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Management Day at the 48th DAC: Decision-making at the Cutting Edge of Business and Technology

LOUISVILLE, Colo. – May 27, 2011 – The rubber meets the road at the intersection of high-performance Systems-on-Chip design and the adoption of emerging technologies. Management Day at the 48th Design Automation Conference (DAC) provides engineering and business managers with essential information to make the right decisions at the intersection of business and technology.

Read More → "Management Day at the 48th DAC: Decision-making at the Cutting Edge of Business and Technology"

IPM (Intelligent Power Module) – a solution for compact motor drive applications?

May 27th 2011 – Power electronics for application embedded motor drives need to be compact and to have good thermal characteristics. Different IPM (intelligent power module) concepts are competing with different sets of features to be the best solution.

Higher integration and more complex subsystems are some of the current mega trends in power electronics. Very popular are Intelligent Power Modules (IPM) for motor drive applications. They are a combination of power semiconductors like IGBTs, MOSFETs and diodes with peripheral components like driver circuits. If a whole subsystem has a good match to an application, an IPM can … Read More → "IPM (Intelligent Power Module) – a solution for compact motor drive applications?"

Imec welcomes NVIDIA as fabless partner in its advanced CMOS scaling program

Leuven, Belgium – May 25, 2011 – NVIDIA, a world-leader in visual computing technologies, signed a 3-year research collaboration agreement with imec on advanced CMOS scaling. By joining imec’s core CMOS program as INSITE member, NVIDIA will get early insight in the impact of future process and design technology options on its next-generation products.

NVIDIA joins the growing fabless community of imec’s core CMOS program. The collaboration focuses on the system design impact of advanced devices, interconnect, including 3D, and lithography implications for the sub-20nm node.

Imec INSITE makes … Read More → "Imec welcomes NVIDIA as fabless partner in its advanced CMOS scaling program"

TI spins out eight new motor drivers for stepper, brushed DC motors

DALLAS (May 24, 2011) – Texas Instruments Incorporated (TI) (NYSE:TXN) today expanded its DRV8x motor driver family with eight new devices supporting up to 5 A for higher-current bipolar stepper and brushed DC motors. The new DRV8x motor drivers provide RDSon as low as 100 milliohms, more than 60 percent less than the previous generation, enabling higher current and better thermal performance. Microstepping options within the family include up to 256 microsteps and greater with an external microcontroller or up to 32 microsteps with an on-chip indexer. For more information or to place an order, visit Read More → "TI spins out eight new motor drivers for stepper, brushed DC motors"

Imec processes first power devices on 200mm CMOS-compatible GaN-on-Si

Leuven, Belgium – May 26, 2011 – Imec and its partners in the GaN industrial affiliation program (IIAP) have produced device-quality wafers with GaN/AlGaN layers on 200mm silicon wafers. With these wafers, functional GaN MISHEMTs were processed using standard CMOS tools. The used processes are compatible with the strict contamination rules in a standard CMOS processing line (e.g. no use of gold). These first GaN devices on 200mm wafers are an important milestone on the path to cost-effective production of power devices in high-productivity 200mm fabs.

GaN is a promising material for next-generation power devices with … Read More → "Imec processes first power devices on 200mm CMOS-compatible GaN-on-Si"

Synopsys Delivers 28-nm Design Solutions and Advanced System-Level Capabilities for TSMC Reference Flow 12.0

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that it is delivering comprehensive design enablement for TSMC’s 28-nm process technology, integrated manufacturing compliance and an advanced system-level prototyping solution, with TSMC Reference Flow 12.0.  New features of the flow include virtual prototyping and high-level synthesis linked to TSMC’s advanced processes, expanded manufacturing compliance capabilities and full support of TSMC’s latest 28-nm design rules and models within Synopsys’ Galaxy™ Implementation Platform. With the new tool capabilities and system-level design integration, designers gain productivity, shortened time-to-market … Read More → "Synopsys Delivers 28-nm Design Solutions and Advanced System-Level Capabilities for TSMC Reference Flow 12.0"

WonderMedia Announces PRIZM WM8710

Taipei, Taiwan, May 26, 2011 – WonderMedia Technologies, Inc, a leading innovator of energy-efficient, feature-rich system-on-chip platforms, today announced the PRIZM WM8710 SoC.  

Combining a highly energy-efficient ARM 11 core running at 800Mhz with advanced graphics and stunning 1080p video playback capabilities, the PRIZM WM8710 further extends WonderMedia’s leadership in the fast-growing entry-level Android media tablet and Windows CE SmartBook markets. With its high-performance, and feature-rich design, the WM8710 is also optimized for a wide range of … Read More → "WonderMedia Announces PRIZM WM8710"

CAST Adds Video and Image Processing Cores to Compression IP Product Line

May 27, 2011, Woodcliff Lake, NJ — New IP cores for image scaling, video deinterlacing, and graphics acceleration are now available in the Video and Image IP core product line of semiconductor intellectual property (IP) provider CAST, Inc. (See http://www.cast-inc.com/ip-cores/images for details.)

CAST already offers one of the broadest and deepest available lines of video and image compression IP, with cores for H.264, JPEG 2000, and five JPEG variations. The new processing cores handle functions typically required before or after compression or de-compression, … Read More → "CAST Adds Video and Image Processing Cores to Compression IP Product Line"

Silicon Frontline Addresses EDA Industry Bottleneck, Promotes Guaranteed Accurate 3D Post-Layout Extraction at Design Automation Conference

SAN DIEGO, CA–(Marketwire – May 25, 2011) –

Who/What

Silicon Frontline Technology, Inc. (SFT), an Electronic Design Automation (EDA) company, in the post-layout verification market focused on solutions for nanometer design applications, is attending the 48th Design Automation Conference (DAC) in San Diego and will show its newest product Read More → "Silicon Frontline Addresses EDA Industry Bottleneck, Promotes Guaranteed Accurate 3D Post-Layout Extraction at Design Automation Conference"

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