News – Page 1070 – EEJournal

Cadence Collaborates with Amazon Web Services to Deliver Electronic Systems and Semiconductor Design for the Cloud

June 26, 2018

SAN FRANCISCO—DESIGN AUTOMATION CONFERENCE, 25 Jun 2018

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it is collaborating with Amazon Web Services (AWS) to deliver electronic systems and semiconductor design with the Cadence^® Cloud portfolio. For the last two years, customers have been able to leverage the Cadence Cloud-Hosted Design Solution, a Cadence-managed and EDA-optimized design environment built on AWS, to address company-specific infrastructure requirements. The service also allows customers who manage their own IT and business relationships with AWS to use the Cadence … Read More → "Cadence Collaborates with Amazon Web Services to Deliver Electronic Systems and Semiconductor Design for the Cloud"

Flex Logix EFLX4K IO eFPGA Core Enables Very Wide Bus Connections for Networking Applications

June 26, 2018

MOUNTAIN VIEW, Calif.– June 26, 2018 –Flex Logix Technologies, Inc.the leading … Read More → "Flex Logix EFLX4K IO eFPGA Core Enables Very Wide Bus Connections for Networking Applications"

Create Secured IoT Endpoints with the First 32-bit MCU to Feature Robust, Chip-level Security and Arm TrustZone Technology

June 26, 2018

CHANDLER, Ariz., June 25, 2018 — With the booming growth of Internet of Things (IoT) endpoints, security is sometimes an afterthought for many designers, increasing the risk of exposing intellectual property (IP) and sensitive information. To address the growing need for security, the new SAM L10 and SAM L11 MCU families are now available from Microchip Technology Inc. (NASDAQ: MCHP). For more information visit www.microchip.com/SAML11.

The new MCU families are based on the Arm^® Cortex^®-M23 … Read More → "Create Secured IoT Endpoints with the First 32-bit MCU to Feature Robust, Chip-level Security and Arm TrustZone Technology"

Offline Pulse-Width Modulation Controller from STMicroelectronics Boosts Efficiency, Economy, and Stability of Ultra-Low Standby Power Supplies

June 26, 2018

Geneva, June 26, 2018 — STMicroelectronics’ STCH03 offline Pulse-Width Modulation (PWM) controller combines high integration with … Read More →

Synopsys’ ASIP Designer Tools Enables RIKEN to Successfully Develop Application-Specific Instruction-Set Processor in Less Than Six Months

June 25, 2018

MOUNTAIN VIEW, Calif., June 25, 2018 /PRNewswire/ —

Highlights:

RIKEN used ASIP Designer to develop custom processor for analyzing large biological systems
Specialized application-specific instruction-set processor executes large-scale molecular dynamics simulation algorithms 30 times faster than existing cores
Automatic generation of software development kit ( … Read More → "Synopsys’ ASIP Designer Tools Enables RIKEN to Successfully Develop Application-Specific Instruction-Set Processor in Less Than Six Months"

Silicon Labs Introduces Industry’s Broadest Portfolio for 56G/112G SerDes Clocking

June 25, 2018

Si539x Clocks Boost Lead in Frequency Flexibility and Jitter Performance

Si56x Ultra Series™ XO/VCXOs Provide Any Frequency up to 3 GHz

AUSTIN, Texas – June 25, 2018 – Silicon Labs (NASDAQ: SLAB) has expanded its timing portfolio to meet the high-performance clocking requirements of 56G PAM-4 SerDes and emerging 112G serial applications. With this portfolio expansion, Silicon Labs is the only timing supplier to offer a comprehensive selection of clock generators, jitter attenuating clocks, voltage-controlled crystal oscillators (VCXOs) and XOs for 100/200/400/600G designs that satisfy sub-100 … Read More → "Silicon Labs Introduces Industry’s Broadest Portfolio for 56G/112G SerDes Clocking"

Cadence and Microsoft Collaborate to Facilitate Semiconductor and System Design on the Microsoft Azure Cloud Platform

June 25, 2018

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced a collaboration with Microsoft to facilitate electronic systems and semiconductor design with the Cadence^® Cloud portfolio. Through the collaboration, customers can access the Cadence Cloud-Hosted Design Solution, a Cadence-managed and EDA-optimized design environment that is built on the Microsoft Azure cloud platform and customized for company-specific infrastructure requirements. The collaboration also enables customers who manage their own IT and business relationships with Microsoft to use the Cadence Cloud Passport model to access cloud-ready software tools for use on Azure. The Cadence and … Read More → "Cadence and Microsoft Collaborate to Facilitate Semiconductor and System Design on the Microsoft Azure Cloud Platform"

Design Code Separately and Integrate Seamlessly with Dual-core dsPIC Digital Signal Controller

dsPIC33CH family optimized for high-performance and time-critical, real-world embedded control

June 25, 2018

CHANDLER, Ariz., June 25, 2018 — System developers designing high-end embedded control applications can benefit from a new Digital Signal Controller (DSC) with two dsPIC^® DSC cores in a single chip, now available from Microchip Technology Inc. (NASDAQ: MCHP). The dsPIC33CH has one core that is designed to function as a master while the other is designed as a slave. The slave core is useful for executing dedicated, time-critical control code while the master core is busy running the user interface, system monitoring and communications functions, customized for the end … Read More → "Design Code Separately and Integrate Seamlessly with Dual-core dsPIC Digital Signal Controller"

STMicroelectronics Becomes First Chip Maker Accredited by the GSMA to Personalize eSIMs for Mobiles and Connected IoT Devices

June 25, 2018

Certification consolidates loading of connection credentials with eSIM manufacturing
Customers can now procure ready-personalized ICs for faster time-to-market and vendor-reduction advantages
High-quality eSIMs are built around proven ST33 secure microcontroller

Geneva, June 25, 2018 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is accelerating progress towards a more convenient and secure connected world as the first embedded SIM (eSIM) manufacturer to be accredited by the GSMA for loading eSIM chips with connection credentials such as certificates and operator … Read More → "STMicroelectronics Becomes First Chip Maker Accredited by the GSMA to Personalize eSIMs for Mobiles and Connected IoT Devices"

Flex Logix Improves Deep Learning Performance by 10X with New EFLX4K AI eFPGA Core

Available on Any Process in 6-8 Months: Enables Reconfigurable AI Matrix Multipliers of Any Size

June 25, 2018

MOUNTAIN VIEW, Calif.– June 25, 2018 – Flex LogixÒTechnologies, Inc., the leading supplier of embedded … Read More → "Flex Logix Improves Deep Learning Performance by 10X with New EFLX4K AI eFPGA Core"