News – Page 1497 – EEJournal

ams delivers industry’s first sensor module to integrate universal remote control, barcode emulation, color sensing, proximity and 3D gesture detection

July 20, 2015

Unterpremstaetten, Austria (20 July, 2015), ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, launched today a new series of advanced optical sensing modules, the TMx4903, integrating multiple functions including universal remote control, barcode emulation, RGB color sensing, proximity and 3D gesture detection in a low-profile 5.0×2.0x1.0mm package.

The high level of integration in the TMx4903 modules reduce board space requirements and lowers bill of material (BOM) cost while delivering exciting new capabilities required by today’s smartphones. By integrating multiple optical sensing functions, and an IR LED in a module, the TMx4903 … Read More → "ams delivers industry’s first sensor module to integrate universal remote control, barcode emulation, color sensing, proximity and 3D gesture detection"

New Waveguide Detectors Covering Frequency Ranges from 26.5 to 110 GHz Released by Pasternack

July 20, 2015

Irvine, CA – Pasternack, a leading manufacturer and supplier of RF, microwave and millimeter wave products, rolls out a brand new collection of high performance zero biased waveguide detectors that exhibit optimum performance in Ka, Q, U, V, E and W frequency bands. These waveguide detectors are widely deployed in various aerospace, defense and commercial wireless applications used in instrumentation, power detection, power monitoring, direct detection receivers, high frequency communications, radar, SATCOM, point-to-point radio, telecom, data links and R&D.

Pasternack’s latest release of waveguide detectors consists of 6 unique models covering a broad … Read More → "New Waveguide Detectors Covering Frequency Ranges from 26.5 to 110 GHz Released by Pasternack"

UltraSoC and Cadence’s Tensilica Division collaborate to deliver universal debug for heterogeneous multicore SoCs

July 20, 2015

CAMBRIDGE, United Kingdom, and SAN JOSE, CA, 20th July 2015 — UltraSoC and Cadence Design Systems, Inc. (NASDAQ:CDNS) today announced that they have collaborated to provide support for the Cadence® Tensilica® Xtensa® family of processors within UltraSoC’s UltraDebug® universal SoC debug solution.

Xtensa technology enables the system architect to create power-efficient, high-performance processors and DSPs customized to the exact needs of their design. This, in turn, allows the creation … Read More → "UltraSoC and Cadence’s Tensilica Division collaborate to deliver universal debug for heterogeneous multicore SoCs"

NXP Introduces Industry’s First Secure Total USB Type-C Solution

July 17, 2015

Eindhoven, Netherlands, July 14, 2015 –– NXP Semiconductors N.V. (NASDAQ: NXPI) today unveiled the industry’s most complete USB Type-C solution, including authentication and power delivery capabilities to further deliver secure connections for a smarter world. The authentication capabilities can be used to validate a device and determine whether specific functionality of that device should be enabled. This will maximize battery life and could prevent safety hazards or equipment damage from low quality materials or non-compliant products. For example, detecting counterfeit power supplies before they are used for rapid charging functions.

“We are excited to sample the industry’s … Read More → "NXP Introduces Industry’s First Secure Total USB Type-C Solution"

Amplicon introduces 4th generation Ventrix and Impact-R rackmount industrial PCs

July 17, 2015

Brighton, UK, 17^th July 2015 – Amplicon proudly introduce the amazing power of the Intel® Core™ 4^th generation processor family, unleashing incredible processing power with low power consumption, lower thermal characteristics, and rich I/O.

The introduction of the Haswell architecture signals further advancements and capabilities from predecessors; lower power consumption, greater numbers of USB 3.0 and SATA III channels and iAMT revision 9.

Haswell processors follow the well-known Intel® ‘tick tock’ format, in this case, Haswell brings in new microarchitecture on an already 22nm die.

