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ITTIA Updates Software for Large Data Management on Embedded Devices

December 31, 2013 — Bellevue, WA — ITTIA, the trusted leader in modern database software for embedded systems and smart devices, today revealed new ITTIA DB SQL capabilities specifically designed to help embedded developers achieve large volume data management and analytics. With faster processing of large result sets from high-capacity storage, this update addresses the growing scale of data in embedded systems.

As embedded systems and mobile devices manufacturers tackle the rising volume of data, they face the growing challenge of how to analyze a large quantity of data quickly through a variety of complex queries. ITTIA DB SQL is already … Read More → "ITTIA Updates Software for Large Data Management on Embedded Devices"

3M Showcases 3M™Quantum Dot Enhancement Film Technology at CES 2014

WHO:

The 3M Optical Systems Division, which manufacturers optical films used in LCD-centric electronic devices such as LCD TVs, monitors, notebooks and mobile phones.

WHAT:          

At CES, 3M will demonstrate its 3M Quantum Dot Enhancement Film (3M QDEF), which allows up to 50 percent more color than current levels in liquid crystal display (LCD) devices. 3M has teamed with Nanosys, Inc., to produce the 3M QDEF solution specifically to deliver more color, and to make devices such as smart phones, tablets and televisions, … Read More → "3M Showcases 3M™Quantum Dot Enhancement Film Technology at CES 2014"

Sidense 1T-OTP Memory Macros meet JEDEC Accelerated Testing Qualifications at Two TSMC 28nm Process Nodes

Ottawa, Canada – December 26, 2013 – Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that its SHF Non-Volatile Memory (NVM) macros have met stringent JEDEC accelerated testing requirements for TSMC’s 28HPM and 28HPL process nodes.

The 28nm HPM node addresses applications requiring high speed as well as low-leakage power and is suitable for many applications from networking and tablets to mobile consumer products. The 28nm HPL low-power node is best suited for cellular baseband, application processor, wireless connectivity, and programmable logic applications.

To meet JEDEC standard reliability test requirements, three lots of … Read More → "Sidense 1T-OTP Memory Macros meet JEDEC Accelerated Testing Qualifications at Two TSMC 28nm Process Nodes"

connectBlue® to Participate in IoT Project for Home Cancer Care

Today, connectBlue announced its participation in the itACiH (IT Support for Advanced Cancer Care in the Home) project. connectBlue will bring to the project its know-how in reliable medical wireless and Internet of Things (IoT) solutions.

Beginning January 14, connectBlue will be a contributor of the Swedish itACiH (IT Support for Advanced Cancer Care in the Home) project. The aim of this project is to make it possible for more cancer patients to safely undergo treatment in the home environment. 

“We have delivered … Read More → "connectBlue® to Participate in IoT Project for Home Cancer Care"

Mentor Graphics adds S1000D compliance and more with latest release of Capital software for vehicle electrical system design, manufacture and service.

WILSONVILLE, Or., December 19th, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced support for the S1000D documentation standard as part of the latest Capital® software release. The Capital suite addresses vehicle electrical system definition, design, manufacture and service.  S1000D support is just one of over 60 new capabilities available in the latest version of the Capital software suite. Users can automatically generate S1000D-compliant information packages directly from their electrical design data using the Capital Publisher™ tool, thereby reducing the costs and lead times associated with technical documentation creation.  Also new in this release is tablet device support, … Read More → "Mentor Graphics adds S1000D compliance and more with latest release of Capital software for vehicle electrical system design, manufacture and service."

Vincotech Integrates Several Power Modules into One Silm 90° Housing

Unterhaching, Germany, December 20, 2013  – Vincotech, a supplier of module-based solutions for power electronics, has unveiled the new power module flow90PACK 0, which integrates several power modules into one housing size for 90° PCB mounting. Featuring three half-bridges up to 1200 V / 35 A with open emitters, this is the module of choice for multiple-axis servo drives where space is at a premium.

Another step up the evolutionary ladder from Vincotech’s popular flow90 1 housing, the flow90 0 housing is a space-saving unit that does not … Read More → "Vincotech Integrates Several Power Modules into One Silm 90° Housing"

Honeywell Launches High Sensitivity Latching Digital Hall-Effect Sensor Integrated Circuits

MINNEAPOLIS, Minn. – Dec. 20, 2013 – Honeywell Sensing and Control’s new SS360PT and SS460P High Sensitivity Latching Hall-Effect Sensor ICs with Built-in Pull-up Resistors are high performance yet economical sensor ICs well-suited for demanding, cost-sensitive high-volume applications, such as commuting brushless DC motors used for medical equipment and appliances as well as for flow-rate sensing, speed and RPM sensing, tachometers, counter pickups, motor and fan controls.

The SS360PT/SS460P Hall-Effect sensors provide reliable switching points with a high magnetic sensitivity of 30 Gauss typical, at 25 °C [77 °F], and 55 Gauss maximum over the full -40 °C to 125 ° … Read More → "Honeywell Launches High Sensitivity Latching Digital Hall-Effect Sensor Integrated Circuits"

Nordic Semiconductor announces Bluetooth Smart solution for Rezence Wireless Charging and the S120 8-link central role Bluetooth low energy SoftDevice for the nRF51822

Oslo, Norway – December 20, 2013 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces the immediate availability of the S120 8-link central protocol stack and the nRF51 Wireless Charging Software Development Kit (SDK) for wireless charging applications based on the Rezence™ standard, developed and maintained by the Alliance for Wireless Power (A4WP).

Rezence is a wireless power transfer technology and specification based on the principles of magnetic resonance. Embracing the concept of spatial freedom, Rezence extends wireless power applications “beyond the mat” and accessories … Read More → "Nordic Semiconductor announces Bluetooth Smart solution for Rezence Wireless Charging and the S120 8-link central role Bluetooth low energy SoftDevice for the nRF51822"

IAR Systems further simplifies designing and testing of state machine-based embedded applications

Uppsala, Sweden—December 20, 2013—IAR Systems® launches a new version of its state machine tool suite IAR visualSTATE®. Version 7.2 includes several new features for further simplifying large design projects for embedded applications based on state machines, as well as updated user guides and a new license management system.

IAR visualSTATE allows developers to build their design from a high level, structure complex applications, step by step add functions in detail, and automatically generate code that is 100 percent consistent with the design. It also provides advanced formal verification, … Read More → "IAR Systems further simplifies designing and testing of state machine-based embedded applications"

RAID-Capable Box PC from MEN Micro Offers Flexible Storage Capacity

BLUE BELL, Pa. December 2013 – MEN Micro Inc., a world-renowned provider of embedded computing and I/O solutions for mission-critical industrial, mobile and harsh environment applications, now offers a box PC with five integrated Ethernet interfaces. The low profile, maintenance-free BL50S is designed for reliable storage in harsh environments.

The robust BL50S boasts two hot-plug-capable HDD/SSD shuttles in a slim 2.4″ housing.  It can support RAID 0 for applications requiring fast data transfer, such as audio and video in a video recorder, as well as RAID 1 … Read More → "RAID-Capable Box PC from MEN Micro Offers Flexible Storage Capacity"

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