industry news
Subscribe Now

STMicroelectronics Makes State-of-the-Art BCD8sP Smart-Power Technology Available for Prototyping through CMP

Geneva, Switzerland, and Grenoble, France, 21 January 2015 — STMicroelectronics (NYSE:STM) a global semiconductor leader serving customers across the spectrum of electronics applications, and CMP (Circuits Multi Projets®) have made ST’s BCD8sP technology platform for smart-power ICs available for prototyping to universities, research labs, and design companies through the silicon brokerage services provided by CMP.

This is the first time ST has released BCD design capability to third parties, which reflects the growing importance of state-of-the-art power integration in the drive for higher performance in computing, consumer, and industrial applications of the future. “We expect CMP to help us identify and support innovative projects, and hopefully establish long-term connections with talented designers and research organizations,” said Claudio Diazzi, Sense & Power and Automotive Sector, Front End Manufacturing and Technology R&D, VP-Smart Power Technologies in STMicroelectronics.

The most advanced of ST’s Bipolar-CMOS-DMOS (BCD) technologies in production, the BCD8sP process enables the integration of analog and logic circuitry with high-voltage power components to produce single-chip devices for complex power-conversion and control applications. The process has enabled ST to leapfrog its competitors in important smart-power applications such as Hard Disk Drive (HDD) controllers, motor controllers, and power-management ICs for equipment such as smartphones, tablets, and computer servers.

The introduction in CMP’s catalog of ST’s BCD8sP process builds on the successful collaboration that has allowed universities and design firms to access leading-edge and previous bulk CMOS generations including 28nm, 65nm, and 130nm. CMP’s clients also have access to 28nm FD-SOI and 130nm SOI (Silicon-On-Insulator), as well as 130nm SiGe processes from STMicroelectronics.

“With ST’s world-class BCD process in our portfolio, we can now provide even stronger support for advanced smart-power design projects,” said Jean-Christophe Crebier, Director of CMP. “Many top universities worldwide have already taken advantage of the collaboration between CMP and ST. About 300 projects have been designed in ST’s 90nm process, more than 350 in bulk 65nm, and already over 50 projects prototyped in 28nm FD-SOI.”

About STMicroelectronics

ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people’s life. By getting more from technology to get more from life, ST stands for life.augmented.

In 2013, the Company’s net revenues were $8.08 billion. Further information on ST can be found at www.st.com.

About CMP

CMP is a service organization in ICs and MEMS for prototyping and low volume production. Circuits are fabricated for Universities, Research Laboratories and Industrial companies.
Advanced industrial technologies are available in CMOS, SiGe BiCMOS, HV-CMOS, SOI, P-HEMT GaAs, MEMS, 3D-IC, etc. CMP distributes and supports several CAD software tools for both Industrial Companies and Universities.
Since 1981, more than 1000 Institutions from 70 countries have been served, more than 6700 projects have been prototyped through 800 runs, and 60 different technologies have been interfaced. For more information, visit: http://cmp.imag.fr

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.
May 19, 2023
37,772 views