The Impact-R and Ventrix offer great solutions … Read More → "Amplicon introduces 4th generation Ventrix and Impact-R rackmount industrial PCs"

Renesas Electronics Delivers Bluetooth® Smart Wireless Solution to Accelerate Use of Embedded Devices in IoT Applications

July 17, 2015

Düsseldorf, July 17, 2015 – Renesas Electronics, a premier provider of advanced semiconductor solutions, today announced a new wireless solution that supports the Bluetooth® Smart near field wireless communication standard. The new RL78/G1D Group of microcontrollers (MCUs) has been developed by combining the low-power RF Transceiver Technology for Bluetooth® Low Energy (BLE), which the company presented at the International Solid-State Circuits Conference (ISSCC) held in February, 2015, with Renesas’ expertise on consumer and industrial MCUs, and on-chip peripheral devices necessary for wireless communication. By employing an evaluation kit and Bluetooth-SIG qualified … Read More → "Renesas Electronics Delivers Bluetooth® Smart Wireless Solution to Accelerate Use of Embedded Devices in IoT Applications"

Water and Dust Resistant Test and Measurement Microphone

July 16, 2015

July 15, 2015, Depew, New York – A new 1/2″ (12mm) microphone and preamplifier system, model 130A24, is available from PCB Piezotronics, Inc. This array microphone is for use in applications where moisture, oil splash and contamination are a concern. Typical applications include brake and tire noise, industrial machinery noise, environmental noise, leak detection and general purpose acoustic tests. The phase characteristics of this microphone are tailored for noise source location applications such as holography, beamforming, acoustic cameras and sound pressure mapping.

Model 130A24 has a replaceable water and dust resistant cover. This acoustically transparent protective cover provides an unobtrusive … Read More → "Water and Dust Resistant Test and Measurement Microphone"

congatec launches COM Express Basic module with 14nm Intel® Xeon® processors and Intel® Iris™ Pro graphics

July 16, 2015

San Diego, California, July 14, 2015 * * * congatec, Inc., a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, announced the latest addition to its COM Express Basic portfolio: the new conga-TS97 computer module with either Intel® Core™ or Intel® Xeon® processors (codename Broadwell) manufactured in 14nm technology. The new conga-TS97 COM Express Basic module in the Intel® Xeon® version delivers server-grade performance for the first time and, compared to its predecessors, excels not only with its overall performance but particularly in terms of graphics due to the featured Intel® Iris™ Pro technology. … Read More → "congatec launches COM Express Basic module with 14nm Intel® Xeon® processors and Intel® Iris™ Pro graphics"

Xilinx Joins the Industrial Internet Consortium to Collaborate and Drive Common Architectures and Frameworks within the Industrial IoT

July 16, 2015

SAN JOSE, Calif., July 15, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) announced today that it has joined the Industrial Internet Consortium (IIC) to collaborate and drive common architectures and frameworks within the Industrial IoT (IIoT). Xilinx’s All Programmable, standards-based solutions combine software programmability, real-time processing, hardware optimization, and any-to-any connectivity with security and safety required by IIoT systems. The Industrial Internet Consortium was founded in 2014 by AT&T, Cisco, General Electric, IBM, and Intel to catalyze and coordinate the priorities and enabling … Read More → "Xilinx Joins the Industrial Internet Consortium to Collaborate and Drive Common Architectures and Frameworks within the Industrial IoT"

Power-Management IC from STMicroelectronics Selected by Kingston for its HyperX® Savage Solid-State Drive

July 16, 2015

Taipei, Taiwan, July 16, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced its 5-channel power-management IC (L7292) has been selected byKingston Technology Company, Inc., the independent world leader in memory products, for its enthusiast-class HyperX Savage solid-state drive (SSD). Compared with designs using low drop-out regulators (LDO) or other multi-channel power-management ICs, ST’s L7292 offers the highest … Read More → "Power-Management IC from STMicroelectronics Selected by Kingston for its HyperX® Savage Solid-State Drive"

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