industry news
Subscribe Now

STMicroelectronics Becomes First Chip Maker Accredited by the GSMA to Personalize eSIMs for Mobiles and Connected IoT Devices

  • Certification consolidates loading of connection credentials with eSIM manufacturing
  • Customers can now procure ready-personalized ICs for faster time-to-market and vendor-reduction advantages
  • High-quality eSIMs are built around proven ST33 secure microcontroller

Geneva, June 25, 2018 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is accelerating progress towards a more convenient and secure connected world as the first embedded SIM (eSIM) manufacturer to be accredited by the GSMA for loading eSIM chips with connection credentials such as certificates and operator profiles before shipping.

The eSIMs, customized with connection credentials, enable smaller form factors, greater security, and increased flexibility. Chip-scale, permanently embedded, and electronically reprogrammable, eSIMs save space inside smartphones for extra features or battery capacity, while enabling different types of connected devices in tiny form factors for an expanding range of markets and applications, such as smart watches and Internet-of-Things (IoT) devices including smart meters, remote sensors, or gateways.

Building on existing accreditation to manufacture eSIM chips that meet the GSMA’s specifications for security and reliability, ST is speeding ahead of other chip makers by gaining further accreditation for securely applying eSIM personalization data, according to the GSMA’s Secure Accreditation Scheme for UICC Production (GSMA SAS-UP).

ST can now deliver personalized eSIMs, built around the proven ST33 secure microcontroller, directly to customers’ production facilities, ready to use with no further programming required. Equipment OEMs, mobile network operators, and SIM operating-system (OS) vendors can thus enjoy greater convenience, economy, and business efficiency by streamlining the eSIM supply chain to save handling overheads and reduce time to market.

The SAS-UP accreditation of ST’s Rousset (France) production site for the personalization of WLCSP SIMs and eSIMs is a significant move in driving widespread adoption of trusted eSIM devices by enabling consumer and IoT device manufacturers to implement eSIM in very small form factors,” confirmed Jean-Christophe Tisseuil, GSMA’s Head of SIM and eSIM. “SAS-UP is a first and essential step towards a secure and trusted eSIM market deployment.

“The eSIM is an important technological advance that makes it possible to build the connected world of the future, safely. The GSMA’s certification scheme governing production and personalization is critical for its success,” said Marie-France Florentin, Group Vice President, General Manager, Secure Microcontroller Division, STMicroelectronics. “Now that ST is accredited to produce and personalize eSIMs before shipping, our customers can benefit from greater efficiency and security throughout the entire supply chain, with all the safeguards and assurances provided by the GSMA’s ecosystem.

About STMicroelectronics

ST is a global semiconductor leader delivering intelligent and energy-efficient products and solutions that power the electronics at the heart of everyday life. ST’s products are found everywhere today, and together with our customers, we are enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and Internet of Things devices.

By getting more from technology to get more from life, ST stands for life.augmented.

In 2017, the Company’s net revenues were $8.35 billion, serving more than 100,000 customers worldwide. Further information can be found at www.st.com.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Analog Output, Isolated Current, & Voltage Sensing Using Isolation Amplifiers
Sponsored by Mouser Electronics and Vishay
In this episode of Chalk Talk, Simon Goodwin from Vishay and Amelia Dalton chat about analog output, and isolated current and voltage sensing using isolation amplifiers. Simon and Amelia also explore the fundamental principles of current and voltage sensing and the variety of voltage and current sensing solutions offered by Vishay that can get your next design up and running in no time.
Apr 27, 2026
605 views