industry news
Subscribe Now

TEWS TECHNOLOGIES Introduces PCI Express x4, Gen3 XMC Carrier for Embedded I/O Applications

Halstenbek, Germany – 14th September 2016. TEWS TECHNOLOGIES increases its product portfolio of PCI Express carriers. The TPCE278 is a standard height PCI Express Revision 3.0 compatible module that provides one slot for a single-width XMC module.

The TPCE278 is a versatile solution to upgrade well known XMC I/O solutions to the PCI Express signalling standard used to build modular, flexible and cost effective I/O solutions for all kinds of applications like process control, medical systems, telecommunication and traffic control.

The PCI Express x4 link from the host board to the XMC module is enhanced by a PCIe Gen3 Redriver, allowing safe operation of XMC modules on PCIe mainboards.

VPWR is selectable between 12V and 5V via order option.

The TPCE278 supports XMC front panel I/O, and also P14 and P16 rear I/O independently.

XMC P14 rear I/O is provided through a Tyco AMPMODU System 50 0.050×0.100 flat ribbon cable connector. The I/O lines are routed differential.

XMC P16 rear I/O is implemented through two Samtec QTH-DP 0.50mm Q Pairs® High Speed Ground Plane Socket Strip, Differential Pair connector providing access to all P16 I/O lines.

The PCIe edge card connector provides +12V and +3.3V. The TPCE278 uses the +12V of the PCIe edge card connector to generate all power supply voltages for the XMC slot (+3.3V, VPWR and +12V).


VPWR is selectable between 12V and 5V via order option.

The TPCE278 supports XMC front panel I/O, and also P14 and P16 rear I/O independently.

XMC P14 rear I/O is provided through a Tyco AMPMODU System 50 0.050×0.100 flat ribbon cable connector. The I/O lines are routed differential.

XMC P16 rear I/O is implemented through two Samtec QTH-DP 0.50mm Q Pairs® High Speed Ground Plane Socket Strip, Differential Pair connector providing access to all P16 I/O lines.

The PCIe edge card connector provides +12V and +3.3V. The TPCE278 uses the +12V of the PCIe edge card connector to generate all power supply voltages for the XMC slot (+3.3V, VPWR and +12V).

TEWS TECHNOLOGIES is a leading solutions provider of embedded I/O and CPU products based on open architecture standards such as PMC, XMC, IndustryPack® (IP), CompactPCI, standard PCI, PCIe, mPCIe, AMC, FMC, and VME. TEWS has more than 30 years of experience designing and building turn-key embedded interface solutions using the philosophy to listen and respond to our customers’ needs. Using this ‘customer first’ approach, TEWS has developed a large number of standard and custom products for industrial control, telecommunication infrastructure, medical equipment, traffic control and COTS applications. TEWS’ line of embedded I/O solutions is available worldwide through a global network of distributors. For more information, go to www.tews.com.

Leave a Reply

featured blogs
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

FlyOver® Technology: Twinax FlyOver® System for Next Gen Speeds -- Samtec and Mouser
Sponsored by Mouser Electronics and Samtec
In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec investigate the challenges of routing high speed data over lossy PCBs. They also discuss the benefits that Samtec’s Flyover® cable assembly systems bring to data center and embedded designs and how Samtec is furthering innovation with their high speed interconnect solutions. 
Apr 15, 2024
4,430 views