industry news
Subscribe Now

Introducing u-blox 8 module series

Thalwil, Switzerland – April 27, 2016 – u-blox, a global leader in wireless and positioning modules and chips, announces the release of its u-blox 8 module series. It follows the launch in January of the u-blox 8 GPS/GLONASS receiver platform, an update of the u?blox 7 platform. The new u-blox 8 module portfolio addresses power sensitive usage, whereas the existing u-blox M8 platform continues to serve applications where navigation performance and highest accuracy are paramount. 

The new u-blox 8 modules EVA-8M, NEO-8Q, MAX-8Q and MAX-8C will come after their u-blox 7 predecessors, with which they are pin compatible for easy migration. u-blox 8 offers significant improvements compared to u?blox 7. The tracking sensitivity has been increased by 4 dB, and is now -166 dBm. New features include geofencing, advanced anti-spoofing and anti-jamming functions. Power consumption is down by 13%, making the modules ideal for applications such as asset tracking, telematics, sports, and wearables.

Sampling quantities will be available in May/June 2016. The modules will be available in volumes in August 2016.

For more information about the new modules, visit the website:
https://www.u-blox.com/en/product/max-8-series
https://www.u-blox.com/en/product/eva-8m https://www.u-blox.com/en/product/neo-8q 

About u-blox

Swiss u-blox (SIX:UBXN) is a global leader in wireless and positioning semiconductors and modules for the automotive, industrial and consumer markets. u-blox solutions enable people, vehicles and machines to locate their exact position and communicate wirelessly over cellular and short range networks. With a broad portfolio of chips, modules and software solutions, u-blox is uniquely positioned to empower OEMs to develop innovative solutions for the Internet of Things, quickly and cost-effectively. With headquarters in Thalwil, Switzerland, u-blox is globally present with offices in Europe, Asia and the USA.
(http://www.u-blox.com)

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.
May 19, 2023
38,361 views