News – Page 1708 – EEJournal

Renesas Electronics America Expands Solutions Ecosystem for Low-Power RL78 MCUs

October 15, 2012

SANTA CLARA, Calif., October 12, 2012 – Renesas Electronics America Inc. today announced it has expanded its portfolio of solutions for the low-power RL78/G14 microcontroller (MCU) family in order to simplify systems development and decrease time-to-market. Designed to deliver performance and power-efficiency while incorporating advanced on-chip peripherals, the RL78/G14 MCUs are ideal for a number of applications including low-power consumer and wireless systems, household appliances, home healthcare, HVAC equipment and industrial automation systems. With today’s announcement, Renesas offers a new Read More → "Renesas Electronics America Expands Solutions Ecosystem for Low-Power RL78 MCUs"

Fox’s New XpressO TCXOs Provide Custom Frequencies up to 250 MHz with Quick Delivery

October 15, 2012

Fort Myers, Fla. October 2012 – Fox Electronics, a leading global supplier of frequency control solutions and an IDT company, has enhanced its innovative XpressO line of low jitter configurable oscillators with the XpressO-TC, a new TCXO version with custom frequencies up to 250 MHz. As w ith all XpressO oscillators, the new TCXOs can be delivered in less than ten working days, a major improvement over the standard lead times of competitive offerings.

Part of the FXTC-HE73 series, the new HCMOS … Read More → "Fox’s New XpressO TCXOs Provide Custom Frequencies up to 250 MHz with Quick Delivery"

ITRI Tapes Out 3D-IC Chip Using Cadence Technology

October 15, 2012

SAN JOSE, CA–(Marketwire – October 15, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that its full suite of 3D-IC technologies were deployed by Taiwan’s Industrial Technology Research Institute (ITRI) to develop a 3D-IC chip. Working together, engineers from Cadence® and ITRI used the integrated Cadence 3D-IC flow to implement, analyze, and verify the test chip — a wide I/O memory stack with through-silicon vias (TSVs). The 3D-IC approach — in which multiple ICs are stacked … Read More → "ITRI Tapes Out 3D-IC Chip Using Cadence Technology"

Synopsys and TSMC Collaborate for 20nm Reference Flow

October 15, 2012

MOUNTAIN VIEW, Calif., Oct. 15, 2012 /PRNewswire/ —

Highlights:

TSMC 20nm Reference Flow deployed by early adopters for design enablement
Flow provides proven support for double patterning, pre-coloring, pattern matching, multi-valued SPEF
Flow includes Synopsys’ Design Compiler®, IC Compiler™, StarRC™, PrimeTime® and IC Validator tools

Synopsys, Inc. (Nasdaq: SNPS), a global leader accelerating innovation in the design, verification and manufacture of chips and systems, today announced 20-nanometer (nm) process technology support for the TSMC 20nm Reference flow. This includes Synopsys® Galaxy™ Implementation Platform support for the latest TSMC 20 … Read More → "Synopsys and TSMC Collaborate for 20nm Reference Flow"

TSMC Validates Cadence 3D-IC Technology for Its CoWoS(TM) Reference Flow

October 15, 2012

SAN JOSE, CA–(Marketwire – October 15, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that TSMC has validated Cadence® 3D-IC technology for its CoWoS™ (chip-on-wafer-on-substrate) Reference Flow with the development of a CoWoS™ test vehicle that includes an SoC with Cadence Wide I/O memory … Read More → "TSMC Validates Cadence 3D-IC Technology for Its CoWoS(TM) Reference Flow"

New Extendable C Callable Optimised MINPACK Library for TI DSPs

October 12, 2012

October 2012, Northwich, Cheshire. Kane Computing Ltd (KCL) is pleased to announce a new Extendable C Callable Software Library for TI DSPs, the GDD5000-Optimised-MINPACK.

The GDD5000 is a set of functions for solving non-linear equation solutions and non-linear least squares problems.

The library provides a set of routines to solve unconstrained and constrained optimisation problems for univariate and multivariate functions, systems of non-linear equations and non-linear least squares problems.

The optimisation algorithm implemented in the library uses function values only for first and possible second order derivatives (gradient vector, Hessian and Jacobian matrices), … Read More → "New Extendable C Callable Optimised MINPACK Library for TI DSPs"

150W Industrial ATX Power Supply for PC/104, EPIC, and EBX Single Board Computers

October 12, 2012

October 10, 2012, Arlington, TX – Today WinSystems introduced the PS-ATX150-0, a 150W industrial power supply for ATX-compatible embedded Single Board Computers (SBCs). It supports ATX signals Power On/Off, Power Good, and Power Fail, allowing ATX-compatible SBCs to utilize sleep and suspend modes for energy savings during periods of processor or system inactivity. The PS-ATX150-0 is designed to power embedded SBCs that support the Advanced Configuration and Power Interface (ACPI) specification for device configuration and power management by … Read More → "150W Industrial ATX Power Supply for PC/104, EPIC, and EBX Single Board Computers"

Solido Design Automation Joins IPL Alliance to Support Open Interoperable Analog Design Constraints Standards

October 12, 2012

MOUNTAIN VIEW, Calif., Oct. 10, 2012 /PRNewswire/ — The Interoperable PDK Libraries (IPL) Alliance announced today that Solido Design Automation Inc., an electronic design automation (EDA) software provider for variation-aware custom integrated circuit (IC) design, has joined the IPL Alliance, a standards organization whose charter is to establish an interoperable custom design ecosystem. Solido Design Automation plans to support IPL’s Interoperable Analog Design Constraint Standard 1.1.

The IPL Alliance, which includes major EDA, semiconductor and foundry companies, is an industry standards organization established to develop an interoperable ecosystem for custom IC design. Its current focus is to create and promote … Read More → "Solido Design Automation Joins IPL Alliance to Support Open Interoperable Analog Design Constraints Standards"

New VPX Mass Storage Module Boots over SATA/SAS and PCI Express for Use with Any CPU

October 12, 2012

WIXOM, Mich., Oct. 10, 2012 /PRNewswire/ — The new Xembedded XVPX-9756 is a SATA/SAS bootable storage module, in a 3U form factor, suitable for use with any CPU. It supports dual slim SATA drives or a single 2.5″ drive, either rotating or solid-state. The module connects directly to the CPU via SATA signals or by means of PCI Express signals through an on-board controller. Given its connectivity options, the XVPX-9756 is an unequaled bootable storage solution. The operating range is 0 to 70 degrees C or -40 to 85 degrees C, dependent upon thermal options. List price is $1,345.00 for air-cooled, $2,025.00 for conduction-cooled, and $2,590.00 for REDI … Read More → "New VPX Mass Storage Module Boots over SATA/SAS and PCI Express for Use with Any CPU"

Codethink Demonstrates Rapid Kernel Upgrades with Baserock Embedded Linux

October 11, 2012

Shanghai, China – 11th October 2012 – Codethink, a provider of software engineering services for mobile and embedded devices, has unveiled and demonstrated Baserock Embedded Linux at the GENIVI automotive industry trade association meeting for in-vehicle infotainment (IVI) standards in Shanghai, China. Codethink showed a full upgrade of a Linux system image kernel from version 3.2 to 3.6 in less than 10 minutes showing how the engineer tool saves vast amounts of developer time. The Linux 3.6 kernel is the latest stable kernel released on 1 October 2012.

< … Read More →

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