industry news
Subscribe Now

Element Six’s GaN-on-Diamond Wafers Proven by Raytheon to provide 3x improvement in power density vs GaN-on-SiC for RF Devices

14 May, 2014—Element Six, the world leader in synthetic diamond supermaterials and a member of the De Beers Group of Companies, today announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Company to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices—reducing thermal resistance, increasing RF power density, and preserving RF functionality.

In high electron mobility transistor (HEMT) devices, Raytheon achieved a 3 times improvement in GaN-on-Diamond’s RF areal power density, compared to GaN-on-SiC devices. The GaN-on-Diamond devices also demonstrated a nearly 3 times reduction in thermal resistance. Raytheon used several industry standard thermal measurement techniques, including time-domain thermal reflectance (TDTR), laser flash, and resistance thermometry, as well as finite-element modeling, to establish the consistency of these results.

Upon reaching these milestones, Raytheon has met the aggressive objectives of the Defense Advanced Research Project Agency’s (DARPA) Near Junction Thermal Transport (NJTT) program, which aimed to develop GaN RF devices that exhibit three times or greater improvement in power density through improved thermal management.

GaN-on-Diamond substrates, fabricated by Element Six, exhibit a clear advantage over other substrate materials because synthetic diamond dissipates heat up to five times more effectively than silicon or silicon carbide. This dissipation advantage, coupled with the close proximity of the diamond to the GaN results in a dramatic reduction in the thermal resistance of GaN-on-Diamond wafers.  Lower thermal resistance enables simpler and less expensive thermal management systems and reliable operation in higher ambient temperatures, as well as more cost-effective RF devices.

“Heat issues account for more than 50 percent of all electronic failures, and limit GaN’s inherent power-density performance potential,” said Adrian Wilson, director of Element Six Technologies Group. “RF and high-voltage power device manufacturers that leverage GaN-on-Diamond will have access to unmatched wafer thermal conductivity, and be able to deliver rapid, efficient and cost-effective heat extraction. As the first company to make GaN-on-Diamond wafers commercially available, we look forward to collaborating with manufacturers to tap into the unique properties of synthetic diamond.”
  
Having been designed for manufacturers of transistor-based circuits with high power, high voltage, and high frequency characteristics, Element Six’s GaN-on-Diamond wafers will lead to the creation of smaller, faster, more energy efficient, and higher power electronic devices that enjoy longer lifespans and improved reliability. GaN-on-Diamond technology offers revolutionary advantages over all other available RF semiconductor materials, delivering superior system performance and cost, which makes it ideal for next generation device technology in both defense and commercial applications.

To learn more about GaN-on-Diamond wafers for advanced defense or commercial applications, please visit www.e6.com/GaN

About Element Six

Element Six is a synthetic diamond supermaterials company. Element Six is a member of The De Beers Group of Companies, its majority shareholder. Element Six designs, develops and produces synthetic diamond supermaterials, and operates worldwide with its head office registered in Luxembourg, and primary manufacturing facilities in China, Germany, Ireland, Sweden, South Africa, U.S. and the U.K.

Element Six supermaterial solutions are used in applications such as cutting, grinding, drilling, shearing and polishing, while the extreme properties of synthetic diamond beyond hardness are already opening up new applications in a wide array of industries such as optics, power transmission, water treatment, semiconductors and sensors.

Leave a Reply

featured blogs
May 12, 2021
The ICADVM20.1 ISR18 and IC6.1.8 ISR18 production releases are now available for download at Cadence Downloads . For information on supported platforms and other release compatibility information,... [[ Click on the title to access the full blog on the Cadence Community site...
May 11, 2021
Human vision in indispensable and often taken for granted. Similarly machine, or embedded, vision influences daily human life in ways thought impossible. Simply, machine vision refers to the ability of embedded systems to “see”. Key system components include camer...
May 6, 2021
Learn how correct-by-construction coding enables a more productive chip design process, as new code review tools address bugs early in the design process. The post Find Bugs Earlier Via On-the-Fly Code Checking for Productive Chip Design and Verification appeared first on Fr...
May 4, 2021
What a difference a year can make! Oh, we're not referring to that virus that… The post Realize Live + U2U: Side by Side appeared first on Design with Calibre....

featured video

Insights on StarRC Standalone Netlist Reducer

Sponsored by Synopsys

With the ever-growing size of extracted netlists, parasitic optimization is key to achieve practical simulation run times. Key trade-off for any netlist reducer is accuracy vs netlist size. StarRC Standalone Netlist reducer provides the flexibility to optimize your netlist on a per net basis. The user has total control of trading accuracy of some nets versus netlist optimization - yet another feature from StarRC to provide flexibility to the designer.

Click here for more information

featured paper

Keys to quick success using high-speed data converters

Sponsored by Texas Instruments

Hardware designers using modern high-speed data converters face tough challenges. Issues might include connecting with your field-programmable gate array (FPGAs), being confident that your first design pass will work, or determining how to best model the system before building it. In this article, Texas Instruments takes a closer look at each of these challenges.

Click to read more

featured chalk talk

How Trinamic's Stepper Motor Technologies Improve Your Application

Sponsored by Mouser Electronics and Maxim Integrated

Stepper motor control has come a long way in the past few years. New techniques can give greater control, smoother operation, greater torque, and better efficiency. In this episode of Chalk Talk, Amelia Dalton chats with Lars Jaskulski about Trinamic stepper solutions and how to take advantage of micro stepping, load measurement, and more.