industry news
Subscribe Now

Kionix’s 6-Axis Accel-Gyro Combo Sensors at Industry-Leading Low Power Consumption

Ithaca, NY and Kyoto, Japan – June 15, 2016 – Kionix, Inc., a leader in the design and manufacture of MEMS solutions, announces immediate sample availability of two new flagship 6-axis Accelerometer-Gyroscope combos: the KXG07 and the KXG08. “Our new products represent a significant technological leap forward in reducing the power consumption of 6-axis solutions,” says Nader Sadrzadeh, President and CEO of Kionix. “High power consumption has traditionally hindered the adoption rate of gyros across a variety of platforms. Kionix has now eliminated this barrier, benefiting applications in Mobile, Gaming, IoT, and Wearables where power is most critical.”

The KXG07 and KXG08 incorporate a newly developed, proprietary technology which dramatically lowers the power consumption of the gyroscope. The KXG08 is packaged in a conventional 2.5mm x 3mm x 0.9mm 14-pin LGA, while the KXG07 is offered in a 3mm x 3mm x 0.9mm 16-pin LGA package with footprint compatible with many of Kionix’s discrete accelerometers. These new solutions enable full high-speed operation of the onboard accelerometer, gyroscope, and temperature sensor at industry-leading low-power consumption levels as low as 0.2mA. This reduces sensor power consumption over comparable devices and brings the combined operation of the gyroscope and accelerometer to levels traditionally associated with standalone accelerometers. These products include synchronization functionality, a 4,096-byte buffer and support for controlling and acquiring data from external sensors.

Kionix will be exhibiting these 6-axis accel-gyro combo sensors at Sensors Expo 2016, the premier event in applied sensors (for more information, click here).

About Kionix

Kionix, Inc., a ROHM Group Company, is a global MEMS sensor manufacturer based in Ithaca, NY, USA, offers high-performance, low-power accelerometers, gyroscopes, and 6-axis combination sensors plus comprehensive software libraries that support a full range of sensor combinations, operating systems and hardware platforms. Leading consumer, automotive, health and fitness and industrial companies worldwide use Kionix sensors and total system solutions to enable motion-based functionality in their products. Kionix is ISO 9001:2008, TS 16949, and TS 14001:2004 certified. Kionix is a wholly owned subsidiary of ROHM Co., Ltd.

Leave a Reply

featured blogs
Dec 8, 2023
Read the technical brief to learn about Mixed-Order Mesh Curving using Cadence Fidelity Pointwise. When performing numerical simulations on complex systems, discretization schemes are necessary for the governing equations and geometry. In computational fluid dynamics (CFD) si...
Dec 7, 2023
Explore the different memory technologies at the heart of AI SoC memory architecture and learn about the advantages of SRAM, ReRAM, MRAM, and beyond.The post The Importance of Memory Architecture for AI SoCs appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

Click to read more

featured chalk talk

Battery-free IoT devices: Enabled by Infineon’s NFC Energy-Harvesting
Sponsored by Mouser Electronics and Infineon
Energy harvesting has become more popular than ever before for a wide range of IoT devices. In this episode of Chalk Talk, Amelia Dalton chats with Stathis Zafiriadis from Infineon about the details of Infineon’s NFC energy harvesting technology and how you can get started using this technology in your next IoT design. They discuss the connectivity and sensing capabilities of Infineon’s NAC1080 and NGC1081 NFC actuation controllers and the applications that would be a great fit for these innovative solutions.
Aug 17, 2023
13,847 views