industry news
Subscribe Now

Sidense 1T-OTP Memory Macros meet JEDEC Accelerated Testing Qualifications at Two TSMC 28nm Process Nodes

Ottawa, Canada – December 26, 2013 – Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that its SHF Non-Volatile Memory (NVM) macros have met stringent JEDEC accelerated testing requirements for TSMC’s 28HPM and 28HPL process nodes.

The 28nm HPM node addresses applications requiring high speed as well as low-leakage power and is suitable for many applications from networking and tablets to mobile consumer products. The 28nm HPL low-power node is best suited for cellular baseband, application processor, wireless connectivity, and programmable logic applications.

To meet JEDEC standard reliability test requirements, three lots of SHF devices at each process node underwent 1000 hours of high temperature storage (HTS) and high temperature operating life (HTOL) stress testing with no bit-cell failures. For both process nodes, macro functionality and performance was verified across each of the FF, FS, SF, SS, and TT process corners at read and program temperatures of -40°C to +125°C. All macro configurations were successfully programmed and read in single-ended, redundant and double-redundant read modes.

“Our patented 1T-Fuse™ bit-cell architecture allows us to migrate Sidense 1T-OTP macros to shrinking process nodes as they become available,” said Rhéal Gervais, Sidense VP of Operations. “We perform rigorous characterization and qualification of our macros at each node and process variant, including JEDEC accelerated testing, to assure our customers that they are getting low-power non-volatile memory that is highly reliable.”

About SHF

The Sidense SHF One-Time-Programmable (OTP) memory subsystem is based on a patented 1T-Fuse™ (anti-fuse) bit-cell. The 1T-Fuse bit-cell uses gate oxide breakdown as a robust, non-reversible programming mechanism. Optimized for high-performance and a wide range of bit densities, Sidense SHF macros are available for standard CMOS processes. There are no requirements for any additional masks or processing steps.

Sidense SHF memory IP is provided as a complete, non-volatile memory (NVM) subsystem providing interfaces and features to support a range of embedded SoC applications. The SHF module integrates the OTP memory and Integrated Power Supply (IPS) hard macro blocks along with program control, programming and test interface, error correction and Built-In Self-Test (BIST) RTL. SHF applications include: code storage, ROM replacement, secure encryption key storage, configuration, fuse replacement, trimming and calibration.

About Sidense Corp.

Sidense Corp. provides very dense, highly reliable and secure non-volatile one-time programmable (OTP) Logic Non-Volatile Memory (LNVM) IP for use in standard-logic CMOS processes. The Company, with over 115 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-OTP macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming and device configuration uses. 

Over 110 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-OTP as their NVM solution for more than 350 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit www.sidense.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Power High-Performance Applications with Renesas RA8 Series MCUs
Sponsored by Mouser Electronics and Renesas
In this episode of Chalk Talk, Amelia Dalton and Kavita Char from Renesas explore the first 32-bit MCUs based on the new Arm® Cortex® -M85 core. They investigate how these new MCUs bridge the gap between MCUs and MPUs, the advanced security features included in this new MCU portfolio, and how you can get started using the Renesas high performance RA8 series in your next design. 
Jan 9, 2024
15,535 views