industry news
Subscribe Now

Imec solves metallization issues in advanced interconnects for the sub-1X technology node

San Francisco (USA) – July 2, 2013 – Imec has developed a Manganese (Mn)-based self-formed barrier (SFB) process that significantly improves Resistance Capacitance (RC) performance, via resistance and reliability in advanced interconnects. It provides excellent adhesion, film conformality, intrinsic barrier property and reduced line resistance. This technology paves the way towards interconnect Cu metallization into the 7nm node and beyond.

With continuous interconnect scaling, the wire resistance per unit length increases, which has a detrimental impact on the device performance (RC). Moreover, when reducing the dimensions with conventional barrier layers, an increased loss of copper (Cu) cross sectional area is observed, resulting in high resistance and decreased interconnect lifetime (electro-migration and time dependent dielectric breakdown – EM and TDDB). To overcome these interconnect metallization issues when scaling beyond the 1X technology node, imec’s R&D program on advanced interconnect technology explores new barrier and seed materials as well as novel deposition and filling techniques. The Mn-based SFB was demonstrated to be an attractive candidate for future interconnect technology.  At module level, Mn-based SFB resulted in a 40% increase in RC benefits at 40nm half pitch compared to conventional barrier and good lifetime performance (comparable to TaN/Ta reference).

These results were achieved in cooperation with imec’s key partners in its core CMOS programs Globalfoundries, INTEL, Micron, Panasonic, Samsung, TSMC, Elpida, SK hynix, Fujitsu and Sony.

Imec exhibits at SEMICON West, July 9-11, 2013. To learn more about imec, please visit booth 1741, South hall.

Leave a Reply

featured blogs
May 12, 2021
The ICADVM20.1 ISR18 and IC6.1.8 ISR18 production releases are now available for download at Cadence Downloads . For information on supported platforms and other release compatibility information,... [[ Click on the title to access the full blog on the Cadence Community site...
May 11, 2021
Human vision in indispensable and often taken for granted. Similarly machine, or embedded, vision influences daily human life in ways thought impossible. Simply, machine vision refers to the ability of embedded systems to “see”. Key system components include camer...
May 6, 2021
Learn how correct-by-construction coding enables a more productive chip design process, as new code review tools address bugs early in the design process. The post Find Bugs Earlier Via On-the-Fly Code Checking for Productive Chip Design and Verification appeared first on Fr...
May 4, 2021
What a difference a year can make! Oh, we're not referring to that virus that… The post Realize Live + U2U: Side by Side appeared first on Design with Calibre....

featured video

The Verification World We Know is About to be Revolutionized

Sponsored by Cadence Design Systems

Designs and software are growing in complexity. With verification, you need the right tool at the right time. Cadence® Palladium® Z2 emulation and Protium™ X2 prototyping dynamic duo address challenges of advanced applications from mobile to consumer and hyperscale computing. With a seamlessly integrated flow, unified debug, common interfaces, and testbench content across the systems, the dynamic duo offers rapid design migration and testing from emulation to prototyping. See them in action.

Click here for more information

featured paper

Designing TI mmWave radar made easier using our third-party ecosystem

Sponsored by Texas Instruments

If you are new to radar or interested in replacing your existing sensing technology with radar, there can be a significant learning curve to both designing your product and ramping to production. In order to lower this barrier, Texas Instruments created a third-party ecosystem of radar experts who can provide solutions no matter how much help you need.

Click to read more

featured chalk talk

UWB: Because Location Matters

Sponsored by Mouser Electronics and Qorvo

While technologies like GPS, WiFi, and Bluetooth all offer various types of location services, none of them are well-suited to providing accurate, indoor/outdoor, low-power, real-time, 3D location data for edge and endpoint devices. In this episode of Chalk Talk, Amelia Dalton chats with Mickael Viot from Qorvo about ultra-wideband (UWB) technology, and how it can revolutionize a wide range of applications.

Click here for more information about Qorvo Ultra-Wideband (UWB) Technology