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UltraSoC partners with Tortuga Pacific to advance global SoC debug and analytics market

July 27, 2015

CAMBRIDGE, United Kingdom, and SAN JOSE, CA, 27th July 2015 — UltraSoC and Tortuga Pacific today announced that they are partnering to develop the global SoC debug and embedded analytics market. Under the terms of the agreement, UltraSoC will use Tortuga’s revenue generation, strategic initiative and market-maker capabilities to bring its innovative UltraDebug® pre- and post-silicon debug … Read More → "UltraSoC partners with Tortuga Pacific to advance global SoC debug and analytics market"

42V Quad Synchronous Step-Down DC/DC Converter Delivers 93% Efficiency & Operates from 3V to 42V Inputs

July 27, 2015

MILPITAS, CA – July 27, 2015 – Linear Technology Corporation announces the LT8602, a 42V input capable, high efficiency quad output synchronous monolithic step-down switching regulator. Its quad channel design combines two high voltage 2.5A and 1.5A channels with two lower voltage 1.8A channels to provide four independent outputs, delivering voltages as low as 0.8V. Its synchronous rectification topology delivers up to 93% efficiency while Burst Mode® operation keeps quiescent current under 30µA (all channels) in no-load standby conditions, making it ideal for always-on systems. For noise-sensitive applications, the LT8602 utilizes its pulse-skipping mode to minimize switching noise and meet the CISPR25, Class 5 EMI … Read More → "42V Quad Synchronous Step-Down DC/DC Converter Delivers 93% Efficiency & Operates from 3V to 42V Inputs"

ADLINK to Offer New COM Express® Module with 14nm Intel® Xeon® Processor and Intel® Iris™ Pro Graphic

July 24, 2015

ADLINK Technology, a leading global provider of embedded and industrial cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), will offer its first COM Express® Basic Size Type 6 module incorporating the latest Intel® Xeon® E3-1200 processor and Intel® Core™ i7 processor (formerly codenamed “Broadwell”) with Intel® QM87 Chipset. Featuring improved graphics and processing performance compared to previous generation processors, the Read More → "ADLINK to Offer New COM Express® Module with 14nm Intel® Xeon® Processor and Intel® Iris™ Pro Graphic"

Applied Materials Introduces High-Performance ALD Technology for the 3D Era

July 24, 2015
  • Innovative Olympia(TM) system positions Applied at the forefront of ALD* technology
  • Unique architecture expands portfolio of high-quality ALD films, enables critical low-temperature processes without compromising productivity
  • Systems installed at leading chipmakers for multiple logic and memory device applications

SANTA CLARA, Calif., July 13, 2015 – Applied Materials, Inc. today unveiled the Applied Olympia(TM) ALD system featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.  … Read More → "Applied Materials Introduces High-Performance ALD Technology for the 3D Era"

CSR and SK Telecom Launch World’s First Smart Lighting Beacon with CSRmesh™

July 24, 2015

San Jose, California and Cambridge, UK –July 15, 2015 – CSR plc (LSE: CSR; NASDAQ: CSRE) today announced that its CSRmesh™ technology has been used by SK Telecom to enable the world’s first range of smart LED lightbulbs which also function as Bluetooth® Smart beacons networked together using CSRmesh. The intelligent CSRmesh lighting system will allow an almost unlimited number of smart lightbulbs to be simply controlled and networked together in-store while … Read More → "CSR and SK Telecom Launch World’s First Smart Lighting Beacon with CSRmesh™"

Mentor Graphics Announces Flowmaster with Enhanced Multi-Arm Tank Component and 1D Pipe Stress Links

July 23, 2015

WILSONVILLE, Ore., July 22, 2015—Mentor Graphics Corporation (NASDAQ: MENT) today announced the newest version of the Flowmaster® 1D computational fluid dynamics (CFD) software product for fast and accurate thermo-fluid systems design. The new Flowmaster solution features several key new and enhanced functionalities including an improved multi-arm tank component, and integration with complementary 1D pipe stress products such as CAESAR II and CAEPIPE for pipe fluid-force predictions. Overall product enhancements to usability and increases in physical modeling capabilities provide unparalleled accuracy and ease-of-use to the automotive, aerospace, power generation and gas turbine markets.

The enhanced usability … Read More → "Mentor Graphics Announces Flowmaster with Enhanced Multi-Arm Tank Component and 1D Pipe Stress Links"

Researchers Boost Wireless Power Transfer with Magnetic Field Enhancement

July 23, 2015

Research from North Carolina State University and Carnegie Mellon University shows that passing wireless power transfer through a magnetic resonance field enhancer (MRFE) – which can be as simple as a copper loop – can boost the transfer efficiency by at least 100 percent as compared to transferring through air alone. MRFE use could potentially boost transfer efficiency by as much as 5,000 percent in some systems, experts say.

Wireless power transfer works by having a transmitter coil generate a magnetic field; a receiver coil then draws energy from that magnetic field. One of the major roadblocks for development of marketable … Read More → "Researchers Boost Wireless Power Transfer with Magnetic Field Enhancement"

Applied Materials’ New Etch System Provides Atomic-Level Precision

July 23, 2015
  • New Centris(TM) Sym3(TM) Etch system’s innovative chamber architecture enables precision removal of materials to the atomic level
  • Already installed as a production tool of record with multiple customers, the new system is experiencing the fastest adoption rate for etch in Applied’s history

SANTA CLARA, Calif., July 13, 2015 – Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris(TM) Sym3(TM) Etch Read More → "Applied Materials’ New Etch System Provides Atomic-Level Precision"

congatec adds new AMD G-Series motherboards to its Mini?ITX portfolio

July 22, 2015

San Diego, California, July 21, 2015   * * *   congatec, Inc., a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, announces the expansion of its industrial-grade Mini-ITX motherboard portfolio with two highly efficient low-power conga-IGX variants that are based on the Gen 2 AMD Embedded G-Series SoC processor (codenamed “Steppe Eagle”) and feature powerful SoC integrated AMD Radeon graphics.

The new low-power motherboards are widely scalable with a TDP ranging between 5 and 15 watts max. The powerful AMD Radeon graphics offers, among other benefits, support for up to two independent displays and up to 4 … Read More → "congatec adds new AMD G-Series motherboards to its Mini?ITX portfolio"

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