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Xilinx Addresses System Integration with All Programmable SoCs at ARM TechCon 2012

SAN JOSE, Calif., Oct. 25, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced its  participation at ARM® TechCon 2012, booth #515, October 30 – November 1, 2012. Xilinx

will spotlight its All Programmable SoC hardware development platforms, IP and software solutions for ARM system developers and demonstrate how its solutions enable developers to reach new levels of programmable system integration, design productivity, security and performance. In-booth demonstrations and technical sessions will highlight the broad base of end applications and design solutions enabled by Zynq™-7000 All Programmable SoCs. Xilinx will also host a panel of experts on the pressing need for … Read More → "Xilinx Addresses System Integration with All Programmable SoCs at ARM TechCon 2012"

TI’s new 28-V, 500-mA step-down converter provides highest efficiency at light loads

DALLAS (Oct. 24, 2012) – Texas Instruments Incorporated (TI) (NASDAQ:TXN) today introduced a synchronous, 28-V, 500-mA step-down DC/DC converter that can operate at less than 5 uA during “sleep” mode. The new TPS62175 maintains high efficiency during light load operation, while supporting ultra-low power microcontrollers that operate in 12-V, 15-V and 24-V applications, such as industrial sensorsmart meterRead More → "TI’s new 28-V, 500-mA step-down converter provides highest efficiency at light loads"

Semtech Introduces Next-Generation Capacitive Touch Platform with High Resolution Sensing

CAMARILLO, California – Oct 25, 2012 – Semtech Corporation. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced the SX95xx platform of capacitive touch  ICs for a wide range of home appliances and consumer electronics. The feature-rich touch button family enhances the ECO mode present in many green home electronics by integrating an IR decoder for system wake up. This enables the host to go into sleep mode during system standby and minimizes the overall power consumption.

The analog sensor front end in … Read More → "Semtech Introduces Next-Generation Capacitive Touch Platform with High Resolution Sensing"

Cadence Verification IP Significantly Reduces Verification Turnaround Time for ARM AMBA 4 Protocols

SAN JOSE, CA–(Marketwire – October 25, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced multiple successful verification projects using Cadence® Verification IP (VIP) for ARM® AMBA® protocols, one of the industry’s most widely used verification solutions for the AMBA protocol family. Leading customers, including CEVA, Inc., Faraday Technology Corporation, … Read More → "Cadence Verification IP Significantly Reduces Verification Turnaround Time for ARM AMBA 4 Protocols"

IBM Rational Rhapsody and LDRA tool suite streamline model to verification process

Wirral, UK. October 25, 2012 – LDRA, the leading provider of automated software verification, source code analysis and test tools, has fully integrated the LDRA tool suite® with IBM® Rational® Rhapsody® ensuring a seamless workflow from model-driven development to test and verification. IBM Rational Rhapsody, a UML-based modeling and code-generation tool, speeds the design of complex systems that often must meet industry certification standards.

Read More → "IBM Rational Rhapsody and LDRA tool suite streamline model to verification process"

Poly-Platform 2.0 now available for Texas Instruments’ TMS320C6678

BURLINGAME, CA (October 25, 2012) — PolyCore Software, Inc. (PSI), leader in multicore software development solutions, today announced that Version 2.0 of its Poly-Platform&#153 multicore software platform, is available for Texas Instruments Incorporated (TI) TMS320C6678 digital signal processor (DSP), based on the KeyStone multicore architecture. Poly-Platform is a bundle of productivity tools and runtime communications engine that simplifies the process of migrating to and developing applications for multicore platforms. With version 2.0, users have enhanced memory organization and increased functionality to take full advantage of the performance capabilities of TI’s multicore DSPs.

Applications can be streamlined … Read More → "Poly-Platform 2.0 now available for Texas Instruments’ TMS320C6678"

Ericsson Reveals Ability of Dynamic-Bus-Voltage Architecture to Save Power in Datacenters

  • Advanced board-power-consumption monitoring and control technologies enable significant energy savings, between 3 and 10 percent at board level
  • FRIDA II platform Advanced Bus Converters offer high efficiency and optimized mode of operation to adjust bus voltage for low- and high-traffic scenarios
  • BMR456-DBV and BMR457-DBV only products in their category able to deliver voltages as low as 4V to power Sleep Mode

A long-term pioneer in delivering leading-edge digital power solutions to reduce board power consumption, … Read More → "Ericsson Reveals Ability of Dynamic-Bus-Voltage Architecture to Save Power in Datacenters"

Breker Verification Systems Adds Support for Multi-Processor SoCs

MOUNTAIN VIEW, CALIF. –– October 24, 2012 –– Breker Verification Systems, the system-on-chip (SoC) Verification Company, today announced that the latest release of its TrekSoC™ software supports SoC designs that include multiple heterogeneous embedded processors.

TrekSoC automatically generates self-verifying C test cases that run on the SoC’s processors in a fully synchronized manner for faster and more thorough verification. Its test cases exercise a wide range of functional scenarios, ensuring that the SoC can support the necessary concurrency, system-level and software functionality while meeting performance requirements.

< … Read More → "Breker Verification Systems Adds Support for Multi-Processor SoCs"

Agilent Technologies to Demonstrate Newest 3-D EM Software Release at European Microwave Week

SANTA CLARA, Calif., Oct. 23, 2012 – Agilent Technologies Inc. (NYSE: A) today announced that EMPro 2012 will be demonstrated at European Microwave Week (Booth 114), Oct. 29-Nov. 1, RAI, Amsterdam.

EMPro 2012 makes it easier for designers to create 3-D models and analyze the electrical performance of packages, connectors, antennas, and other RF and high-speed components. During European Microwave Week, attendees will get a closer look at … Read More → "Agilent Technologies to Demonstrate Newest 3-D EM Software Release at European Microwave Week"

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