industry news
Subscribe Now

Lattice Semiconductor Demonstrating New USB3 and HMI Solutions, Presenting Papers on MIPI Interfacing at Embedded World

HILLSBORO, OR – February 12, 2014 – Lattice Semiconductor Corporation (NASDAQ: LSCC) will demonstrate new USB3 and Human Machine Interface (HMI) solutions, and address how embedded designers can use low-power, low-cost FPGAs (Field Programmable Gate Arrays) to overcome the challenges of implementing MIPI interfaces at the Embedded World Exhibition and Conference taking place in Nuremberg, Germany, Feb. 25-27.    

HMI-on-a-Chip (HOC) is a complete Lattice FPGA-based single chip HMI reference design demonstrating touch screen based HMI solutions. The solution is scalable and can be implemented using Lattice’s family of MachXO2™ or MachXO3™ FPGAs as well as LatticeECP3™ devices.

“The key benefits of the solution are scalability, high-end graphics, fast response times, and ease of HMI design,” explains Lattice Strategic Marketing and Business Development Manager Kambiz Khalilian. “Unlike microcontroller-based solutions, the Lattice HMI solution is editor-based, so no programming or operating system expertise is required.”

The Lattice USB3 Video Bridge reference design addresses emerging applications in consumer, video broadcast, machine vision, and surveillance applications built around the new USB3 interface.

“USB3 is amongst the preferred formats for reasons of flexibility, cost, size and availability of standard parts,” said Khalilian. “However, since image sensor, SDI, or HDMI video & audio formats are different than USB3 data format, a bridge design is required, and low cost, low power FPGAs are ideal for this application.”

Lattice will demonstrate the new USB3 and HMI solutions at the Arrow Electronics booth (Hall 5/Booth 370) and Future Electronics booth (Hall 4A/ Booth 110), two of Lattice’s authorized distributors.

Ted Marena, Lattice’s director of product marketing for MachXO Families, will present two papers at the Nuremberg event that address the emerging use of the Mobile Industry Processor Interface, or MIPI standards, within the context of embedded designs and specifically for display applications. Marena will discuss how small-form factor FPGAs with their low power and low cost can help designers to overcome the system design challenges that must be addressed when integrating low-cost, high-reliability components designed for smart phones and tablets.

On Feb. 25 at 2:00 pm Marena will present a paper at the Embedded World Conference titled ‘MIPI Interfaces in Embedded Designs with Ultra-Low-Density, Low-Power, Low-Cost FPGAs’.

On Feb. 26 at 2:00 pm Marena will deliver his paper ‘Using low cost MIPI Displays in Embedded Applications’ at the Electronic Displays conference, an event within Embedded World – further details can be found at: http://www.embedded-world.de/en/conference/.

About Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the world’s leading provider of ultra-low-power programmable IC solutions for makers of smartphones, mobile handheld devices, small-cell networking equipment, industrial control, automotive infotainment, and much more. With more than 1 billion units sold over the past 10 years, Lattice ships more FPGAs, CPLDs and Power Management solutions than any other programmable solutions vendor. For more information, visit www.latticesemi.com. You can also follow us via Twitter, Facebook, or RSS.

 

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Littelfuse Protection IC (eFuse)
If you are working on an industrial, consumer, or telecom design, protection ICs can offer a variety of valuable benefits including reverse current protection, over temperature protection, short circuit protection, and a whole lot more. In this episode of Chalk Talk, Amelia Dalton and Pete Pytlik from Littelfuse explore the key features of protection ICs, how protection ICs compare to conventional discrete component solutions, and how you can take advantage of Littelfuse protection ICs in your next design.
May 8, 2023
42,481 views