industry news
Subscribe Now

Wirepas and u-blox partner for scalable and easy-to-use industrial Internet of Things solutions

Thalwil, Switzerland – August 22, 2016 – Wirepas and u-blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, have partnered to offer an advanced decentralized radio communications solution (comparable with advanced mesh technology) for demanding industrial Internet of Things (IoT) applications. The IoT industry is still quite young and fragmented, making deployment of industrial IoT applications slow and complex for the end customers. The goal of u-blox and Wirepas is to make large scale, decentralized industrial IoT networks easy to deploy for their customers.

NINA-B1  https://www.u-blox.com/en/product/nina-b1 is a small, stand-alone Bluetooth low energy module, with the latest state-of-the-art power performance. It is targeting several different applications, such as healthcare, connected buildings, manufacturing and telematics. The module has been certified for a range of countries world-wide, thus reducing risk and time to market for customers integrating the module in their devices.

“The NINA-B1 in combination with the Wirepas Connectivity software enables short time to market for easy-to-install, large scale, decentralized industrial IoT applications in segments such as lighting, sensor, asset tracking and beacons,” says Hakan Svegerud, Head of Product Strategy, Short Range Radio, at u?blox. 

“We believe that technology should never be the starting point; instead, we should concentrate on business and application needs. As needs evolve over time, so should the technology. Wirepas and u-blox share this core value and that is what makes us stronger together,” says Wirepas CEO, Teppo Hemiä.

Additional information about the u-blox NINA-B1 module can be found at: https://www.u-blox.com/en/product/nina-b1.

Wirepas in brief

Wirepas is focused on providing the most reliable, optimized, scalable and simple to use connectivity for large-scale IoT applications. With Wirepas connectivity there is no need for traditional repeaters, because every wireless device is a smart router of the network. The connected devices form the network – easy as that. In nature, things communicate and make autonomous decisions based on de-centralized protocols that fulfill the need as efficiently as possible – nothing more, nothing less. This is also what Wirepas is all about. Wirepas has its headquarters in Tampere, Finland and offices in Brazil, France, Germany, South Korea and the United States. Things connected – Naturally, http://www.wirepas.com  

About u-blox

Swiss u-blox (SIX:UBXN) is a global leader in wireless and positioning semiconductors and modules for the automotive, industrial and consumer markets. u-blox solutions enable people, vehicles and machines to locate their exact position and communicate wirelessly over cellular and short range networks. With a broad portfolio of chips, modules and software solutions, u-blox is uniquely positioned to empower OEMs to develop innovative solutions for the Internet of Things, quickly and cost-effectively. With headquarters in Thalwil, Switzerland, u-blox is globally present with offices in Europe, Asia and the USA.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Introducing QSPICE™ Analog & Mixed-Signal Simulator
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Amelia Dalton and Mike Engelhardt from Qorvo investigate the benefits of QSPICE™ - Qorvo’s Analog & Mixed-Signal Simulator. They also explore how you can get started using this simulator, the supporting assets available for QSPICE, and why this free analog and mixed-signal simulator is a transformational tool for power designers.
Mar 5, 2024
7,425 views