News – Page 1495 – EEJournal

New Multifunction High-Speed USB Module Provides Optimized Digital I/O for Economical Digital Control and Monitoring

July 22, 2015

July 22, 2015—SAN DIEGO, CA — ACCES I/O Products, Inc. reveals its newest USB digital I/O module—Model USB-DIO24-CTR6. This multifunction, high speed USB device is an ideal solution for adding portable, easy-to-install, industrial strength digital I/O and counter capabilities to any PC or embedded system with a USB port. An ideal choice for embedded system and test designers, the USB-DIO24-CTR6 can be used in an assortment of USB-based embedded applications including light, motion, and process controls.

The USB-DIO24-CTR6 features 24 lines of CMOS/LVTTL high-current digital I/O with two fully-undedicated 82C54’s, … Read More → "New Multifunction High-Speed USB Module Provides Optimized Digital I/O for Economical Digital Control and Monitoring"

Redpine Signals Announces Multi-Protocol Wireless Connectivity Support in Mini PCIe Form Factor for IoT Devices

July 22, 2015

NEWS HIGHLIGHTS

Support for Dual band 802.11n Wi-Fi®, Bluetooth® v2.1+EDR, dual-mode Bluetooth Smart (v4.0) and ZigBee® with Redpine’s RS9113 M2MCombo™ chipset
Worldwide module certification FCC/IC/CE/TELEC/SRRC
Wireless connectivity module provided in PCIe Mini Card form … Read More → "Redpine Signals Announces Multi-Protocol Wireless Connectivity Support in Mini PCIe Form Factor for IoT Devices"

Renesas Electronics Introduces 16- and 32-Megabit Advanced Low Power SRAMs with Over 500 Times the Resistance to Soft Errors Compared to Full CMOS Memory Cells

July 22, 2015

Düsseldorf, July 22, 2015 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the release of two new series of Advanced Low Power SRAM (Advanced LP SRAM), the leading type of low-power-consumption SRAM, designed to provide enhanced reliability and longer backup battery life for applications such as factory automation (FA), industrial equipment, and the smart grid. Fabricated using the 110-nanometer (nm) process, the new RMLV1616A Series of 16-megabit (Mb) devices and the RMWV3216A Series of 32 Mb devices feature an innovative memory cell technology that dramatically improves reliability … Read More → "Renesas Electronics Introduces 16- and 32-Megabit Advanced Low Power SRAMs with Over 500 Times the Resistance to Soft Errors Compared to Full CMOS Memory Cells"

World’s First Automotive-Qualified 2Mbit EEPROM from STMicroelectronics Helps Make Cars Greener and Safer

July 22, 2015

Geneva, July 15, 2015 – STMicroelectronics has introduced the industry’s first AEC-Q100-qualified 2Mbit EEPROM device extending the possibilities for parameter storage and management in complex automotive modules.

New advanced applications such as hybrid, electric, or high-power truck engines require extensive use of various parameters, including the information on air volume, fuel injection, exhaust, or battery charge, to maximize power-conversion efficiency for greener driving. Similarly, automotive-safety applications, such as event recording for airbag or body and braking controllers, increasingly rely on storing and processing large amounts of parametric inputs that include object detection, 3-axis motion, wheel speed, and steering … Read More → "World’s First Automotive-Qualified 2Mbit EEPROM from STMicroelectronics Helps Make Cars Greener and Safer"

Dual 2.5A, Single 5A Ultrathin µModule Regulator in 6.25mm x 6.25mm x 1.8mm LGA Package

July 22, 2015

MILPITAS, CA – July 22, 2015 – Linear Technology Corporation introduces the LTM4622, a dual 2.5A or single 5A step-down µModule^® (micromodule) regulator in a small and ultrathin package. Only three capacitors and two resistors are required, and the solution occupies less than 1cm² single-sided or 0.5mm² on a double-sided PCB. Housed in a 6.25m x 6.25mm x 1.82mm LGA package, the LTM4622 includes the switching … Read More → "Dual 2.5A, Single 5A Ultrathin µModule Regulator in 6.25mm x 6.25mm x 1.8mm LGA Package"

Embedded Security Made Easy: Protection from Product Piracy and IP Theft for Capital Equipment

July 21, 2015

Munich, Germany – July 20, 2015 – Industrial automation, medical equipment, electronic components – plagiarism of capital equipment requires effective prevention, such as embedded security solutions from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). According to the OECD, counterfeiting and piracy costs add up to around 638 billion US dollars annually. The new OPTIGA™ Trust E offers an easily implementable solution to protect manufacturers’ valuable IP from being attacked, analyzed, copied and modified. Enhanced authentication as well as secured storage of software codes and product data improve network and supply chain management – particularly in the context of Industry 4.0. And help manufacturers of high value goods … Read More → "Embedded Security Made Easy: Protection from Product Piracy and IP Theft for Capital Equipment"

Molex ML-XTTM Sealed Connection System Delivers Market-Leading Seal Technology for the Commercial Vehicle Market

July 21, 2015

LISLE, IL – July 21, 2015 – Molex Incorporated introduces its ML-XTä Sealed Connection System, a highly reliable, securely sealed solution that minimizes … Read More → "Molex ML-XTTM Sealed Connection System Delivers Market-Leading Seal Technology for the Commercial Vehicle Market"

Advanced WEBENCH® tools for expert power-supply designers

July 21, 2015

DALLAS (July 20, 2015) – Texas Instruments (TI) (NASDAQ: TXN) today unveiled a series of advanced tools in WEBENCH^® Power Designer that provide experienced engineers extensive design control, analysis and trouble-shooting capability to create complex power-supply designs. From control-loop compensation to simulation export, WEBENCH Power Designer now puts cutting-edge tools in the hands of expert design engineers to create power supplies for industrial, automotive and communications equipment. For more information or to start a design, visit Read More → "Advanced WEBENCH® tools for expert power-supply designers"

Xilinx Announces Vivado Design Suite Early Access Support for the 16nm UltraScale+ Portfolio

July 21, 2015

SAN JOSE, Calif., July 21, 2015 /PRNewswire/ — Xilinx, Inc. (NASDAQ:XLNX) today announced Vivado® Design Suite early access support for the 16nm UltraScale+™ portfolio, including Zynq® UltraScale+ and Kintex® UltraScale+ devices. The Vivado early access release has been co-optimized with the UltraScale+ ASIC-class programmable logic to exploit the full advantages of production UltraScale+ devices, leveraging the complete catalog of SmartCORE™ and LogiCORE™ IP.

Xilinx is also enabling software development for the Zynq UltraScale+ MPSoC family in the Xilinx Software Development Kit (SDK) … Read More → "Xilinx Announces Vivado Design Suite Early Access Support for the 16nm UltraScale+ Portfolio"

Green Hills Software and Luxoft Partner to Bring the Automotive HMI Design Tool Chain to a Wide Range of MCUs that Power Digital Instrument Clusters

July 21, 2015

SANTA CLARA, CA — July 21, 2015 — Embedded Systems Conference, Booth B — Green Hills Software, the largest independent software vendor for the Internet of Things, and Luxoft Holding, Inc (NYSE:LXFT), a leading provider of software development services and innovative IT solutions to a global client base, today announced the integration of Green Hills Software’s INTEGRITY® real-time operating system (RTOS) with Luxoft’s PopulusTM Suite HMI design tool chain. With the use of Green Hills Software’s MULTI® integrated development tool chain, this combination allows Populus to run … Read More → "Green Hills Software and Luxoft Partner to Bring the Automotive HMI Design Tool Chain to a Wide Range of MCUs that Power Digital Instrument Clusters"