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Mentor Graphics Next-Generation FloTHERM Product Delivers Enhanced Performance and Extended Functionality

November 19, 2013

WILSONVILLE, Ore., November 19, 2013 —Mentor Graphics Corporation (NASDAQ: MENT) today announced its next-generation FloTHERM® product featuring a new native Windows graphical user interface (GUI) to handle pre-processing and large models with ease, targeting today’s most advanced electronic designs.  The latest release continues the product line’s 25 year history of technical product innovation and was developed based on extensive user feedback.

The new FloTHERM product was developed from user feedback via the company’s IDEAS website, soliciting requests on software enhancements and features … Read More → "Mentor Graphics Next-Generation FloTHERM Product Delivers Enhanced Performance and Extended Functionality"

Imagination unveils industry’s most scalable Image Signal Processing architecture

November 19, 2013

London, UK – 18 November, 2013 – Imagination Technologies (IMG.L) announces a ground-breaking new camera Image Signal Processing (ISP) architecture codenamed ‘Raptor.’ Imagination designed the PowerVR Series2 ‘Raptor’ imaging pipeline architecture from the ground-up to be optimized for integration into next-generation System-on-Chips (SoCs) for a broad range of imaging and vision applications.

‘Raptor’ is also the first ISP designed to operate as a cooperative part of a heterogeneous computing platform for advanced functions and next-generation applications. The ‘Raptor’ architecture takes ISP to … Read More → "Imagination unveils industry’s most scalable Image Signal Processing architecture"

Tektronix Delivers Advanced 802.11 WLAN Test Solutions for Embedded Design Engineers

November 19, 2013

BEAVERTON, Ore., Nov. 19, 2013 / PRNewswire / — Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today announced numerous new capabilities and upgrades to its mixed domain oscilloscope, performance oscilloscope, and spectrum analyzer families that give electrical engineers powerful – and affordable – tools for integrating 802.11 a/b/g/j/n/p/ac WLAN connectivity into their product designs. The new WLAN solutions address the growing demand toward integrating Wi-Fi in everything from home appliances to industrial equipment.

The new WLAN tools span several products that together provide the highest value, … Read More → "Tektronix Delivers Advanced 802.11 WLAN Test Solutions for Embedded Design Engineers"

Tilera Speeds Up Power Signoff Flow for TILE-Gx72 Processor With Cadence Voltus IC Power Integrity Solution

November 19, 2013

SAN JOSE, CA–(Marketwired – November 19, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that Tilera Corp. achieved an 8X run-time performance improvement for power signoff of its largest design to date, the TILE-Gx72 processor using the new Cadence® Voltus™ IC Power Integrity Solution. Without any loss of accuracy, Tilera cut power signoff runtime for this highly integrated 72 core system-on-a-chip design from 65 hours to 8 hours for dynamic analysis and … Read More → "Tilera Speeds Up Power Signoff Flow for TILE-Gx72 Processor With Cadence Voltus IC Power Integrity Solution"

TI showcases an in-depth look at never-before-seen technology for motor control, drives and PLC applications at industrial show SPS IPC Drives in Germany

November 19, 2013

DALLAS (Nov. 19, 2013) – At SPS IPC Drives in Nuremberg, Germany on Nov. 26-28, 2013, Texas Instruments (TI) (NASDAQ: TXN) will showcase new technology innovations for the industrial market on its booth in Hall 6, stand # 136. Several hands-on analog and embedded processing demonstrations will highlight key technology advancements in industrial automation, including motor control, industrial drives, programmable logic control (PLC), industrial communication and sensors. Further details can be found on TI’s industrial automation portfolio web page. 

Main highlights of the TI booth:

IAR Systems updates its popular development tools for 8051-based microcontrollers

November 19, 2013

Uppsala, Sweden—November 19, 2013—Today, IAR Systems® releases an updated version of its complete C/C++ development toolchain IAR Embedded Workbench® for 8051. The toolchain, popular with the 8051 community, includes high-performance compiler and debugger tools with extensive support for a wide range of microcontrollers from manufacturers such as Atmel, Intel, Infineon, NXP, Silicon Labs and Texas Instruments. Version 8.30, released today, adds new and updated device support and integration possibilities as well as new features.

Despite the growing complexity of applications and the industry focus on … Read More → "IAR Systems updates its popular development tools for 8051-based microcontrollers"

Microchip’s PIC32MZ 32-bit MCUs Have Class-Leading Performance of 330 DMIPS and 3.28 CoreMarks™/MHz; 30% Better Code Density

November 19, 2013

CHANDLER, Ariz., Nov. 18, 2013 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the new 24-member PIC32MZ Embedded Connectivity (EC) family of 32-bit MCUs.  It provides class-leading performance of 330 DMIPS and 3.28 CoreMarks™/MHz, along with dual-panel, live-update Flash (up to 2 MB), large RAM (512 KB) and the connectivity peripherals—including a 10/100 Ethernet MAC, Hi-Speed USB MAC/PHY (a first … Read More → "Microchip’s PIC32MZ 32-bit MCUs Have Class-Leading Performance of 330 DMIPS and 3.28 CoreMarks™/MHz; 30% Better Code Density"

EV Group Introduces Non-Contact Lithography System For Cost-Efficient Volume Production Of Passive And Active Photonic Components

November 19, 2013

ST. FLORIAN, Austria, Nov. 19, 2013 /PRNewswire/ — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®PHABLE™ exposure system, which is designed specifically for manufacturing photonic components.  Leveraging EVG’s expertise in photolithography, the EVG PHABLE system incorporates a unique contactless lithography mask-based approach that enables full-field, high-resolution … Read More → "EV Group Introduces Non-Contact Lithography System For Cost-Efficient Volume Production Of Passive And Active Photonic Components"

ADLINK Introduces High Performance PICMG® 1.3 Solution for Machine Vision and Industrial Control

November 19, 2013

SAN JOSE, CA – November 19, 2013 – ADLINK Technology, a leading provider of embedded building blocks and application ready intelligent platforms, introduces the ADLINK NuPRO-E42, its latest PICMG® 1.3 full-size System Host Board (SHB). The NuPRO-E42 is equipped with the 4th generation Intel® Core™ processor—at core speeds up to 3.5GHz—combined with the Intel® Q87 Express Chipset, and provides high-speed data transfer interfaces such as USB 3.0 and SATA 6 Gb/s. With dual-channel DDR3 1333/1600 MHz memory up to 16GB in two DIMM … Read More → "ADLINK Introduces High Performance PICMG® 1.3 Solution for Machine Vision and Industrial Control"

Altera Releases New 100G Ethernet and Interlaken IP Cores To Drive High-Capacity Transmission and Backhaul Applications

November 19, 2013

San Jose, Calif., November 19, 2013 – Altera Corporation (Nasdaq: ALTR) today strengthened its intellectual property (IP) core portfolio with the addition of four new best-in-class IP cores to the company’s MegaCore IP library. These new best-in-class IP cores include an ultra-high performance and ultra-low latency 100G Interlaken, 100G Ethernet, 40G Ethernet and 10G Ethernet IP.  The cores are optimized to deliver the highest performance, lowest latency and smallest resource utilization in the industry. Developers of data centers and networking equipment can leverage these versatile solutions to increase … Read More → "Altera Releases New 100G Ethernet and Interlaken IP Cores To Drive High-Capacity Transmission and Backhaul Applications"

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