industry news
Subscribe Now

Microchip PCIe® Switches Provide High-Performance Connectivity for Open Compute Project’s Accelerator Infrastructure

Switchtec™ PCIe switches enable the high-performance, low-latency fabric connectivity required to fulfill the industry’s vision for interoperable artificial intelligence hardware accelerators

CHANDLER, Ariz., October 3, 2019 – The rapid adoption of Artificial Intelligence (AI), Machine Learning (ML), Deep Learning (DL) and High-Performance Computing (HPC) is driving demand to streamline the development of systems utilizing hardware accelerators that are optimized for the bandwidth needs and flexible interconnect requirements of these workloads. Microchip Technology Inc. (Nasdaq: MCHP) is helping to meet this industry need with Advanced Fabric PCIe switches that provide the interconnect technology for the OCP Open Accelerator Infrastructure (OAI).

Switchtec™ Gen4 PAX Advanced Fabric PCIe switches provide the HIB high-performance connectivity and other capabilities required to provide a common interface between Universal Baseboard (UBB) and hosts and other I/O devices to scale out. PAX switches are ideal for high fanout, scale-out, multi-host environments. The dynamic reconfiguration features provided by the robust, enterprise-grade PAX management firmware allow the HIB to support host-failover and live migration between the many OAI use cases as well as future use cases such as cross-domain peer-to-peer between accelerators and storage devices.

In last week’s Open Compute Regional Summit, the OCP Accelerator Module (OAM) form factor and its interconnects were announced. Microchip is a longtime participant in OCP and is supporting OCP members in the development of the OAM specification.

“Microchip’s Switchtec Advanced Fabric PCIe switches are ideally suited to help meet the fabric connectivity requirements for AI, ML, HPC and other workloads,” said Andrew Dieckmann, associate vice president of marketing for Microchip’s data center solutions (DCS) business unit. The OAM and HIB are critical pieces of the OAI specification, and we are excited to contribute to the advance of these specifications.”

About Microchip Technology

Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve more than 125,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

FlyOver® Technology: Twinax FlyOver® System for Next Gen Speeds -- Samtec and Mouser
Sponsored by Mouser Electronics and Samtec
In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec investigate the challenges of routing high speed data over lossy PCBs. They also discuss the benefits that Samtec’s Flyover® cable assembly systems bring to data center and embedded designs and how Samtec is furthering innovation with their high speed interconnect solutions. 
Apr 15, 2024
1,550 views