STMicroelectronics Makes State-of-the-Art BCD8sP Smart-Power Technology Available for Prototyping through CMP
Geneva, Switzerland, and Grenoble, France, 21 January 2015 — STMicroelectronics (NYSE:STM) a global semiconductor leader serving customers across the spectrum of electronics applications, and CMP (Circuits Multi Projets®) have made ST’s BCD8sP technology platform for smart-power ICs available for prototyping to universities, research labs, and design companies through the silicon brokerage services provided by CMP.
This is the first time ST has released BCD design capability to third parties, which reflects the growing importance of state-of-the-art power integration in … Read More → "STMicroelectronics Makes State-of-the-Art BCD8sP Smart-Power Technology Available for Prototyping through CMP"