News – Page 1673 – EEJournal

Demonstration of world’s first wearable 3D body motion tracking system based on consumer grade MEMS sensors at International CES

December 21, 2012

Enschede, the Netherlands – December 21^th 2012 – Xsens, the leading innovator in 3D motion tracking technology and products, will demonstrate the world’s first wearable 3D body motion tracking system based on consumer grade MEMS combo sensors at the 2013 International CES in Las Vegas, USA.

As part of a broader strategy, Xsens now offers IP originally developed for professional (B2B) applications of 3D body motion tracking using wearable motion trackers for mass market application in the … Read More → "Demonstration of world’s first wearable 3D body motion tracking system based on consumer grade MEMS sensors at International CES"

MEMS Is Changing The Game – Plus The Tablet, Handset And Future Of Consumer Electronics

December 21, 2012

PITTSBURGH—December 18, 2012—MEMS Industry Group (MIG), a global industry organization with close to 150 member-companies and partners, today announced a line-up of suppliers, partners and end-user companies, all participating in MEMS TechZone, its show-floor experience at the 2013 International CES.

Micro-electromechanical systems (MEMS) are pervasive in smartphones, tablets, game controllers, notebooks, and other popular consumer electronics. From tiny inertial sensors that ‘translate’ motion into the digital realm, miniature microphones that improve voice input and speech … Read More → "MEMS Is Changing The Game – Plus The Tablet, Handset And Future Of Consumer Electronics"

Xilinx Vivado Design Suite Now Available in WebPACK Edition

December 21, 2012

SAN JOSE, Calif., Dec. 19, 2012 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced its Vivado™ Design Suite is now available in WebPACK Edition, giving designers immediate access to a no cost, device-limited version of the industry’s first SoC strength design environment. Offered with the 2012.4 release of the Vivado Design Suite, WebPACK Edition provides the same IP and system-centric design flows of the Vivado Design Suite Design edition that enables up to 4x faster time to integration and implementation … Read More → "Xilinx Vivado Design Suite Now Available in WebPACK Edition"

Cypress Integrates Ramtron F-RAM Offerings Creating World’s Broadest Fast-Write Nonvolatile Memory Portfolio

December 21, 2012

SAN JOSE, Calif., December 20, 2012 – Cypress Semiconductor Corp. (Nasdaq: CY) today announced that it has integrated Ramtron International’s ferroelectric random access memory (F-RAM) products into its portfolio, offering the market’s widest range of densities for fast-write nonvolatile memories. F-RAM is the industry’s lowest-power nonvolatile memory, complementing Cypress’s nonvolatile static random access memories (nvSRAMs), which are the world’s fastest. This new combination serves a broad range of applications that require data to be retained when power is lost. Combined, over a billion units of … Read More → "Cypress Integrates Ramtron F-RAM Offerings Creating World’s Broadest Fast-Write Nonvolatile Memory Portfolio"

GreenPeak launches GP410 – ZigBee PRO Green Power chip

December 21, 2012

21 December 2012 – Utrecht – The Netherlands – GreenPeak Technologies, a leading Smart Home RF-communication semiconductor company, today announced its new GP410 chip offering the new ZigBee PRO Green Power feature for low cost energy harvesting and ultra-long battery life ZigBee applications for the Smart Home.

The GP410 IEEE 802.15.4 ZigBee PRO Green Power controller is a fully integrated system-on-chip solution for power harvesting end nodes for light switches, smart home devices, or for applications designed to run on a single battery for … Read More → "GreenPeak launches GP410 – ZigBee PRO Green Power chip"

Mentor Graphics Enables Smart Device Development for M2M Applications with Support for Zero Configuration Networking

December 20, 2012

WILSONVILLE, Ore., December 20, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced a solution to design network-based devices for machine-to-machine (M2M) and smart energy applications with the latest release of the Mentor® Embedded Nucleus® Real Time Operating System (RTOS) platform. Embedded developers can design auto configuring network devices for environments without supporting infrastructure, such as network servers, with the addition of mDNS and DNS-Service Discovery (SD) support to the Nucleus RTOS.

Devices can connect to the network automatically without network servers or manual configuration by using the Nucleus RTOS networking middleware which manages IP address … Read More → "Mentor Graphics Enables Smart Device Development for M2M Applications with Support for Zero Configuration Networking"

Plessey to Demonstrate Ground-breaking imPart™ Contactless Gesture Recognition Technology at CES 2013, Las Vegas, 8-11 January 2013

December 20, 2012

Plymouth, ENGLAND – 20 December 2012 – Plessey announced today that they will be demonstrating their new, low cost, Contactless Gesture Recognition technology called imPart™ at CES 2013. The imPart technology is designed to fit around computer monitors, portable laptop computers, ultra books and tablets and provides the user with the ability to activate and use devices, without having to touch them, via gestures such as swipe, flick, up and down. A simple ‘left-click’ function has been incorporated by hovering the hand at any required point for more than 0.5s.

It uses Plessey’s award-winning EPIC™ sensors, which … Read More → "Plessey to Demonstrate Ground-breaking imPart™ Contactless Gesture Recognition Technology at CES 2013, Las Vegas, 8-11 January 2013"

Samsung and Synopsys Collaborate to Achieve First 14-nanometer FinFET Tapeout

December 20, 2012

MOUNTAIN VIEW, Calif., Dec. 20, 2012 /PRNewswire/ —

Highlights:

Milestone helps accelerate adoption of FinFET technology for faster and more power efficient Systems on Chips (SoC)s
Collaboration delivers foundation for 3D device modeling and physical design rule support
Test chip qualifies FinFET process and Synopsys^® DesignWare^® Embedded Memories

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that its multi-year collaboration with Samsung on FinFET technology has … Read More → "Samsung and Synopsys Collaborate to Achieve First 14-nanometer FinFET Tapeout"

Kuwait University and imec to Collaborate on Advanced Silicon Solar Cell Technology

December 19, 2012

December 19, 2012 (Leuven, Kuwait) – World-leading nanotechnology research centre imec (Belgium) and Kuwait University signed a long term collaboration agreement for research and development on innovative silicon solar cell technologies. The agreement has been signed on Wednesday, Dec.19, 2012, in Kuwait City during a ceremony in the presence of the Belgian Minister of Foreign Affairs and Foreign Trade Deputy-Prime Minister, Didier Reynders, and Kuwait University President, Prof. Abdullatif Al-Bader, and Director General of Kuwait Foundation for Advancement of Sciences, Dr. Adnan Shihab-Eldin.

The basis of the collaboration between imec and Kuwait University is imec’s wafer-based silicon solar cell industrial … Read More → "Kuwait University and imec to Collaborate on Advanced Silicon Solar Cell Technology"

GreenPeak facilitates Green Power

December 19, 2012

19 December 2012 – Utrecht – The Netherlands – GreenPeak Technologies, a leading Smart Home RF-communication semiconductor company, today announced its support for the ZigBee PRO Green Power feature, which adds support for energy harvesting and battery-free applications as part of the ZigBee 2012 standard. GreenPeak also announces achieving ZigBee Certified and Golden Unit status for its Green Power product.

Green Power is the newest feature for the ZigBee PRO feature set. Green Power gives battery-free, energy-harvesting devices the ability to join ZigBee PRO 2012 … Read More → "GreenPeak facilitates Green Power"

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