industry news
Subscribe Now

Newark element14 launches the MSP CapTIvate™ MCU Development Kit

March 23, 2016 – CHICAGO – Newark element14 today announces the launch of  Texas Instruments’ MSP CapTIvate™ microcontroller (MCU) development kit, a comprehensive, easy-to-use platform providing real-time sensor tuning, all without writing a single line of code. The modular design, easy-to-access data and application orientated approach of the MSP430FR2633-based MCU board, contained within the kit, makes it ideal for application in, for example, thermostats, white goods and personal electronics.

The kit contains a CAPTIVATE-FR2633 target MCU module, CAPTIVATE-PGMR eZ-FET with EnergyTrace™ technology and HID communication bridge,CAPTIVATE-ISO UART, I2C and SBW isolation board, CAPTIVATE-BSWP self-capacitance demo (Out-of-Box Experience), CAPTIVATE-PHONE mutual capacitance demo with haptics and guard channel and CAPTIVATE-PROXIMITY proximity detection and gesturing demo.

The MSP430FR2633-based MCU board, a programmer/debugger board with EnergyTrace technology, measures energy consumption with the TI’s Code Composer Studio™ integrated development environment (IDE), and sensor boards to evaluate self-capacitance, mutual capacitance, gesture and proximity sensing.  Users can evaluate the MSP430FR2633 microcontroller with CapTIvate touch technology, which provides the highest resolution capacitive-touch solution in the market.  MSP MCUs with CapTIvate technology are the industry’s lowest power capacitive touch MCUs with 10 V rms noise immunity and support for dirt-proof, glove-friendly designs. 

Features and benefits of the development kit are: 

Modular Design

  • Different sensing panels can be attached through a common connector.
  • The programming/debug logic has been split from the target MCU, unlike a typical LaunchPad which has both components on one PCB. This allows for an isolation module to be inserted between the two for testing/tuning, or for the programming/debug module to be used for in-system product development.
  • The target MCU PCB features BoosterPack™ plug-in board headers, allowing it to be used as a BoosterPack for another LaunchPad™ development kit, such as the MSP-EXP432P401R LaunchPad kit.

Application Oriented

  • The sensing panels included in the kit are designed to mimic real applications.
  • Evaluating a new application simply involves laying out a basic 1 or 2 layer PCB with a footprint for the sensor connector, or simply laying out electrodes with copper tape and wiring them into the connector.

Easy Access to Data

  • EnergyTrace technology power profiling enables capturing of power profiles without any measurement equipment.
  • The HID-Bridge communications interface allows easy debug data transfer between the target and a PC over UART or I2C.

Get more details, downloads and participate in discussions on the element14 Community.
   
The MSP CapTIvate MCU development kit is available from Newark element14 in North America, Farnell element14 in Europe and element14 in Asia.

About the Premier Farnell Group

Premier Farnell plc (LSE:pfl) is a global leader in high service distribution of technology products and solutions for electronic system design, production, maintenance and repair. Trading as Farnell element14 in Europe, Newark element14 in North America and element14 across Asia Pacific, it had sales last year of £983.7m, the Group is supported by a global supply chain of more than 3,000 suppliers and an inventory profile developed to anticipate and meet its customers’ needs.??

Premier Farnell works to bring to market development kits in a variety of applications, enabling it to support the customer from design concept through to production.

The latest products, software, services and solutions from trusted supplier partners are all available through 43 local language transactional websites. The element14 Community allows buyers and engineers to access a wide range of independent technical information, tools and the latest resources and theDesign Center enables design engineers to compare kits from the world’s greatest range of development tools.

For news updates from Premier Farnell and element14 visit:

Premier Farnell News Centre – www.premierfarnell.com/media-centre
Twitter – @element14
YouTube – element14
Facebook – facebook.com/element14page
Email: pressoffice@premierfarnell.com

Premier Farnell Key facts

  • Operations in 38 different countries
  • More than 4,500 employees
  • More than 3,000 leading suppliers
  • More than 600,000 products stocked with access to over four million more on demand
  • Leaders in providing information on REACH, Conflict Minerals and EU RoHS legislation

For more information visit the website at Premier Farnell.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Addressing the Challenges of Low-Latency, High-Performance Wi-Fi
In this episode of Chalk Talk, Amelia Dalton, Andrew Hart from Infineon, and Andy Ross from Laird Connectivity examine the benefits of Wi-Fi 6 and 6E, why IIoT designs are perfectly suited for Wi-Fi 6 and 6E, and how Wi-Fi 6 and 6E will bring Wi-Fi connectivity to a broad range of new applications.
Nov 17, 2023
22,257 views