News – Page 1644 – EEJournal

4DSP Brings Versatility and PCI Express Performance to VPX with FlexVPX

May 15, 2014

May 15, 2014 – AUSTIN, TX – 4DSP’s FlexVPX provides system designers with the flexibility and performance required for the most demanding applications. The ability to interconnect 2 and 3-slot 3U VPX compliant backplanes allows for custom system configurations using COTS hardware. The backplanes are equipped with PCI Express bridges that ensure fast and high throughput for point-to-point communication between different elements in the system. FlexVPX utilizes OpenVPX (VITA 65) which enables the interoperability of products from different vendors. With the option to build multi-slot solutions, users have the opportunity to design a range of systems that feature a small footprint, a high level … Read More → "4DSP Brings Versatility and PCI Express Performance to VPX with FlexVPX"

Monitor and Gather Smart Electricity Distribution Data Faster and More Accurately with Real-Time Measurements

May 14, 2014

San Jose, CA—May 14, 2014—Utilities and infrastructure providers can now simultaneously and accurately measure distributed power grid data with Petaluma, (MAXREFDES30#), a subsystem reference design from Maxim Integrated Products, Inc. (NASDAQ: MXIM).

Utility organizations worldwide are deploying more robust applications that require highly accurate distributed grid status data to leverage distributed generation technologies such as solar and wind power. Voltage and current measurements must be gathered simultaneously for all lines, so the … Read More → "Monitor and Gather Smart Electricity Distribution Data Faster and More Accurately with Real-Time Measurements"

Element Six’s GaN-on-Diamond Wafers Proven by Raytheon to provide 3x improvement in power density vs GaN-on-SiC for RF Devices

May 14, 2014

14 May, 2014—Element Six, the world leader in synthetic diamond supermaterials and a member of the De Beers Group of Companies, today announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Company to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices—reducing thermal resistance, increasing RF power density, and preserving RF functionality.

In high electron mobility transistor (HEMT) devices, Raytheon achieved a 3 times improvement in GaN-on-Diamond’s RF areal power … Read More → "Element Six’s GaN-on-Diamond Wafers Proven by Raytheon to provide 3x improvement in power density vs GaN-on-SiC for RF Devices"

New Data Processing Board Offered By VadaTech Features High Performance and Low Latency

May 14, 2014

Henderson, NV – May 13, 2014 – VadaTech, a manufacturer of embedded boards and complete application-ready platforms, now offers a new data processor that meets the MicroTCA.4 specification with a rear I/O interface. The board is ideal for several High Energy Physics applications such as cavity field stabilization and standing-wave linear accelerators, as well as other systems requiring high speeds DSPs and low latency.

The CM045 data processing AMC comes in the double module, mid-size format. It features a high-performance Kintex-7 FPGA with x4 PCI Gen 3 signaling across the fat pipes. The module provides processing power, data memory, communication links, … Read More → "New Data Processing Board Offered By VadaTech Features High Performance and Low Latency"

Xilinx Ships First Virtex UltraScale FPGA and Expands Industry’s Only 20nm High-End Family for 500G on a Single Chip

May 14, 2014

SAN JOSE, Calif., May 13, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced the first customer shipment of the Virtex® UltraScale™ VU095 All Programmable FPGA, and the expansion of the industry’s only 20nm high-end family to enable single chip implementation of 400G and 500G applications. The Virtex UltraScale VU095 device provides unprecedented levels of performance, system integration, and bandwidth for a wide range of applications, such as wired communication, test and measurement, aerospace and defense, and data center. Xilinx also added the VU190 … Read More → "Xilinx Ships First Virtex UltraScale FPGA and Expands Industry’s Only 20nm High-End Family for 500G on a Single Chip"

Leti MEMS Technology Part of Micro-needle Injection Device that Is Nominated for Medical Design Excellence Award

May 14, 2014

GRENOBLE, France – May 14, 2014 – A team comprised of CEA-Leti, Debiotech SA, the Swedish Royal Institute of Technology (KTH) and Mecaplast SA is a finalist in the 2014 Medical Design Excellence Awards. They are nominated for a MEMS-based micro-needle that allows pain-free and precise injection of up to 0.5ml of vaccines and other medications in a few seconds.

The innovative Read More → "Leti MEMS Technology Part of Micro-needle Injection Device that Is Nominated for Medical Design Excellence Award"

Thursday is Training Day at the 51st Design Automation Conference

May 14, 2014

LOUISVILLE, Colo. –– May 14, 2014 –– The Design Automation Conference (DAC), the premier conference devoted to the design and automation of electronic systems, will feature a day of training providing engineers with the latest techniques required for today’s designs. Four tracks of training will be held on Thursday, June 5^th, 2014. DAC 2014 will be held at Moscone Center in San Francisco, Calif. from June 1-5, 2014. Conference registration is now open.

Each track of training comprises two separate half day sessions, in the morning from 9:00am to 12:30pm, and in … Read More → "Thursday is Training Day at the 51st Design Automation Conference"

FlexTech Alliance, Cal Poly Complete Screen Printing Study for Printed Electronics Applications

May 14, 2014

San Jose, Calif. (May 14, 2014) – The FlexTech Alliance today announced the completion of a two-year, $40,000 study to explore the capabilities of screen printing electronics with the Graphic Communication Department at the California Polytechnic State University at San Luis Obispo (Cal Poly). The partnership, which was launched in late 2012, investigated low viscosity inks to produce thin ink films and fine features with the intent to help the printing industry better understand and adopt printed electronics technologies.

The study, which was titled “Characterizations of Screen Printing Low Viscosity Ink, Thin … Read More → "FlexTech Alliance, Cal Poly Complete Screen Printing Study for Printed Electronics Applications"

Next-generation automotive LED drivers for front and rear lights bring reliability and flexibility to exterior lighting

May 14, 2014

DALLAS (May 14, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the automotive industry’s first two-channel switching LED driver for front lights and the only linear LED driver with single short LED detection for rear lights. Unlike other LED drivers in the market, the TPS92630-Q1 and TPS92602-Q1 feature both high-side current sense dimming and pulse width modulation (PWM) dimming capabilities, as well as full diagnostic and thermal management, which helps designers create flexible lighting systems that meet many countries’ differing traffic regulations. Applications include automotive LED front lamp, rear lamp and interior lighting. For more information or to … Read More → "Next-generation automotive LED drivers for front and rear lights bring reliability and flexibility to exterior lighting"

Applied Materials Introduces the Biggest Materials Change to Interconnect Technology in 15 Years

May 14, 2014

New Endura^® Volta (TM)CVD system’s unique cobalt processes ease interconnect bottlenecks to enable continued Moore’s Law scaling
Two breakthrough interconnect applications designed to support future generations of high-performance, low-power microchips
Industry’s first selective CVD metal process demonstrates Applied’s leadership in precision materials engineering

SANTA CLARA, Calif., May 13, 2014 – Applied Materials, Inc. today announced its Applied Endura^® Volta(TM) CVD Cobalt system, the … Read More → "Applied Materials Introduces the Biggest Materials Change to Interconnect Technology in 15 Years"

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