News – Page 1672 – EEJournal

Real Intent Unveils New Release of Ascent Lint for Early Verification of Digital Designs

May 28, 2014

SUNNYVALE, Calif. – May 22, 2014 – Real Intent, Inc., a leading provider of EDA software products today announced the 2014 version of its Ascent Lint product, the industry’s fastest and most accurate tool for early verification of digital designs, with significant new enhancements for users. In addition it announced the tight integration of Ascent Lint within MATLAB® and Simulink®, the market-leading technical computing software from Read More → "Real Intent Unveils New Release of Ascent Lint for Early Verification of Digital Designs"

2kVAC Isolated 1.5W Low Noise µModule Converters in 9mm x 11.25mm x 4.92mm BGA Package Are UL60950 Recognized

May 28, 2014

MILPITAS, CA – May 28, 2014 – Linear Technology Corporation introduces the LTM8057 and Read More → "2kVAC Isolated 1.5W Low Noise µModule Converters in 9mm x 11.25mm x 4.92mm BGA Package Are UL60950 Recognized"

eSilicon adds GDSII handoff to suite of online SoC automation tools

May 27, 2014

SAN JOSE, Calif. — May 23, 2014 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the expansion of its online automation suite with the addition of a GDSII portal that allows eSilicon to provide rapid, automated quoting for TSMC foundry technologies. eSilicon will demonstrate this capability at the 51^st Design Automation Conference (DAC), to be held at the Moscone Convention Center in San Francisco, California from June 2 to June 4, 2014.

Building on the successful introduction of its … Read More → "eSilicon adds GDSII handoff to suite of online SoC automation tools"

Fast-charge wireless power receivers cut power loss by 50 percent

May 27, 2014

DALLAS (May 27, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s most power-efficient 5-watt wireless power receivers that support the Wireless Power Consortium (WPC) Qi 1.1 standard. TI’s new bq51020 and bq51021 allow consumers to charge their Qi-compliant mobile phones, tablets, power banks and other electronics faster, cooler and more efficiently compared to other available wireless power solutions. To order samples and a development kit, visit: www.ti.com/bq51021-pr.

Available to ship in … Read More → "Fast-charge wireless power receivers cut power loss by 50 percent"

Cadence Offers Production Proven USB 3.0 Host Controller IP

May 27, 2014

SAN JOSE, Calif, May 27, 2014–Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that a production proven host controller intellectual property (IP) for USB 3.0 has been added to the Cadence IP offering. The Cadence® USB 3.0 xHCI host controller IP was originally developed by Fresco Logic, a global fabless semiconductor company that develops and markets advanced connectivity solutions. This design IP is used as part of a recommended Peripheral Development Kit (PDK) for compliance testing by the USB Implementers Forum (USB-IF) … Read More → "Cadence Offers Production Proven USB 3.0 Host Controller IP"

Ericsson Power Modules new hybrid regulated ratio quarter-brick delivers up to 600W in powering advanced telecoms applications

May 27, 2014

600W in an industry-standard quarter-brick delivers 43% more available power than conventional modules to power 36V to 75V applications
Tightly regulated output voltage guarantees operation in case of line disturbance
2250Vdc isolation makes PKM4613NH best choice for a large range of ICT and industrial applications
Intelligent soft-start handles high capacitances load and complex configuration mixing a large number of hold-up capacitors

Ericsson has introduced the third version of its high-power-density quarter-brick power module based on the company’s innovative Hybrid Regulated Ratio (HRR) topology. The PKM4613NH is … Read More → "Ericsson Power Modules new hybrid regulated ratio quarter-brick delivers up to 600W in powering advanced telecoms applications"

Sabic Collaborates with Cima NanoTech on Breakthrough Technology: Industry-First Transparent Conductive Polycarbonate Film

May 27, 2014

With smart materials being one of the fastest growing areas of materials technology, SABIC and Cima NanoTech have announced the joint development of a plastics industry first: a transparent conductive polycarbonate film that has the potential to revolutionize the materials used in consumer electronics, household goods, automotive, architecture and healthcare.

The new material, designed to provide “next generation” functionality, has the potential to further enhance performance, enable new innovative applications and open doors for new product designs. This could translate into faster response touch screens for consumer electronics, transparent “no-line” anti-fogging capabilities for automotive windows, better EMI … Read More → "Sabic Collaborates with Cima NanoTech on Breakthrough Technology: Industry-First Transparent Conductive Polycarbonate Film"

Synopsys and TSMC Collaborate to Validate DesignWare IP in TSMC 16-nm FinFET Process

May 27, 2014

MOUNTAIN VIEW, Calif., May 27, 2014 /PRNewswire/ —

Highlights:

Validated IP in TSMC 16-nm FinFET process accelerates 16-nm FinFET Plus (16FF+) IP development and reduces SoC integration risk
Portfolio of IP under development for TSMC 16FF+ process includes DesignWare Interface, Logic Library and Embedded Memory IP
TSMC 16-nm FinFET and 16FF+ processes significantly improve performance and lower power compared to planar technologies

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to … Read More → "Synopsys and TSMC Collaborate to Validate DesignWare IP in TSMC 16-nm FinFET Process"

Synopsys Unveils Industry’s First Complete PCI Express 4.0 IP Solution

May 26, 2014

MOUNTAIN VIEW, Calif., May 22, 2014 /PRNewswire/ —

Highlights:

Industry’s first complete PCI Express® 4.0 IP solution, supporting the latest PCI Express 4.0 standard, will be featured on June 4^th at the PCI-SIG® Developers Conference 2014 in Santa Clara, Calif.
Synopsys DesignWare® Controller IP for PCI Express 4.0 architecture provides port logic for endpoints, root complex, dual mode (endpoint/root complex) and switch applications with minimized latency, gate count and power consumption
Verification IP for PCI Express 4.0 architecture will verify PCI Express endpoints, switch and root complex devices with software/ … Read More → "Synopsys Unveils Industry’s First Complete PCI Express 4.0 IP Solution"

Avnet Electronics Marketing Americas Distributes Samsung Electro-Mechanics’ Haptic Motors

May 26, 2014

PHOENIX—May 22, 2014—Avnet Electronics Marketing Americas, a business region of Read More → "Avnet Electronics Marketing Americas Distributes Samsung Electro-Mechanics’ Haptic Motors"