industry news
Subscribe Now

Alliance Memory to Highlight Latest SRAM, DRAM, Flash, and Storage Memory ICs at Embedded World 2022

KIRKLAND, Wash. — May 5, 2022 — Alliance Memory today announced its technology lineup for Embedded World 2022, taking place June 21-23 in Nuremberg, Germany. Exhibiting in Hall 1, Stand 639, the company will highlight its latest SRAM, DRAM, flash, and storage memory ICs for embedded platforms.

“It’s been more than two years since Alliance Memory has exhibited at an in-person trade show,” said David Bagby, president and CEO of Alliance Memory. “During that time, we’ve been proudly supporting the European market with a reliable source of legacy memory chips that were otherwise in short supply, especially our Micron Technology flash devices, which we’ve been able to keep in stock due to our special relationship with the company. But the long wait is finally over, and we’re excited to meet up with our valued distributors and customers again at Embedded World 2022. We can’t wait to see everyone in Nuremberg.”

On display at Embedded World 2022, Alliance Memory’s latest offering for the embedded market includes 4GB and 8GB industrial grade embedded multi-media card (eMMC) solutions for solid-state storage in consumer, industrial, and networking applications. The devices each integrate NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5mm by 13mm 153-ball FBGA package. Compliant with the JEDEC eMMC v5.1 industry standard, the eMMCs support features such as boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write leveling, high-priority interrupt (HPI), secure trim/erase, and high-speed HS200 and HS400 modes.

Alliance Memory will also be highlighting high-speed CMOS mobile low-power SDRAMs featuring on-chip ECC. With low-voltage operation of 1.1 V and 0.6 V, respectively, the LPDDR4 and LPDDR4x devices increase battery life in portable electronics for the consumer, commercial, and industrial markets, including tablets, wearables, smartphones, smart speakers, and other IoT devices utilizing AI and 5G technologies. Providing increased efficiency for advanced audio and high-resolution video in embedded applications, the low-power SDRAMs deliver fast clock speeds of 1.6GHz for extremely high transfer rates of 3.2Gbps. For automotive applications — including infotainment and ADAS systems — the AEC-Q100 qualified devices operate over a temperature range of -40°C to +105°C.

To meet the growing demand for serial peripheral interface (SPI) NAND flash memory products in the automotive, industrial, communications, and consumer electronic markets, Alliance Memory will be exhibiting its AS5F series of 1.8V to 3V devices with densities from 1Gb to 8Gb and high-speed clock frequencies up to 120MHz. Offering reliable, long-term performance, the SPI NAND flash products feature more than 60,000 program/erase cycles, offer 10-year data retention, and support standard, dual, and quad SPI operation. With their enhanced performance, the devices meet the requirements for multimedia data storage applications and AI implementation.

In addition, Alliance Memory will showcase its AS25F line of 3V multiple input/output serial NOR flash memory products, which are designed to provide supply continuity for Micron Technology customers utilizing discontinued N25Q series devices. The AS25F series combines fast read performance up to 104MHz with fast program and erase times of 0.3ms and 40ms typical, respectively. Available in 8-pin SOP Wide Body (209mils) and 8L WSON (6x5mm) packages, the devices provide reliable, long-term performance with 100,000 program/erase cycles and 10-year data retention.

For free admission to Embedded World 2022, register at https://www.messe-ticket.de/Nuernberg/embeddedworld/Register using personalized voucher code ew22466864.

About Alliance Memory Inc.
Alliance Memory is a worldwide provider of critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes flash, DRAM, and SRAM memory ICs with commercial, industrial, and automotive operating temperature ranges and densities from 64Kb to 8Gb. Privately held, Alliance Memory maintains headquarters in Kirkland, Washington, and regional offices in Europe, Asia, Canada, and South America. More information about Alliance Memory is available online at www.alliancememory.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

How Capacitive Absolute Encoders Enable Precise Motion Control
Encoders are a great way to provide motion feedback and capture vital rotary motion information. In this episode of Chalk Talk, Amelia Dalton and Jeff Smoot from CUI Devices investigate the benefits and drawbacks of different encoder solutions. They also explore the unique system advantages of absolute encoders and how you can get started using a CUI Devices absolute encoder in your next design.
Apr 1, 2024
3,406 views