ high-resolution high-frame-rate sensor integrates 6.7 million pixels on 50-micron pitch for mammography applications 

Harwell, UK – June 19, 2012 – A highly innovative high-resolution wafer-scale digital image sensor that targets medical imaging applications has been developed at the Science and Technology Facilities Council’s (STFC) Rutherford Appleton Laboratory (RAL). One of the key … Read More → "X-Ray Imaging Applications to Benefit from Development of Wafer-Scale CMOS Imaging Technology"

SymTA/S supports ECU software development on new multicore AURIXTM automotive microcontrollers from Infineon

Braunschweig, Germany – 19th June 2012.  Symtavision, the global leader for timing design and timing verification for embedded real-time systems, has announced that SymTA/S supports the timing design and verification of embedded software developed for the new multicore AURIXTM microcontroller family from Infineon Technologies. 

Featuring up to three independent 32-bit TriCoreTM CPUs, the AURIX MCUs from Infineon have been designed to meet the exacting ISO 26262 safety requirements for automotive applications while significantly increasing performance. The modular design and memory approach of AURIX provide the scalability that customers increasingly demand and … Read More → "SymTA/S supports ECU software development on new multicore AURIXTM automotive microcontrollers from Infineon"

Cypress, Nuvation and Arrow Electronics Introduce New USB 3.0 SuperSpeed Interface Board for Altera FPGAs

SAN JOSE, Calif., June 19, 2012 – Cypress Semiconductor Corp. (NASDAQ: CY) and Nuvation Research Corp. today announced the production release of a rapid-prototyping solution that simplifies streaming video, images and other data from Altera FPGAs to a host processor at speeds up to 400 Megabytes per second. This solution includes a SuperSpeed USB 3.0 device interface board that connects to Arrow Electronics’ BeMicro SDK (Software Development Kit), the popular FPGA evaluation platform featuring an Altera Cyclone IV FPGA. This new USB 3.0 expansion board enables BeMicro users to prototype a simpler, uncompressed, cost-effective alternative to traditional slower interfaces such as USB 2.0 and Gigabit Ethernet.</ … Read More → "Cypress, Nuvation and Arrow Electronics Introduce New USB 3.0 SuperSpeed Interface Board for Altera FPGAs"

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