Mouser Adds Adafruit to Its Open Source Lineup
July 13, 2015 – Mouser Electronics, Inc. today announced that it has signed a global distribution agreement with Read More → "Mouser Adds Adafruit to Its Open Source Lineup"
July 13, 2015 – Mouser Electronics, Inc. today announced that it has signed a global distribution agreement with Read More → "Mouser Adds Adafruit to Its Open Source Lineup"
14 July 2015 – Munich, Germany and Westford, MA, USA – Zuken announces that electronics manufacturing services (EMS) provider Enics has invested inCR-8000 Design Force, part of Zuken’s next generation product-centric design platform.
Enics chose CR-8000 as part of an ongoing investment program to ensure they can meet their customers’ future technical requirements … Read More → "Enics invests in Zuken’s CR-8000 software to future-proof electronics manufacturing services"
MILPITAS, CA – July 14, 2015 – Linear Technology Corporation introduces the LTC4015, a highly integrated, high voltage multichemistry synchronous step-down battery charger controller with onboard telemetry functions. The device efficiently transfers power from a variety of input sources, such as wall adapters and solar panels, to a Li-Ion/Polymer, LiFePO4 or lead-acid battery stack and system load up to 35V. It provides … Read More → "Versatile 35VIN/35VOUT Synchronous Buck Battery Charger Controller Offers up to 20A Charge Current, Multichemistry Operation & Digital Telemetry"
SAN FRANCISCO – July 14, 2015 – Imec and Panasonic Corp. announced today that they have fabricated a 40nm TaOx-based RRAM (resistive RAM) technology with precise filament positioning and high thermal stability. This breakthrough result paves the way to realizing 28nm embedded applications. The results were presented at this year’s VLSI technology symposium (Kyoto, June 15-19 2015).
One of today’s most promising concepts for scaled memory is RRAM which is based on the electronic (current-or voltage-induced) switching of a resistor element material between two metals. … Read More → "Imec and Panasonic Demonstrate Breakthrough RRAM Cell"
Andover, Massachusetts- July 14, 2015- MEMSIC Inc., a leading sensing solutions provider, today announced the availability of its MFC2030 Bi-Directional Flow Sensor for a wide range of applications such as analytical instruments, anesthesia and other medical flow devices, process control, and natural gas measurement.
MEMSIC Inc. utilizes its highly advanced and successful MEMS thermal accelerometer platform, of which it has shipped hundreds of millions of units into a variety of automotive and consumer applications, as the flow sensing element in this high performance flow sensor. The MFC2030 leverages this experience, technology and economy of scale to offer a … Read More → "MEMSIC Launches First High Performance Bi-Directional Flow Sensors for Medical and Industrial Applications"
Liverpool (UK) – UK Space Conference, NEW YORK, and PARIS, July 14, 2015 – AdaCore today announced the start of the Lunar IceCube project, a major hardware/software development effort that will use the GNAT Pro and SPARK language toolsets to help achieve the high reliability required for space missions. Sponsored by NASA through their NextSTEP initiative (“Next Space Technologies for Exploration Partnerships”), Vermont Tech’s flight software development … Read More → "SPARK Going to the Moon"
Plano, Texas – July 14th, 2015 – The AH376xQ family of AECQ100-qualified Hall effect latches introduced by Diodes Incorporated offers eight magnetic sensitivity options to cover the requirements of numerous automotive applications. Such uses include commutation, encoding and position control of the various motors, pumps, fans and valves found in vehicle cabins for operating windows, sun roofs, seats, tailgates and air-conditioning. These Hall effect latches can also be used in the engine bay for steering and sensing the speed and position of the crankshaft, camshafts, cooling fans, … Read More → "High-Performance Automotive Hall Effect Latch from Diodes Incorporated Features Wide Range of Sensitivity Options"
SANTA BARBARA, CA — July 14, 2015 — Green Hills Software, the worldwide leader in high assurance operating systems, announced that Northrop Grumman has successfully integrated the INTEGRITY®-178 tuMP multicore operating system in its FlightPro™ Gen III Mission Computer for the U.S. Marine Corps UH-1Y and AH-1Z helicopter upgrades. The Northrop Grumman FlightPro Gen III Mission Computer uses the INTEGRITY-178 Time-Variant Unified Multi Processing (tuMP) operating system on Freescale QorIQ® P4080-based single-board computers.
“Our team has integrated INTEGRITY-178 tuMP on our … Read More → "Green Hills Software’s INTEGRITY-178 tuMP Multicore Operating System Successfully Flies on Northrop Grumman’s FlightPro Gen III Mission Computer"
Geneva, July 14, 2015 – The new M-series 650V IGBTs from STMicroelectronics offer designers a fast and affordable way to increase the efficiency of HVAC motor drives, Uninterruptible Power Supplies, solar power converters, and all power-conversion applications working up to 20kHz in hard-switching circuit topologies.
Built using ST’s third generation of trench-gate field-stop low-loss technology, the M-series IGBTs feature a new trench gate and a specially designed P-N-P vertical structure that together deliver the best trade-off between conduction and switch-off losses and significantly improve the overall performance of … Read More → "650V IGBTs from STMicroelectronics Boost Efficiency in 20kHz Power-Switching Applications"
SAN FRANCISCO – July 14, 2015 – Nano-electronics research center imec and SPTS Technologies, an Orbotech company (NASDAQ: ORBK) and supplier of advanced wafer processing solutions for the global semiconductor and related industries, announced today at SEMICON West that they are jointly developing a highly accurate, short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding.
Wafer backside processing is critical for 3D-IC wafer stacking. Today, through-silicon vias (TSV) formed using ‘via-middle’ processing, are … Read More → "Imec and SPTS Technologies, an Orbotech Company, Collaborate on Critical Processes for 3D IC Wafer Stacking"