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PNI Sensor’s Becky Oh Explores Getting to Low Power and Maximum Functionality through Sensor Fusion at 2015 CES

What: Getting to Low Power and Maximum Functionality through Sensor Fusion – an executive industry panel representing the MEMS/sensors supply chain

When: January 6, 2015, from 3:30-4:30 p.m. A post-conference reception will be co-sponsored by PNI Sensor.

Where: Sensors & MEMS Technology conference track, presented by MEMS Industry Group, Venetian, Level 1, Marco Polo 702

Why:</ … Read More → "PNI Sensor’s Becky Oh Explores Getting to Low Power and Maximum Functionality through Sensor Fusion at 2015 CES"

Imec Demonstrates Broadband Graphene Optical Modulator on Silicon

SAN FRANCISCO—Dec. 15, 2014—At this week’s IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry’s first integrated graphene optical electro-absorption modulator (EAM) capable of 10Gb/s modulation speed. Combining low insertion loss, low drive voltage, high thermal stability, broadband operation and compact footprint, the device marks an important milestone in the realization of next-generation, high-density low-power integrated optical interconnects.

Integrated optical modulators with high modulation speed, small footprint and broadband athermal operation are highly desired for future chip-level optical interconnects. … Read More → "Imec Demonstrates Broadband Graphene Optical Modulator on Silicon"

Crossbar Unveils Another Breakthrough Innovation Behind Its Ultra-High Density 3D RRAM Solutions at IEDM 2014

  • Enables very high-density storage solutions with faster response time and lower power consumption
  • Solves one of the greatest technical challenges faced by developers of high-density RRAM
  • Proven in silicon; signals Crossbar’s 3D RRAM readiness for commercialization of Terabyte storage-on-a-chip

SANTA CLARA, California, December 15, 2014 – Achieving another major milestone needed to bring terabyte storage-on-a-chip to market, Crossbar, Inc., a start-up company pioneering 3D Resistive < … Read More → "Crossbar Unveils Another Breakthrough Innovation Behind Its Ultra-High Density 3D RRAM Solutions at IEDM 2014"

ProTek Devices’ New TVS Array Provides Circuit Protection for Industrial Communications

TEMPE, Ariz. – Dec. 15, 2014 – ProTek Devices™ today introduced an asymmetrical line protection transient voltage suppressor array (TVS array) designed for local interconnect network (LIN) BUS protection in industrial applications such as field devices, protocol converters and gateways, and more. The new circuit protection device is rated at 200 watts peak pulse power per line. This is for an 8/20 secondary lightning surge.

The part number is the PESD1LIN and it is available in a bidirectional configuration. The PESD1LIN is an ideal replacement for multilayer varistors (MLV 0805) in LIN BUS applications. It protects one power or I/O port … Read More → "ProTek Devices’ New TVS Array Provides Circuit Protection for Industrial Communications"

Ericsson introduces high-efficiency power modules with ultra-wide input voltage range for industrial and telecom applications

  • New power DC/DC power modules deliver up to 120W within ultra-wide input range from 18 to 75V DC
  • Targeting wide range of applications in telecommunication and industrial markets, new PKB5000W series delivers efficiency of typically 91.5 percent
  • Available in industry-standard eight-brick format, new series offers outstanding thermal performance

Ericsson has introduced the PKB5000W series of open-frame isolated 120W eighth-brick DC/DC power modules that offer high current output and high efficiency. Importantly, the new PKB5000W module features an ultra-wide input range of 18 to 75V DC, which means that … Read More → "Ericsson introduces high-efficiency power modules with ultra-wide input voltage range for industrial and telecom applications"

Synopsys Surpasses Milestone of 100 VC Apps on the Verdi Debug Solution

MOUNTAIN VIEW, Calif., Dec. 15, 2014 /PRNewswire/ — Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that the open Verdi® debug solution has achieved the milestone of more than 100 debug and analysis apps developed through the VC Apps open interfaces. These apps are now available through the Verdi VC Apps ToolBox as well as the VC Apps Exchange website. Developed and contributed by Verdi users and third-party EDA companies, these apps offer access to additional debug and … Read More → "Synopsys Surpasses Milestone of 100 VC Apps on the Verdi Debug Solution"

Express Logic’s ThreadX® RTOS First To Earn UL/IEC 60730 and UL/IEC 60335 Safety Certification

San Diego, CA – December 15, 2014—Express Logic, Inc., the worldwide leade in royalty-free real-time operating systems (RTOSes), today announced that its popular ThreadX® RTOS has been recognized by UL for compliance with UL 60730-1 Annex H, CSA E60730-1 Annex H, IEC 60730-1 Annex H, UL 60335-1 Annex R, IEC 60335-1 Annex R, and UL 1998 safety standards for software in programmable components. UL is a global, independent, safety-science company with more than a century of expertise innovating safety solutions, ranging from the public adoption of electricity to breakthroughs in sustainability, renewable energy, and nanotechnology.

“ThreadX is the first … Read More → "Express Logic’s ThreadX® RTOS First To Earn UL/IEC 60730 and UL/IEC 60335 Safety Certification"

New Super-Slim Rectifiers from STMicroelectronics Save Space, Weight, and Energy in Automotive and Outdoor Electronics

Geneva, December 15, 2014 – The extremely low profile and light weight of STMicroelectronics’ latest automotive-qualified high-voltage ultrafast rectifiers support space-efficient vehicle electronics by helping miniaturize electronic control modules, power converters, and motor drives.

The new rectifiers are packaged as SMBFlat devices that weigh only 50mg and, at 1mm-thick, are almost 60% thinner than the nearest competing rectifiers in standard 2.4mm-thick SMB packages. This helps designers create lighter and slimmer Electronic Control Units suitable for mounting in small spaces within the vehicle. The two-lead surface-mount SMBFlat package is footprint-compatible with standard SMB devices, which promotes ease of use in existing PC-board … Read More → "New Super-Slim Rectifiers from STMicroelectronics Save Space, Weight, and Energy in Automotive and Outdoor Electronics"

Altera Quartus II Software v14.1 Enables TFLOP Performance in Industry’s First FPGA with Hardened Floating Point DSP Blocks

San Jose, Calif., December 15, 2014 – Altera Corporation (Nasdaq: ALTR) today released itsQuartus® II software v14.1 featuring expanded support for Arria® 10 FPGAs and SoCs, the FPGA industry’s only devices with hardened floating point DSP blocks and the industry’s only 20 nm SoC FPGAs that integrate ARM processors. Altera’s latest software release provides immediate support for the hardened floating point DSP blocks integrated in Arria 10 FPGAs and SoCs. … Read More → "Altera Quartus II Software v14.1 Enables TFLOP Performance in Industry’s First FPGA with Hardened Floating Point DSP Blocks"

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