industry news
Subscribe Now

Cavium ThunderX2 Motherboard Specification for Microsoft’s Project Olympus Contributed to the Open Compute Project

London, November 8, 2017– Cavium™, Inc. (NASDAQ: CAVM), announced today that they are collaborating with Microsoft to contribute the ThunderX2™ mother board specification to the Open Compute Project (OCP) as part of the design specification for Microsoft’s Project Olympus. The contribution enables the adoption and iteration by members of OCP, a global community of technology leaders who are reimagining hardware to make it more efficient, flexible, and scalable.

The ThunderX2 product family is Cavium’s second generation 64-bit ARMv8-A server processor SoCs for Data Center, Cloud and High-Performance Computing applications. The family integrates fully out-of-order high performance custom cores supporting single and dual socket configurations. ThunderX2 is optimized to drive high computational performance delivering outstanding memory bandwidth and memory capacity. The new line of ThunderX2 processors includes multiple workload optimized SKUs for both scale up and scale out applications and is fully compliant with ARMv8-A architecture specifications as well as ARM’s SBSA and SBBR standards. It is also widely supported by industry leading OS, Hypervisor and SW tool and application vendors.

Cavium and Microsoft originally announced their collaboration at the OCP U.S. Summit in March 2017, where the two companies demonstrated cloud service workloads developed for Microsoft’s internal use running on ThunderX2 based server platform.  During theDCD: Zettastructuresummit today, the companies releasedthe detailed specificationof ThunderX2 Server Motherboard for Microsoft’s Project Olympus including block diagram, management sub-system, power management, FPGA Card support, IO connectors, and physical specifications.

“Cavium is pleased to collaborate with Microsoft on contributing world’s first dual socket ARM server mother board design to the Open Compute Project,” said Gopal Hegde, VP/GM, Data Center Processor Group at Cavium. “ThunderX2 delivers best-in-class compute, memory and IO performance to most demanding Data Center workloads and this contribution will enable interested server OEMs and ODMs to quickly design and proliferate ThunderX2 based Project Olympus platforms.”

Kushagra Vaid, GM, Azure Hardware Infrastructure, Microsoft Corp. said, “We designed Microsoft’s Project Olympus with the ability to accommodate a variety of workloads and processor architectures. We’ve been closely collaborating with Cavium to integrate ThunderX2 into Microsoft’s Project Olympus design, and to drive innovation within the ARM ecosystem especially for workloads that benefit from high-throughput computing. The completion and contribution of our Project Olympus specification shows our continued commitment to the Open Compute Project and community developed innovation.”

About Cavium
Cavium, Inc. offers a broad portfolio of infrastructure solutions for compute, security, storage, switching, connectivity and baseband processing. Cavium’s highly integrated multi-core SoC products deliver software compatible solutions across low to high performance points enabling secure and intelligent functionality in Enterprise, Data center and Service Provider Equipment. Cavium processors and solutions are supported by an extensive ecosystem of operating systems, tools, application stacks, hardware reference designs and other products. Cavium is headquartered in San Jose, CA with design centers in California, Massachusetts, India, Israel, China and Taiwan. For more information, please visit http://www.cavium.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Non-Magnetic Interconnects
Sponsored by Mouser Electronics and Samtec
Magnets and magnetic fields can cause big problems in medical, scientific, industrial, space, and quantum computing applications but using a non-magnetic connector can help solve these issues. In this episode of Chalk Talk, Amelia Dalton and John Riley from Samtec discuss the construction of non-magnetic connectors and how you could use non-magnetic connectors in your next design.
May 3, 2023
40,700 views